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M74HC365TTR

STMicroelectronics

M74HC365TTR by STMicroelectronics

M74HC365TTR by STMicroelectronics is a 6-bit bus driver with a propagation delay of 27 ns and operates b/w 2V to 6V. It features a compact SO package, ideal for space-constrained applications. This CMOS device supports true output polarity and is suitable for military-grade environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,354 parts In-Stock

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4,354

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Cyclops Electronics Ltd

UK . 2,500 parts In-Stock

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2,500

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Speed Components Ltd

Israel . 383 parts In-Stock

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383

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Anansix

USA . 258 parts In-Stock

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258

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Digiode

USA . 206 parts In-Stock

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Distributors (Availability)

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Microchip USA

USA . 447 parts In-Stock

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$5.251

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447

$5.251

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AZTECH Wire

Italy . 257 parts In-Stock

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$13.890

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257

$13.890

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IDEA Electronic Components Group

UK . 1,131 parts In-Stock

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$22.335

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$20.101

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$22.335

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$20.101

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MKK Technologies

India . 716 parts In-Stock

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$41.999

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716

$41.999

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DigiPath Technology Company

USA . 716 parts In-Stock

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$41.999

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716

$41.999

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Component Stockers USA

USA . 618 parts In-Stock

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$99.990

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618

$99.990

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RC Electronics

USA . 92,044 parts In-Stock

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Authorized Procurement Solutions

USA . 6,220 parts In-Stock

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Corphita

USA . 3,220 parts In-Stock

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Kepictronics

USA . 2,500 parts In-Stock

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2,500

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Parana Technologies

USA . 1,054 parts In-Stock

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$26.705

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1,054

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$26.705

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Overview

Unlock unparalleled performance with the M74HC365TTR from STMicroelectronics, a trusted leader in semiconductor innovation. Designed as a versatile bus driver and transceiver, this device ensures high-speed data transmission with exceptional reliability, making it ideal for industrial automation, communications, and automotive applications. Experience enhanced efficiency and robustness in your designs, backed by ST's commitment to quality and cutting-edge technology. Elevate your projects today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body enhances durability and protects the electronic components from environmental factors, making it suitable for various applications.

Propagation Delay At Nominal Supply: 27 ns

A low propagation delay ensures faster signal transmission, which is crucial for high-speed data applications.

Surface Mount: YES

Surface mount technology allows for compact designs and efficient use of PCB space, enabling more functionality in smaller devices.

Package Shape: RECTANGULAR

The rectangular shape facilitates easy integration into circuit boards, optimizing space and arrangement.

No. of Bits: 6

With 6 bits, this product can handle a significant amount of data, making it ideal for a variety of data bus applications.

Nominal Supply Voltage / Vsup (V): 4.5

A nominal supply voltage of 4.5V ensures compatibility with many standard circuits and battery-operated devices.

Load Capacitance (CL): 50 pF

A low load capacitance allows for faster signal processing and reduces power consumption, optimizing performance.

Power Supplies (V): 2/6

The ability to operate between 2V to 6V makes this product versatile for various applications and power supply configurations.

No. of Terminals: 16

Having 16 terminals allows for multiple connectivity options and facilitates complex circuit designs.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The thin profile and shrink pitch permit high-density circuit layouts, maximizing space efficiency.

Maximum I (ol): 6 Amp

A high output current capability of 6 Amps supports robust applications, including those requiring significant power load.

Propagation Delay (tpd): 195 ns

While slightly higher than nominal delay, this is acceptable for certain applications, ensuring reliable operation without significantly affecting performance.

Maximum Operating Temperature: 125 °C

A high maximum operating temperature makes this product suitable for demanding environments and enhances reliability.

Output Characteristics: 3-STATE

3-state output allows for greater flexibility in bus communication, enabling multiple devices to share the same bus without interference.

Minimum Operating Temperature: -55 °C

The ability to operate at extremely low temperatures ensures this product can be used in harsh environments, enhancing durability.

Terminal Finish: NICKEL PALLADIUM GOLD

This high-quality terminal finish provides excellent corrosion resistance and improves solderability, ensuring long-term performance.

Terminal Position: DUAL

Dual terminal positions offer flexibility in PCB layout and design while simplifying assembly.

No. of Ports: 2

With 2 ports, this device can facilitate intercommunication between multiple circuits or integrated components efficiently.

Maximum Seated Height: 1.2 mm

A low seated height contributes to compact designs, which are essential in modern electronic applications where space is at a premium.

Width: 4.4 mm

A narrow width allows for close placement of components on a PCB, promoting space-saving designs.

Output Polarity: TRUE

True output polarity simplifies circuit design and integration by ensuring compatibility with most logic systems.

Minimum Supply Voltage (Vsup): 2 V

A low minimum supply voltage facilitates operation in low-power applications, enhancing energy efficiency.

Length: 5 mm

A compact length aids in fitting into tight spaces on circuit boards, ideal for miniaturized electronics.

Temperature Grade: MILITARY

With a military-grade temperature rating, this product is built for reliability and performance in extreme conditions.

Technology: CMOS

CMOS technology offers low power consumption and high-speed performance, making it ideal for modern digital circuits.

Terminal Form: GULL WING

Gull wing terminals allow for easier soldering and improved mechanical strength, enhancing assembly efficiency.

Packing Method: TR

Tape and reel packing method enables automated assembly, reducing production time and costs.

Terminal Pitch: 0.65 mm

A smaller terminal pitch allows for closer spacing of terminals, optimizing PCB layout and reducing footprint.

Control Type: ENABLE LOW

Low-enable control type provides straightforward implementation in various circuit configurations.

Maximum Supply Voltage (Vsup): 6 V

Supporting up to 6V supply voltage ensures versatility across different circuit designs.

Technical Specifications

Bus Driver & Transceivers M74HC365TTR attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Control Type:

ENABLE LOW

Family:

HC/UH

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

6 Amp

No. of Bits:

6

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Power Supplies (V):

2/6

Propagation Delay At Nominal Supply:

27 ns

Propagation Delay (tpd):

195 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceiver

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Trade Compliance

M74HC365TTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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