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M74HCT574TTR

STMicroelectronics

M74HCT574TTR by STMicroelectronics

M74HCT574TTR by STMicroelectronics is an 8-bit bus driver with a 5V supply, featuring a max output current of 6A and a propagation delay of just 54 ns. Its compact SOIC package makes it ideal for space-constrained applications. Designed for military use, it operates in extreme temperatures from -55 °C to 125°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,658 parts In-Stock

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7,658

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Chip Stock

USA . 6,500 parts In-Stock

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6,500

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Anansix

USA . 2,282 parts In-Stock

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2,282

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Digiode

USA . 1,365 parts In-Stock

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1,365

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Prism Electronics

USA . 12 parts In-Stock

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12

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 2,729 parts In-Stock

1+ parts

$5.366

100+ parts

-

1k+ parts

$5.151

10k+ parts

$5.151

2,729

$5.366

-

$5.151

$5.151

Microchip USA

USA . 200 parts In-Stock

1+ parts

$8.645

100+ parts

-

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200

$8.645

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AZTECH Wire

Italy . 682 parts In-Stock

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$18.470

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-

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682

$18.470

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IDEA Electronic Components Group

UK . 714 parts In-Stock

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$26.237

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$23.613

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714

$26.237

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$23.613

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MKK Technologies

India . 1,573 parts In-Stock

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$49.336

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1,573

$49.336

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DigiPath Technology Company

USA . 1,573 parts In-Stock

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$49.336

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1,573

$49.336

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Ampacity Inc.

Singapore . 245 parts In-Stock

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$57.000

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245

$57.000

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QUARKTWIN TECHNOLOGY LTD

USA . 26,846 parts In-Stock

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Perfect Parts

USA . 8,887 parts In-Stock

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8,887

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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5,000

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Corphita

USA . 2,120 parts In-Stock

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2,120

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Parana Technologies

USA . 1,995 parts In-Stock

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$31.370

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1,995

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$31.370

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Overview

Elevate your designs with the M74HCT574TTR from STMicroelectronics, a leader in reliable semiconductor solutions. This versatile 8-bit bus driver and transceiver combines superior quality and performance, ensuring seamless integration in various applications from industrial automation to consumer electronics. With its compact footprint and robust temperature range, enjoy enhanced efficiency and durability, making it the smart choice for engineers seeking innovation without compromise!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides durability and resistance to environmental factors, making the product reliable in various conditions.

Surface Mount: YES

Surface mount capability allows for compact designs and efficient use of circuit board space, making it ideal for modern electronics.

Package Shape: RECTANGULAR

The rectangular shape is standard in many applications, ensuring compatibility with various PCB layouts and simplifying integration.

No. of Bits: 8

With an 8-bit configuration, this product supports a broad range of data transmission and control functions.

Nominal Supply Voltage / Vsup: 5 V

Operating at a standard 5 V simplifies design and integration with other common electronic components.

Load Capacitance (CL): 50 pF

A load capacitance of 50 pF ensures efficient signal transmission with minimal distortion, making it suitable for high-speed applications.

Power Supplies (V): 5

A single 5 V power supply streamlines design requirements and reduces component count within the circuit.

No. of Terminals: 20

20 terminals provide ample connectivity options, which enhances flexibility in circuit design.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The thin profile and small outline facilitate space-saving designs in dense electronic applications.

Maximum I (ol): 6 Amp

A maximum output current of 6 Amps supports high-performance applications without sacrificing reliability.

Propagation Delay (tpd): 54 ns

A propagation delay of 54 ns ensures fast signal processing, making it suitable for high-speed signal applications.

Maximum Operating Temperature: 125 °C

With a maximum operational temperature of 125 °C, this product can perform in extreme environments, enhancing reliability.

Output Characteristics: 3-STATE

3-state output characteristics allow for versatile applications in bus systems, enhancing functionality.

Trigger Type: POSITIVE EDGE

Positive edge triggering is favored in many digital circuits, ensuring reliable operation in clock-driven applications.

Minimum Operating Temperature: -55 °C

A minimum operating temperature of -55 °C allows for use in harsh environments and extreme conditions.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

This terminal finish enhances corrosion resistance and ensures reliable electrical connections over time.

Terminal Position: DUAL

Dual terminal positioning allows for flexible placement on PCBs, supporting different design requirements.

No. of Ports: 2

Two ports facilitate multi-channel communication in data buses, optimizing functionality for complex systems.

Maximum Seated Height: 1.2 mm

A maximum seated height of 1.2 mm keeps components compact, aiding in space-constrained designs.

Width: 4.4 mm

A narrow width of 4.4 mm makes this product suitable for high-density applications.

Output Polarity: TRUE

True output polarity aligns with standard operation, ensuring compatibility with a variety of devices and circuits.

Minimum Supply Voltage (Vsup): 4.5 V

Working down to 4.5 V provides flexibility in supply voltage options and compatibility with a wide range of devices.

Maximum Time At Peak Reflow Temperature (s): 40

A maximum time at peak reflow of 40 seconds ensures durability during the soldering process, reducing damage risk.

Peak Reflow Temperature (°C): 260

A peak reflow temperature of 260 °C allows compatibility with lead-free soldering processes, adhering to modern standards.

Length: 6.5 mm

A compact length of 6.5 mm facilitates integration into small form-factor devices.

Temperature Grade: MILITARY

Designed to meet military temperature specifications, ensuring high reliability in demanding applications.

Maximum Frequency At Nominal Supply: 21,000,000 Hz

High maximum frequency capability (21 MHz) supports rapid data transmission, essential for modern high-speed applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making it suitable for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminal form facilitates easy soldering and enhances mechanical stability.

Terminal Pitch: 0.65 mm

A terminal pitch of 0.65 mm allows for compact design while ensuring reliable electrical connections.

Moisture Sensitivity Level (MSL): 3

With an MSL of 3, this product can handle standard assembly processes without special precautions, simplifying manufacturing.

Maximum Supply Voltage (Vsup): 5.5 V

Supporting a maximum supply voltage of 5.5 V provides design flexibility while ensuring performance stability.

Technical Specifications

Bus Driver & Transceivers M74HCT574TTR attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Family:

HCT

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

21000000 Hz

Maximum I (ol):

6 Amp

Moisture Sensitivity Level (MSL):

3

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Propagation Delay (tpd):

54 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Trigger Type:

POSITIVE EDGE

Width:

4.4 mm

Trade Compliance

M74HCT574TTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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