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M74HCT273TTR

STMicroelectronics

M74HCT273TTR by STMicroelectronics

M74HCT273TTR by STMicroelectronics is an 8-bit positive edge-triggered latch with a 5V supply and a max frequency of 20 MHz. It features a low propagation delay of 45 ns and operates in extreme temperatures from -55 °C to 125 °C. Ideal for high-speed digital applications, it comes in a compact SOIC package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,343 parts In-Stock

1+ parts

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4,343

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Vyrian

USA . 3,010 parts In-Stock

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3,010

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Anansix

USA . 339 parts In-Stock

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339

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 496 parts In-Stock

1+ parts

$1.034

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496

$1.034

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IDEA Electronic Components Group

UK . 1,650 parts In-Stock

1+ parts

$11.694

100+ parts

-

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$10.525

10k+ parts

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1,650

$11.694

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$10.525

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AZTECH Wire

Italy . 924 parts In-Stock

1+ parts

$18.360

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924

$18.360

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MKK Technologies

India . 1,633 parts In-Stock

1+ parts

$21.990

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1,633

$21.990

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DigiPath Technology Company

USA . 1,633 parts In-Stock

1+ parts

$21.990

100+ parts

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1,633

$21.990

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Corphita

USA . 3,267 parts In-Stock

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3,267

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Parana Technologies

USA . 1,891 parts In-Stock

1+ parts

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$13.982

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1,891

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$13.982

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Overview

Elevate your design with the M74HCT273TTR from STMicroelectronics, a leader in quality and innovation. This 8-bit latch offers unmatched reliability for various applications, including automotive and industrial controls. Its compact footprint and robust performance ensure seamless integration into your projects, providing peace of mind with every use. Enjoy superior efficiency and exceptional durability—all backed by ST's renowned expertise in semiconductor solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material enhances the product's longevity and reliability in various applications.

Surface Mount: YES

Surface mount capability allows for easier integration into modern PCB designs, saving space and improving assembly efficiency.

Package Shape: RECTANGULAR

The rectangular shape is optimal for efficient PCB layout and space utilization.

No. of Bits: 8

An 8-bit configuration provides a good balance between complexity and capability for a variety of applications.

Nominal Supply Voltage / Vsup: 5 V

A standard supply voltage of 5V ensures compatibility with a wide range of devices and systems.

Load Capacitance (CL): 50 pF

A load capacitance of 50 pF can support various operational scenarios while maintaining signal integrity.

Power Supplies (V): 5

Utilizing a 5V power supply enhances compatibility with existing electronic systems and ease of integration.

No. of Terminals: 20

20 terminals allow for versatile connections and multiple functionalities in circuit designs.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

This package style is ideal for compact applications where space is limited, making it a top choice for modern designs.

Maximum I (ol): 4 Amp

A maximum output current of 4A enables driving of heavier loads, expanding application possibilities.

Propagation Delay (tpd): 45 ns

A propagation delay of 45 ns allows for high-speed operation, making it suitable for fast data-processing applications.

Maximum Operating Temperature: 125 °C

Operating at a maximum temperature of 125 °C ensures reliability in harsh environments, suitable for industrial applications.

Trigger Type: POSITIVE EDGE

The use of positive edge triggering is beneficial in synchronous design, allowing for precise timing control.

Minimum Operating Temperature: -55 °C

A minimum operating temperature of -55 °C makes the product suitable for extreme environments, including aerospace and military.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold finish offers high reliability and excellent solderability, enhancing long-term performance.

Terminal Position: DUAL

Dual terminal positioning helps in flexible PCB layouts and connections, facilitating ease of integration.

Maximum Seated Height: 1.2 mm

A low seated height allows for better stacking of components and a more compact overall design.

Width: 4.4 mm

A width of 4.4 mm contributes to space-efficient designs and reduced PCB footprint.

Output Polarity: TRUE

The true output polarity is suitable for a variety of applications requiring straightforward logic levels.

Minimum Supply Voltage (Vsup): 4.5 V

A minimum supply voltage of 4.5V supports a wide range of operational scenarios while maintaining device performance.

Maximum Time At Peak Reflow Temperature (s): 40

A maximum reflow time of 40 seconds ensures compatibility with various PCB manufacturing processes.

Peak Reflow Temperature °C: 260

A peak reflow temperature of 260 °C accommodates high-temperature soldering processes, ensuring reliability.

Length: 6.5 mm

The compact length of 6.5 mm allows for high-density PCB designs, fitting into tight spaces.

Temperature Grade: MILITARY

MILITARY-grade temperature classification ensures the device can withstand extreme conditions, ideal for critical applications.

Maximum Frequency At Nominal Supply: 20000000 Hz

A maximum frequency of 20 MHz ensures the product can handle high-speed data transfer, enhancing performance.

Technology: CMOS

CMOS technology leads to low power consumption and high-speed performance, making it energy-efficient and reliable.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and improve the overall reliability of connections on a PCB.

Packing Method: TR

Tape and Reel (TR) packing ensures efficient automated handling during manufacturing, improving production speed.

Terminal Pitch: 0.65 mm

A terminal pitch of 0.65 mm allows for compact designs while maintaining serviceability and accessibility.

Minimum fmax: 20 MHz

A minimum frequency of 20 MHz assures baseline performance in applications where speed is critical.

Moisture Sensitivity Level (MSL): 3

An MSL rating of 3 indicates moderate moisture sensitivity, allowing for stable storage and handling conditions.

Maximum Supply Voltage (Vsup): 5.5 V

A maximum supply voltage of 5.5V provides a safe operational margin, ensuring reliability in various applications.

Technical Specifications

Latches & Flip-Flops M74HCT273TTR attributes and parameters. Explore more Latches & Flip-Flops devices from STMicroelectronics

Specs

Family:

HCT

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

20000000 Hz

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

3

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Propagation Delay (tpd):

45 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Trigger Type:

POSITIVE EDGE

Width:

4.4 mm

Minimum fmax:

20 MHz

Trade Compliance

M74HCT273TTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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