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M74HC27TTR

STMicroelectronics

M74HC27TTR by STMicroelectronics

M74HC27TTR by STMicroelectronics is a CMOS logic gate with 3 functions and 3 inputs, featuring a propagation delay of just 23 ns. It operates b/w 2-6 V and supports load capacitance up to 50 pF. Ideal for military applications, it comes in a compact SOIC package.

Median Price

$0.154

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 50 parts In-Stock

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$0.154

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$0.154

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DigiKey

USA . 22 parts In-Stock

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$0.490

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$0.144

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$0.490

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$0.144

Verical

USA . 50 parts In-Stock

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$0.154

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Chip1Stop

Japan . 50 parts In-Stock

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50

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Digiode

USA . 1,722 parts In-Stock

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$0.146

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Vyrian

USA . 7,113 parts In-Stock

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Anansix

USA . 2,702 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 1,621 parts In-Stock

1+ parts

$0.139

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Component Stockers USA

USA . 131 parts In-Stock

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$0.150

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Microchip USA

USA . 302 parts In-Stock

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$1.468

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302

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IDEA Electronic Components Group

UK . 109 parts In-Stock

1+ parts

$18.372

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$16.535

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109

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$16.535

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MKK Technologies

India . 1,104 parts In-Stock

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$34.548

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DigiPath Technology Company

USA . 1,104 parts In-Stock

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$34.548

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Perfect Parts

USA . 38,510 parts In-Stock

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Parana Technologies

USA . 742 parts In-Stock

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$21.967

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Overview

Unlock the potential of your projects with the M74HC27TTR from STMicroelectronics, a leader in innovative semiconductor solutions. This versatile logic gate offers exceptional performance in a compact design, ideal for a range of applications from consumer electronics to industrial automation. Enjoy the benefits of high reliability, low power consumption, and quick response times, ensuring your designs are both efficient and robust. Elevate your engineering game with trusted quality that only STMicroelectronics can provide!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy materials ensures durability and resistance to environmental factors, enhancing the product's longevity.

Propagation Delay At Nominal Supply: 23 ns

A low propagation delay allows for faster switching, making it suitable for high-speed applications.

Surface Mount: YES

Surface-mount technology allows for compact designs, making this logic gate ideal for modern electronics where space is a premium.

No. of Functions: 3

Multiple functions in a single chip enhance versatility, reducing the need for multiple components in circuits.

No. of Inputs: 3

Having three inputs offers flexibility in circuit design, allowing for more complex logic operations.

Package Shape: RECTANGULAR

A rectangular package shape allows for efficient space utilization on PCBs, making it easier to integrate into designs.

Nominal Supply Voltage / Vsup (V): 4.5

This nominal supply voltage is suitable for various applications, providing a balance between performance and power consumption.

Load Capacitance (CL): 50 pF

A low load capacitance ensures quicker response times, which is critical for high-frequency applications.

Power Supplies (V): 2/6

Wide power supply range supports compatibility with various systems, allowing for flexibility in design.

No. of Terminals: 14

With 14 terminals, this product provides ample connectivity options, facilitating diverse configurations and connections.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile are ideal for portable devices and applications where space is limited.

Maximum I (ol): 4 Amp

High output current capacity enables this logic gate to drive larger loads, enhancing its utility in various applications.

Propagation Delay (tpd): 115 ns

While this propagation delay is higher than nominal, it still supports effective operations in applications with moderate speed requirements.

Maximum Operating Temperature: 125 °C

High operating temperature capability ensures reliability in demanding environments, making it suitable for industrial applications.

Minimum Operating Temperature: -55 °C

Ability to operate at low temperatures enables its use in extreme conditions, broadening the scope of applications.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold finish improves corrosion resistance and ensures better conductivity, enhancing performance.

Terminal Position: DUAL

Dual terminal positioning allows for ease of soldering and integration into circuit designs, enhancing assembly efficiency.

Maximum Seated Height: 1.2 mm

A low seated height helps in maintaining a compact design profile, which is essential for modern electronic applications.

Width: 4.4 mm

Narrow width supports high-density applications, assisting in designing miniaturized electronic circuits.

Minimum Supply Voltage (Vsup): 2 V

Allows for operation in low-power modes, which is ideal for battery-powered devices.

Length: 5 mm

Compact length contributes to a reduced footprint, making it perfect for small electronic devices.

Temperature Grade: MILITARY

Designed to meet military standards, ensuring reliability and robustness in critical applications.

Technology: CMOS

CMOS technology offers high noise immunity and low static power consumption, making it energy-efficient.

Terminal Form: GULL WING

Gull wing terminals facilitate easier handling and better soldering connections, improving assembly reliability.

Packing Method: TR

Tape and reel packing method simplifies automated assembly processes, ensuring efficiency during production.

Terminal Pitch: 0.65 mm

A standard terminal pitch allows compatibility with various PCB designs, easing the integration into existing systems.

Maximum Supply Voltage (Vsup): 6 V

The ability to handle up to 6 V allows for use in a variety of applications, providing design flexibility.

Technical Specifications

Logic Gates M74HC27TTR attributes and parameters. Explore more Logic Gates devices from STMicroelectronics

Specs

Family:

HC/UH

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

No. of Functions:

3

No. of Inputs:

3

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Power Supplies (V):

2/6

Propagation Delay At Nominal Supply:

23 ns

Propagation Delay (tpd):

115 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.2 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Trade Compliance

M74HC27TTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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