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M74HCT540B1R

STMicroelectronics

M74HCT540B1R by STMicroelectronics

STMicroelectronics M74HCT540B1R is an 8-bit bus driver with 30ns propagation delay, 150pF load capacitance, and 6A max I (ol). It operates at a supply voltage of 5V and has a temperature range of -55 to 125 °C. Ideal for military-grade applications requiring inverted output polarity and enable low control type.

Median Price

$1.080

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 756 parts In-Stock

1+ parts

$1.080

100+ parts

$0.624

1k+ parts

$0.560

10k+ parts

-

756

$1.080

$0.624

$0.560

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 605 parts In-Stock

1+ parts

$1.026

100+ parts

-

1k+ parts

-

10k+ parts

-

605

$1.026

-

-

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Vyrian

USA . 8,436 parts In-Stock

1+ parts

-

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-

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8,436

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ComSIT Distribution GmbH

Germany . 3,540 parts In-Stock

1+ parts

-

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3,540

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Anansix

USA . 2,539 parts In-Stock

1+ parts

-

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2,539

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ECAB

Sweden . 171 parts In-Stock

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171

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LWI Electronics Inc

India . 7 parts In-Stock

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7

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 276 parts In-Stock

1+ parts

$0.972

100+ parts

-

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-

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276

$0.972

-

-

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Andel Nordic

Denmark . 460 parts In-Stock

1+ parts

$3.405

100+ parts

-

1k+ parts

$3.269

10k+ parts

$3.269

460

$3.405

-

$3.269

$3.269

IDEA Electronic Components Group

UK . 532 parts In-Stock

1+ parts

$28.575

100+ parts

-

1k+ parts

$25.718

10k+ parts

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532

$28.575

-

$25.718

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MKK Technologies

India . 1,245 parts In-Stock

1+ parts

$53.734

100+ parts

-

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1,245

$53.734

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DigiPath Technology Company

USA . 1,245 parts In-Stock

1+ parts

$53.734

100+ parts

-

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10k+ parts

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1,245

$53.734

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Component Stockers USA

USA . 734 parts In-Stock

1+ parts

$99.990

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734

$99.990

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Authorized Procurement Solutions

USA . 3,500 parts In-Stock

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3,500

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Perfect Parts

USA . 2,108 parts In-Stock

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2,108

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Parana Technologies

USA . 1,855 parts In-Stock

1+ parts

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100+ parts

$34.166

1k+ parts

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1,855

-

$34.166

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Overview

Unlock seamless communication and data transfer with the M74HCT540B1R by STMicroelectronics. Crafted with precision and expertise, this Bus Driver & Transceiver offers unparalleled quality and reliability. Perfect for military-grade applications, this CMOS technology marvel ensures fast propagation delay and low power consumption. With 3-STATE output characteristics and inverted polarity, this product guarantees seamless integration and enhanced performance. Trust STMicroelectronics to deliver cutting-edge solutions that elevate your projects to new heights. Experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body provides good durability and protection for the internal components of the bus driver & transceivers, making it a reliable choice for long-term use in various environments.

Propagation Delay At Nominal Supply: 30 ns

The low propagation delay of 30 ns ensures fast data transmission and response times, making this product suitable for high-speed communication applications.

Nominal Supply Voltage / Vsup (V): 5

The 5V nominal supply voltage ensures compatibility with standard power sources, making it easy to integrate this bus driver & transceiver into existing systems.

Output Characteristics: 3-STATE

The 3-STATE output characteristics allow for flexibility in controlling the output signal, enabling the bus driver & transceiver to adapt to different communication protocols and configurations.

Technology: CMOS

The CMOS technology used in this product offers low power consumption and high noise immunity, making it an efficient and reliable choice for various industrial and commercial applications.

Technical Specifications

Bus Driver & Transceivers M74HCT540B1R attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Additional Features:

WITH DUAL OUTPUT ENABLE

Control Type:

ENABLE LOW

Family:

HCT

JESD-30 Code:

R-PDIP-T20

JESD-609 Code:

e3

Load Capacitance (CL):

150 pF

Logic IC Type:

Maximum I (ol):

6 Amp

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

TUBE

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

30 ns

Propagation Delay (tpd):

38 ns

Qualification:

Not Qualified

Maximum Seated Height:

3.93 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

M74HCT540B1R Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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