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M74HC541B1R

STMicroelectronics

M74HC541B1R by STMicroelectronics

M74HC541B1R by STMicroelectronics is an 8-bit bus driver with a propagation delay of 26ns at 4.5V, suitable for military-grade applications. It features a max operating temperature of 125 °C, output polarity TRUE, and a terminal pitch of 2.54mm in a PLASTIC/EPOXY package style.

Median Price

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Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (In-Stock)

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R&J Components

USA . 11,400 parts In-Stock

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ComSIT Distribution GmbH

Germany . 11,320 parts In-Stock

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Vyrian

USA . 6,340 parts In-Stock

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Digiode

USA . 4,967 parts In-Stock

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Anansix

USA . 1,834 parts In-Stock

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Semi Source

USA . 48 parts In-Stock

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Inventory MP

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40

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Bristol Electronics

USA . 40 parts In-Stock

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PC Components Company LLC

USA . 20 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 19 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 34 parts In-Stock

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$8.180

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$8.180

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Andel Nordic

Denmark . 489 parts In-Stock

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$9.771

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$9.380

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$9.380

489

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$9.380

IDEA Electronic Components Group

UK . 700 parts In-Stock

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$12.845

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$11.561

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$12.845

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$11.561

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Ampacity Inc.

Singapore . 551 parts In-Stock

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$24.000

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MKK Technologies

India . 988 parts In-Stock

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$24.154

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DigiPath Technology Company

USA . 988 parts In-Stock

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Component Stockers USA

USA . 748 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 12,628 parts In-Stock

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Microchip USA

USA . 5,557 parts In-Stock

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Authorized Procurement Solutions

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Kepictronics

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Parana Technologies

USA . 982 parts In-Stock

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Corphita

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Overview

Unlock unparalleled performance and reliability with the M74HC541B1R from STMicroelectronics, a leading manufacturer known for delivering top-quality semiconductor solutions. This bus driver & transceiver is a game-changer in various applications, offering customers exceptional value, efficiency, and versatility without compromising on quality. Experience seamless integration, faster data transmission, and enhanced functionality with this innovative product, setting new standards in the industry. Elevate your projects with the M74HC541B1R and unleash the full potential of your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and resistance to physical damage, making it suitable for use in rugged environments.

Propagation Delay At Nominal Supply: 26 ns

Low propagation delay ensures fast and efficient data transmission.

Package Shape: RECTANGULAR

Compact rectangular shape allows for easy installation and integration into various systems.

No. of Bits: 8

Sufficient number of bits for versatile data processing and control capabilities.

Nominal Supply Voltage / Vsup (V): 4.5

Optimal supply voltage for efficient and reliable performance.

Load Capacitance (CL): 150 pF

Suitable load capacitance for stable operation and reduced signal distortion.

Power Supplies (V): 2/6

Compatible with a range of power supplies for flexible application.

No. of Terminals: 20

Sufficient terminals for connections and interface with other components.

Package Style (Meter): IN-LINE

In-line package style for convenient installation and space-saving design.

Maximum I (ol): 6 Amp

High output current capability for driving various loads.

Propagation Delay (tpd): 175 ns

Provides a balance between fast data transmission and signal integrity.

Maximum Operating Temperature: 125 °C

Wide operating temperature range for versatile use in different environments.

Output Characteristics: 3-STATE

3-state output for flexible control and signal routing options.

Minimum Operating Temperature: -55 °C

Ability to withstand low temperatures for reliable operation in harsh conditions.

Terminal Finish: MATTE TIN

Matte tin finish for enhanced solderability and corrosion resistance.

Terminal Position: DUAL

Dual terminal position for improved stability and connectivity.

No. of Ports: 2

Multiple ports for versatile connectivity and data exchange capabilities.

Maximum Seated Height: 3.93 mm

Low profile design for space-constrained applications.

Width: 7.62 mm

Compact width for easy integration into different systems.

Output Polarity: TRUE

True output polarity for accurate signal representation.

Minimum Supply Voltage (Vsup): 2 V

Low minimum supply voltage for efficient power management.

Temperature Grade: MILITARY

Military-grade temperature rating for rugged and reliable performance in harsh environments.

Technology: CMOS

CMOS technology for low power consumption and high noise immunity.

Terminal Form: THROUGH-HOLE

Through-hole terminal form for secure and reliable connections.

Packing Method: TUBE

Tube packing method for safe transportation and storage.

Terminal Pitch: 2.54 mm

Standard terminal pitch for easy PCB layout and assembly.

Control Type: ENABLE LOW

Enable low control type for versatile operation and signal management.

Maximum Supply Voltage (Vsup): 6 V

High maximum supply voltage for compatibility with various power sources.

Technical Specifications

Bus Driver & Transceivers M74HC541B1R attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Additional Features:

WITH DUAL OUTPUT ENABLE

Control Type:

ENABLE LOW

Family:

HC/UH

JESD-30 Code:

R-PDIP-T20

JESD-609 Code:

e3

Load Capacitance (CL):

150 pF

Logic IC Type:

Maximum I (ol):

6 Amp

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

TUBE

Power Supplies (V):

2/6

Propagation Delay At Nominal Supply:

26 ns

Propagation Delay (tpd):

175 ns

Qualification:

Not Qualified

Maximum Seated Height:

3.93 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

M74HC541B1R Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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