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M93C56-MN6T

STMicroelectronics

M93C56-MN6T by STMicroelectronics

M93C56-MN6T by STMicroelectronics is a 2048-bit EEPROM with 128x16 organization, operating at 2MHz clock frequency. It features software write protection, synchronous operation, and MICROWIRE serial bus type. Ideal for industrial applications requiring reliable non-volatile memory storage in a compact 8-terminal package.

Median Price

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Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

Distributors (In-Stock)

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ComSIT Distribution GmbH

Germany . 88,688 parts In-Stock

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ComSIT USA

USA . 47,250 parts In-Stock

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Vyrian

USA . 8,272 parts In-Stock

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8,272

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LIBRA Elektronik GmbH

Germany . 2,849 parts In-Stock

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2,849

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Pegasus Components GmbH

Germany . 2,500 parts In-Stock

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2,500

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Sinequanon

UK . 2,500 parts In-Stock

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2,500

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Digiode

USA . 1,833 parts In-Stock

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1,833

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Anansix

USA . 1,424 parts In-Stock

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

USA . 1,200 parts In-Stock

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Zilex Electronics Inc.

Canada . 1,000 parts In-Stock

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1,000

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Inventory MP

USA . 710 parts In-Stock

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710

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Bristol Electronics

USA . 710 parts In-Stock

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710

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Prism Electronics

USA . 257 parts In-Stock

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Semi Source

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 1,558 parts In-Stock

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$4.844

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$4.359

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1,558

$4.844

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$4.359

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Microchip USA

USA . 294 parts In-Stock

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$7.413

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294

$7.413

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MKK Technologies

India . 725 parts In-Stock

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$9.108

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725

$9.108

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DigiPath Technology Company

USA . 725 parts In-Stock

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$9.108

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725

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AZTECH Wire

Italy . 747 parts In-Stock

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$10.640

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747

$10.640

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Authorized Procurement Solutions

USA . 25,000 parts In-Stock

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Lixinc

USA . 18,640 parts In-Stock

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Infinite Electronics LLP (Excess)

. 5,484 parts In-Stock

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Corphita

USA . 3,054 parts In-Stock

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Assy Fe

Spain . 3,012 parts In-Stock

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Kepictronics

USA . 2,449 parts In-Stock

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A-Z Elektronik GmbH

Germany . 2,027 parts In-Stock

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Alle Elektronik GmbH

Germany . 1,351 parts In-Stock

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Parana Technologies

USA . 621 parts In-Stock

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$5.792

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Perfect Parts

USA . 288 parts In-Stock

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288

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Overview

Discover the M93C56-MN6T by STMicroelectronics, a top-quality EEPROM that offers unparalleled reliability and performance. With a reputation for excellence in semiconductor manufacturing, STMicroelectronics delivers a product that meets the highest industry standards. Ideal for a wide range of applications, this EEPROM provides valuable benefits such as data retention, write protection, and low power consumption. Trust in STMicroelectronics to bring you cutting-edge technology that enhances your projects with efficiency and precision. Experience the difference with the M93C56-MN6T today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the EEPROM, making it suitable for various operating conditions.

Surface Mount: Yes

Surface mount capability allows for easy installation on printed circuit boards, saving space and simplifying manufacturing processes.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard voltage of 5V ensures compatibility with a wide range of systems and power sources.

Memory Density: 2048 bit

Having a high memory density allows for storing more data in a compact EEPROM, making it efficient for various applications.

Endurance: 1000000 Write/Erase Cycles

With a high number of write/erase cycles, this EEPROM ensures long-term reliability and data integrity.

Technical Specifications

EEPROM M93C56-MN6T attributes and parameters. Explore more EEPROM devices from STMicroelectronics

Specs

Alternate Memory Width:

8

Maximum Clock Frequency (fCLK):

2 MHz

Minimum Data Retention Time:

40

Endurance:

1000000 Write/Erase Cycles

JESD-30 Code:

R-PDSO-G8

Length:

4.9 mm

Memory Density:

2048 bit

Memory IC Type:

Memory Width:

16

No. of Functions:

1

No. of Terminals:

8

No. of Words:

128 words

No. of Words Code:

128

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

128X16

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

SERIAL

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Serial Bus Type:

MICROWIRE

Maximum Standby Current:

.000015 Amp

Sub-Category:

EEPROMs

Maximum Supply Current:

2 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Maximum Write Cycle Time (tWC):

5 ms

Write Protection:

SOFTWARE

Trade Compliance

M93C56-MN6T Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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