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M74HCT245RM13TR

STMicroelectronics

M74HCT245RM13TR by STMicroelectronics

M74HCT245RM13TR by STMicroelectronics is an 8-bit bus driver with a propagation delay of 33 ns, operating at a nominal voltage of 5V. It features a compact SO package and supports bidirectional data transfer. Ideal for high-speed digital applications, it operates in extreme temperatures from -55 °C to 125 °C.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,622 parts In-Stock

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Digiode

USA . 3,616 parts In-Stock

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Anansix

USA . 2,536 parts In-Stock

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ComSIT Distribution GmbH

Germany . 877 parts In-Stock

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CirComp Electronics, Inc.

USA . 250 parts In-Stock

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250

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Distributors (Availability)

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Andel Nordic

Denmark . 1,305 parts In-Stock

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$6.129

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-

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$5.884

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$5.884

1,305

$6.129

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$5.884

$5.884

IDEA Electronic Components Group

UK . 1,382 parts In-Stock

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$10.316

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-

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$9.284

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$10.316

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$9.284

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MKK Technologies

India . 1,027 parts In-Stock

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$19.398

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$19.398

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DigiPath Technology Company

USA . 1,027 parts In-Stock

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$19.398

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$19.398

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AZTECH Wire

Italy . 948 parts In-Stock

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$20.100

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948

$20.100

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

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$30.078

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$27.371

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$24.664

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3,000

$30.078

$27.371

$24.664

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QUARKTWIN TECHNOLOGY LTD

USA . 21,218 parts In-Stock

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Microchip USA

USA . 3,020 parts In-Stock

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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Assy Fe

Spain . 1,891 parts In-Stock

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Corphita

USA . 1,245 parts In-Stock

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Perfect Parts

USA . 1,240 parts In-Stock

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Parana Technologies

USA . 1,055 parts In-Stock

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$12.334

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1,055

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$12.334

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Overview

Elevate your designs with the M74HCT245RM13TR from STMicroelectronics, a trusted leader in semiconductor innovation. This high-quality bus driver and transceiver promises exceptional performance with its reliable 8-bit data handling and low propagation delay, making it perfect for a variety of applications from automotive to industrial automation. Experience seamless integration, enhanced efficiency, and robust reliability—ensuring your projects achieve their full potential with every connection!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material contributes to reliability and longevity, ensuring the product withstands challenging operating conditions.

Propagation Delay At Nominal Supply: 33 ns

A low propagation delay indicates fast signal transmission, making this product suitable for high-speed applications.

Surface Mount: YES

Surface mounting allows for efficient use of PCB space and contributes to lower manufacturing costs.

Package Shape: RECTANGULAR

The rectangular shape is conducive to efficient placement and optimized circuit design.

No. of Bits: 8

An 8-bit configuration is advantageous for a range of digital applications, balancing complexity and performance.

Nominal Supply Voltage / Vsup (V): 5

The standard 5V supply voltage enhances compatibility with a wide variety of existing electronic systems.

Power Supplies (V): 5

Powered by a single 5V supply, simplifying design and reducing the need for additional power supply components.

No. of Terminals: 20

The 20-terminal design allows for multiple connection points, enhancing flexibility in circuit design.

Package Style (Meter): SMALL OUTLINE

A small outline package minimizes PCB real estate usage, making it ideal for space-constrained applications.

Maximum I (ol): 6 Amp

With a maximum output current of 6 Amps, this product is capable of driving heavy loads efficiently.

Propagation Delay (tpd): 45 ns

A propagation delay of 45 ns makes it suitable for applications that require moderate signal processing speeds.

Maximum Operating Temperature: 125 °C

A higher maximum operating temperature allows usage in demanding environments without compromising performance.

Output Characteristics: 3-STATE

The 3-state output allows for versatile signal handling in bus applications, enabling multiple devices to share communication lines.

Minimum Operating Temperature: -55 °C

This allows the product to function in extreme cold conditions, broadening its usability in various environments.

Terminal Finish: NICKEL PALLADIUM GOLD

The premium finish enhances corrosion resistance and ensures reliable electrical connections over time.

Terminal Position: DUAL

Dual terminal positioning enables flexible mounting options, enhancing the design adaptability.

No. of Ports: 2

Two ports facilitate communication between devices, allowing for simple integration into more complex systems.

Maximum Seated Height: 2.65 mm

A low seated height is beneficial for low-profile applications, where space is a key constraint.

Width: 7.5 mm

Compact width allows for effective use in dense electronic designs, fitting snugly on PCBs.

Output Polarity: TRUE

True output polarity ensures proper interfacing with other components, crucial for signal integrity.

Minimum Supply Voltage (Vsup): 4.5 V

A minimum supply voltage of 4.5V allows for operation in low-power applications while maintaining stability.

Maximum Time At Peak Reflow Temperature (s): 30

A maximum reflow time of 30 seconds ensures effective soldering during manufacturing while avoiding component damage.

Peak Reflow Temperature °C: 260

Supporting a high reflow temperature ensures compatibility with various soldering processes.

Length: 12.8 mm

A modest length aids in the design of compact modules while maintaining electrical performance.

Temperature Grade: MILITARY

Designed to meet military specifications, ensuring high reliability under extreme conditions.

Technology: CMOS

CMOS technology offers lower power consumption and higher integration capabilities, essential for modern applications.

Terminal Form: GULL WING

Gull wing terminals provide superior mechanical strength and ease of soldering.

Packing Method: TR

Tape and reel packing facilitates automated assembly processes, improving production efficiency.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm balances high density and ease of handling during assembly.

Count Direction: BIDIRECTIONAL

Bidirectional counting capabilities make this device versatile for various digital communication needs.

Control Type: COMMON CONTROL

Common control interface simplifies integration into larger systems, enhancing ease of use.

Moisture Sensitivity Level (MSL): 3

An MSL of 3 indicates moderate sensitivity to moisture, requiring standard handling precautions during assembly.

Maximum Supply Voltage (Vsup): 5.5 V

The maximum supply voltage of 5.5V provides an extended range for dynamic voltage applications, ensuring flexibility in power management.

Technical Specifications

Bus Driver & Transceivers M74HCT245RM13TR attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Additional Features:

WITH DIRECTION CONTROL

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

HCT

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

Logic IC Type:

Maximum I (ol):

6 Amp

Moisture Sensitivity Level (MSL):

3

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

33 ns

Propagation Delay (tpd):

45 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Translation:

N/A

Width:

7.5 mm

Trade Compliance

M74HCT245RM13TR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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