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M74HC240TTR

STMicroelectronics

M74HC240TTR by STMicroelectronics

M74HC240TTR by STMicroelectronics is a CMOS bus driver with a 27 ns propagation delay and operates b/w 2-6 V. It features 3-state output characteristics and supports dual ports, making it ideal for high-speed data transmission in compact applications. Its military-grade design ensures reliability in extreme temperatures from -55 °C to 125 °C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,620 parts In-Stock

1+ parts

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6,620

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Digiode

USA . 3,745 parts In-Stock

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3,745

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Anansix

USA . 926 parts In-Stock

1+ parts

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926

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 491 parts In-Stock

1+ parts

$1.458

100+ parts

-

1k+ parts

$1.400

10k+ parts

$1.400

491

$1.458

-

$1.400

$1.400

AZTECH Wire

Italy . 790 parts In-Stock

1+ parts

$8.500

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-

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790

$8.500

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Microchip USA

USA . 211 parts In-Stock

1+ parts

$17.214

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211

$17.214

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IDEA Electronic Components Group

UK . 1,506 parts In-Stock

1+ parts

$22.369

100+ parts

-

1k+ parts

$20.132

10k+ parts

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1,506

$22.369

-

$20.132

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Advanced Electronics

New Zealand . 121 parts In-Stock

1+ parts

$33.652

100+ parts

$33.315

1k+ parts

$31.969

10k+ parts

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121

$33.652

$33.315

$31.969

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MKK Technologies

India . 1,569 parts In-Stock

1+ parts

$42.063

100+ parts

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1,569

$42.063

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DigiPath Technology Company

USA . 1,569 parts In-Stock

1+ parts

$42.063

100+ parts

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1,569

$42.063

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

1+ parts

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5,000

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Parana Technologies

USA . 2,038 parts In-Stock

1+ parts

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100+ parts

$26.745

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2,038

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$26.745

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Corphita

USA . 235 parts In-Stock

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235

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Overview

Elevate your designs with the M74HC240TTR from STMicroelectronics, a leader in innovative semiconductor solutions. This versatile bus driver and transceiver ensures seamless communication across various applications, providing low power consumption and reliable performance. With its robust quality and military-grade temperature range, the M74HC240TTR enhances system efficiency while offering exceptional value. Trust in STMicroelectronics for unmatched reliability and superior technology that empowers your projects to thrive.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package provides durability and resistance to environmental factors, making it suitable for various applications.

Propagation Delay At Nominal Supply: 27 ns

A low propagation delay ensures fast signal transmission, enhancing performance in high-speed applications.

Surface Mount: YES

Surface mount technology allows for compact designs and efficient use of PCB space, making the product easy to integrate.

No. of Functions: 2

The dual-function capability provides versatility, enabling multiple operations within a single component.

Package Shape: RECTANGULAR

A rectangular shape aids in space-efficient layout and placement on circuit boards.

No. of Bits: 4

The 4-bit configuration allows the device to handle multiple data lines simultaneously, improving performance in digital applications.

Nominal Supply Voltage / Vsup (V): 4.5

Operating at a nominal supply voltage ensures stable performance while being compatible with various standard voltage levels.

Load Capacitance (CL): 50 pF

A load capacitance of 50 pF allows for efficient signal transmission with minimal distortion, essential for maintaining signal integrity.

Power Supplies (V): 2/6

The ability to operate across a range of power supplies (2V to 6V) provides flexibility for different applications.

No. of Terminals: 20

With 20 terminals, this device offers extensive connectivity options, allowing for integration into complex circuits.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

A small outline and thin profile allow this device to fit into space-constrained designs, enhancing versatility.

Maximum I (ol): 6 Amp

A maximum output current of 6 amps supports high-power applications, making the product suitable for demanding tasks.

Propagation Delay (tpd): 195 ns

While the longer propagation delay can indicate slower performance, it provides additional assessment criteria for slower signal needs.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature enables the device to function in high-heat environments, ideal for extreme applications.

Output Characteristics: 3-STATE

3-state output allows for versatile data handling capabilities, enabling multiple devices to share a single output line.

Minimum Operating Temperature: -55 °C

The ability to operate at -55 °C makes this device suitable for frigid environments, adding to its application range.

Terminal Finish: NICKEL PALLADIUM GOLD

The high-quality finish ensures good connectivity and resistance to corrosion, thus ensuring long-term reliability.

Terminal Position: DUAL

Dual terminal positioning allows for flexible layout options, improving connectivity within diverse designs.

No. of Ports: 2

Two ports provide additional interfacing options, enabling effective communication between multiple devices.

Maximum Seated Height: 1.2 mm

A low seated height is beneficial for applications requiring low-profile components, aiding in compact designs.

Width: 4.4 mm

A compact width enables easier integration into tighter spaces, enhancing design flexibility.

Output Polarity: INVERTED

An inverted output polarity can be advantageous in specific circuit designs, offering additional design flexibility.

Minimum Supply Voltage (Vsup): 2 V

A minimum supply voltage of 2V broadens the range of devices and systems with which this product can be used.

Length: 6.5 mm

The compact length offers design efficiency in space-constrained applications, making integration straightforward.

Temperature Grade: MILITARY

With a military temperature grade, this product is reliable in harsh environments, making it suitable for defense and aerospace applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making it ideal for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminals provide easier mounting and soldering, enhancing manufacturability.

Packing Method: TR

Tape and reel (TR) packaging facilitates automated assembly processes, streamlining manufacturing and assembly lines.

Terminal Pitch: 0.65 mm

A terminal pitch of 0.65 mm supports dense packing on PCBs, ideal for modern miniaturized electronics.

Control Type: ENABLE LOW

The low enable control typology contributes to low power draw in inactive states, enhancing energy efficiency.

Maximum Supply Voltage (Vsup): 6 V

The maximum supply voltage of 6V allows for adaptability in various higher voltage environments, accommodating diverse applications.

Technical Specifications

Bus Driver & Transceivers M74HC240TTR attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Control Type:

ENABLE LOW

Family:

HC/UH

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

6 Amp

No. of Bits:

4

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Power Supplies (V):

2/6

Propagation Delay At Nominal Supply:

27 ns

Propagation Delay (tpd):

195 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Trade Compliance

M74HC240TTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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