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M74HC51RM13TR

STMicroelectronics

M74HC51RM13TR by STMicroelectronics

M74HC51RM13TR by STMicroelectronics is a logic gate with 2 functions and 6 inputs. It has a propagation delay of 30 ns at 4.5V, suitable for military-grade applications requiring fast signal processing in compact designs. This surface-mount device features a small outline package with nickel/palladium/gold terminals, ideal for high-speed digital circuits in harsh environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,881 parts In-Stock

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Corel Iberica Componentes, S.L.

Spain . 4,640 parts In-Stock

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Digiode

USA . 2,909 parts In-Stock

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ComSIT Distribution GmbH

Germany . 2,500 parts In-Stock

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Anansix

USA . 1,003 parts In-Stock

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Inventory MP

USA . 52 parts In-Stock

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Bristol Electronics

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Microchip USA

USA . 163 parts In-Stock

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$6.462

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IDEA Electronic Components Group

UK . 1,473 parts In-Stock

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$7.519

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$6.767

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MKK Technologies

India . 1,239 parts In-Stock

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$14.139

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DigiPath Technology Company

USA . 1,239 parts In-Stock

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AZTECH Wire

Italy . 469 parts In-Stock

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$15.370

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Advanced Electronics

New Zealand . 70 parts In-Stock

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$23.093

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$21.015

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$18.936

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A-Z Elektronik GmbH

Germany . 5,844 parts In-Stock

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Assy Fe

Spain . 4,640 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,896 parts In-Stock

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Corphita

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Parana Technologies

USA . 852 parts In-Stock

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$8.990

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Overview

Unlock superior performance and reliability with the M74HC51RM13TR logic gates by STMicroelectronics. As a trusted manufacturer in the industry, STMicroelectronics brings you a cutting-edge solution for your electronic applications. Ideal for a wide range of uses, these logic gates offer unparalleled value and benefits to customers looking for efficiency and quality in their projects. Upgrade your designs with the M74HC51RM13TR and experience the difference that STMicroelectronics can make for you.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a durable and cost-effective packaging option.

Propagation Delay At Nominal Supply: 30 ns

Fast propagation delay ensures efficient signal transmission.

Surface Mount: YES

Can be easily mounted on circuit boards, saving assembly time.

No. of Functions: 2

Allows for multiple logic operations to be performed in a single package.

No. of Inputs: 6

Provides flexibility for complex logic operations.

Nominal Supply Voltage / Vsup (V): 4.5

Works well within standard supply voltage range for many applications.

Load Capacitance (CL): 50 pF

Suitable for driving standard capacitive loads.

Power Supplies (V): 2/6

Compatible with a range of power supply voltages.

No. of Terminals: 14

Provides ample interface options for connecting to other components.

Technology: CMOS

Uses low power CMOS technology for energy efficiency.

Maximum Operating Temperature: 125 °C

Can operate reliably in high-temperature environments.

Minimum Operating Temperature: -55 °C

Can operate reliably in low-temperature environments.

Technical Specifications

Logic Gates M74HC51RM13TR attributes and parameters. Explore more Logic Gates devices from STMicroelectronics

Specs

Additional Features:

ASYMMETRICAL INPUTS

Family:

HC/UH

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

8.65 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Inputs:

6

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Propagation Delay At Nominal Supply:

30 ns

Propagation Delay (tpd):

150 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.75 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

3.9 mm

Trade Compliance

M74HC51RM13TR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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