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M74HCT367RM13TR

STMicroelectronics

M74HCT367RM13TR by STMicroelectronics

M74HCT367RM13TR by STMicroelectronics is a 6-bit bus driver with a propagation delay of 33 ns, operating at a nominal voltage of 5V. It features a compact SO package and supports dual ports for efficient data transmission. Ideal for military applications, it operates in extreme temperatures from -55 °C to 125 °C.

Median Price

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Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,740 parts In-Stock

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Chip Stock

USA . 6,939 parts In-Stock

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Digiode

USA . 4,653 parts In-Stock

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Anansix

USA . 2,732 parts In-Stock

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ComSIT Distribution GmbH

Germany . 2,500 parts In-Stock

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Bristol Electronics

USA . 1,989 parts In-Stock

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Dan-Mar Components

USA . 1,989 parts In-Stock

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MISTER SPROCKETS

USA . 5 parts In-Stock

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IDEA Electronic Components Group

UK . 459 parts In-Stock

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$14.922

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$13.430

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459

$14.922

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$13.430

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AZTECH Wire

Italy . 592 parts In-Stock

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$17.410

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Microchip USA

USA . 301 parts In-Stock

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$21.904

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MKK Technologies

India . 1,954 parts In-Stock

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$28.061

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DigiPath Technology Company

USA . 1,954 parts In-Stock

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$28.061

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Perfect Parts

USA . 9,045 parts In-Stock

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Corphita

USA . 4,504 parts In-Stock

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Parana Technologies

USA . 906 parts In-Stock

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$17.842

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Overview

Unlock unparalleled performance with the M74HCT367RM13TR from STMicroelectronics, a leader in high-quality semiconductor solutions. This robust 6-bit bus driver & transceiver excels in diverse applications, ensuring reliability and efficient data transmission even under extreme conditions. With its compact design and exceptional temperature tolerance, it delivers seamless integration and enhanced functionality, making it the ideal choice for your next project. Experience the STMicroelectronics advantage today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This durable material ensures long-lasting performance and resistance to environmental factors.

Propagation Delay At Nominal Supply: 33 ns

A low propagation delay contributes to speed and efficiency in data transmission, making it ideal for high-frequency applications.

Surface Mount: YES

Surface mounting allows for compact design and easier integration into modern circuits.

Package Shape: RECTANGULAR

Rectangular packages are versatile and can be efficiently arranged in circuit boards.

No. of Bits: 6

With 6 bits, this device can handle multiple data lines simultaneously, increasing data throughput.

Nominal Supply Voltage / Vsup (V): 5

Standard nominal voltage ensures compatibility with a wide range of other components and systems.

Load Capacitance (CL): 50 pF

Low load capacitance means faster switching times, enhancing the overall speed of operation.

Power Supplies (V): 5

Utilizing a common voltage supply simplifies design and integration with existing systems.

No. of Terminals: 16

A higher number of terminals allows for more connections, facilitating greater functionality.

Package Style (Meter): SMALL OUTLINE

The small outline package is ideal for space-constrained applications while providing effective heat dissipation.

Maximum I (ol): 6 Amp

Supports high output current, making it suitable for driving loads in demanding applications.

Propagation Delay (tpd): 42 ns

Consistent delays enable predictable performance, essential for synchronous systems.

Maximum Operating Temperature: 125 °C

High temperature tolerance ensures reliable operation even in harsh environments.

Output Characteristics: 3-STATE

3-state output allows for flexibility in circuit design, enabling multiple devices to share the same bus.

Minimum Operating Temperature: -55 °C

The ability to function in extremely low temperatures makes it suitable for military and aerospace applications.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The high-quality terminal finish enhances conductivity and resistance to corrosion.

Terminal Position: DUAL

Dual terminal positions offer increased adaptability in PCB design layout.

No. of Ports: 2

Two ports enable simple connectivity and facilitate easy intercommunication between devices.

Maximum Seated Height: 1.75 mm

A low seated height promotes better compatibility with low-profile designs.

Width: 3.9 mm

Compact width supports space-efficient design without sacrificing performance.

Output Polarity: TRUE

True output polarity enhances the precision of signal integrity for reliable data transmission.

Minimum Supply Voltage (Vsup): 4.5 V

Flexibility in supply voltage requirements aids in compatibility with various power systems.

Maximum Time At Peak Reflow Temperature (s): 30

A higher tolerance for reflow temperatures supports various manufacturing processes.

Peak Reflow Temperature °C: 260

Supports high temperature during manufacturing, allowing for robust solder joints.

Length: 9.9 mm

Compact length supports miniaturization in device design, critical in modern electronics.

Temperature Grade: MILITARY

Military-grade specifications guarantee reliability and performance in critical applications.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, suitable for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminals facilitate easier soldering and ensure reliable connections.

Packing Method: TR

Taped and reeled packing allows for automated assembly, enhancing manufacturing efficiency.

Terminal Pitch: 1.27 mm

Standard terminal pitch facilitates compatibility with mass production equipment and assembly.

Control Type: ENABLE LOW

Low-enable control type simplifies integration into active circuits and reduces power consumption.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating ensures the component can withstand typical processing, improving reliability.

Maximum Supply Voltage (Vsup): 5.5 V

Allows for a margin in voltage supply, enhancing flexibility in various design scenarios.

Technical Specifications

Bus Driver & Transceivers M74HCT367RM13TR attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Control Type:

ENABLE LOW

Family:

HCT

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

6 Amp

Moisture Sensitivity Level (MSL):

3

No. of Bits:

6

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

33 ns

Propagation Delay (tpd):

42 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

M74HCT367RM13TR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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