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M74HC174RM13TR

STMicroelectronics

M74HC174RM13TR by STMicroelectronics

M74HC174RM13TR by STMicroelectronics is a 6-bit CMOS latch with a max supply voltage of 6V and operates at temperatures from -55 °C to 125 °C. It features a propagation delay of just 205 ns, making it ideal for high-speed applications. This surface-mount device is perfect for digital circuits requiring reliable data storage.

Median Price

$0.314

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 2,260 parts In-Stock

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$0.314

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$0.314

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Verical

USA . 2,260 parts In-Stock

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$0.314

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2,260

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$0.314

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Chip1Stop

Japan . 2,260 parts In-Stock

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2,260

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Digiode

USA . 2,883 parts In-Stock

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$0.294

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$0.294

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ComSIT Distribution GmbH

Germany . 14,852 parts In-Stock

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Vyrian

USA . 5,485 parts In-Stock

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Electronic Expediters

USA . 5,000 parts In-Stock

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Bristol Electronics

USA . 5,000 parts In-Stock

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-

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$0.317

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$0.156

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$0.127

5,000

-

$0.317

$0.156

$0.127

Microfarads

USA . 4,820 parts In-Stock

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4,820

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Anansix

USA . 1,918 parts In-Stock

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1,918

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Distributors (Availability)

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Corphita

USA . 857 parts In-Stock

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$0.279

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857

$0.279

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Component Stockers USA

USA . 6,610 parts In-Stock

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$0.360

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$0.360

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$0.360

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6,610

$0.360

$0.360

$0.360

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Microchip USA

USA . 204 parts In-Stock

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$3.206

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204

$3.206

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IDEA Electronic Components Group

UK . 1,876 parts In-Stock

1+ parts

$17.239

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$15.515

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1,876

$17.239

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$15.515

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AZTECH Wire

Italy . 316 parts In-Stock

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$20.840

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316

$20.840

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MKK Technologies

India . 1,262 parts In-Stock

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$32.417

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1,262

$32.417

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DigiPath Technology Company

USA . 1,262 parts In-Stock

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$32.417

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1,262

$32.417

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Perfect Parts

USA . 43,953 parts In-Stock

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Kepictronics

USA . 8,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 4,950 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 3,969 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,300 parts In-Stock

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Assy Fe

Spain . 2,500 parts In-Stock

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Parana Technologies

USA . 1,842 parts In-Stock

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$20.612

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$20.612

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Overview

Unlock superior performance with the M74HC174RM13TR from STMicroelectronics, a trusted leader in high-quality electronic components. This versatile 6-bit latch offers exceptional reliability and rapid response times, making it ideal for everything from industrial automation to consumer electronics. Enjoy peace of mind knowing you're backed by ST's commitment to innovation, ensuring your projects excel with efficiency, precision, and durability. Elevate your designs today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight, the plastic/epoxy material provides excellent protection against environmental factors, ensuring reliability.

Surface Mount: YES

Surface mount capability allows for more efficient use of PCB space, facilitating compact designs and higher circuit densities.

Package Shape: RECTANGULAR

Rectangular shape optimizes space on the PCB, aiding in tighter arrangements of components.

No. of Bits: 6

With 6 bits, this latch/flip-flop offers ample data storage capability for various applications, enhancing versatility.

Nominal Supply Voltage / Vsup (V): 4.5

Operating near a standard voltage level makes it suitable for numerous electronic applications, ensuring compatibility.

Load Capacitance (CL): 50 pF

Low load capacitance ensures faster switching speeds and lower power consumption, making it efficient for high-speed operations.

Power Supplies (V): 2/6

The flexible operating voltage range accommodates various design requirements, simplifying integration into multiple systems.

No. of Terminals: 16

A generous number of terminals facilitates robust connectivity and enables complex functions in circuit design.

Package Style (Meter): SMALL OUTLINE

Small outline package minimizes the footprint on the PCB, enabling compact designs while maintaining performance.

Maximum I (ol): 4 Amp

High output current capability allows the latch/flip-flop to control large loads directly, enhancing its application range.

Propagation Delay (tpd): 205 ns

With a propagation delay of only 205 ns, this product supports high-speed data processing, making it suitable for advanced applications.

Maximum Operating Temperature: 125 °C

High operating temperature tolerance ensures reliable performance in demanding environments, suitable for industrial use.

Trigger Type: POSITIVE EDGE

The positive edge trigger design ensures synchronous operations, making it ideal for clock-driven applications.

Minimum Operating Temperature: -55 °C

Wide temperature range ensures functionality in extreme conditions, perfect for military and aerospace applications.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

Premium terminal finish enhances connectivity and prevents oxidation, ensuring long-term reliability.

Terminal Position: DUAL

Dual terminal position offers design flexibility, facilitating different layout configurations on the circuit board.

Maximum Seated Height: 1.75 mm

Low seated height aids in creating low-profile designs, suitable for compact electronic devices.

Width: 3.9 mm

Narrow width contributes to space-efficient layouts, making it ideal for space-constrained applications.

Output Polarity: TRUE

True output polarity simplifies design considerations in various applications, ensuring consistent performance.

Minimum Supply Voltage (Vsup): 2 V

Allows operation at lower voltage levels, contributing to overall energy efficiency in various designs.

Maximum Time At Peak Reflow Temperature (s): 30

Extended reflow time demonstrates compatibility with various soldering processes, ensuring stable assembly processes.

Peak Reflow Temperature °C: 260

High peak temperature tolerance ensures compatibility with lead-free soldering processes, supporting modern manufacturing standards.

Length: 9.9 mm

Compact length allows for streamlined assembly, facilitating integration into high-density PCB layouts.

Temperature Grade: MILITARY

MILITARY-grade classification guarantees superior performance and reliability in extreme conditions, suitable for defense applications.

Maximum Frequency At Nominal Supply: 24000000 Hz

High frequency support ensures that the product can handle fast data rates, ideal for modern digital circuits.

Technology: CMOS

CMOS technology ensures low power consumption, high noise immunity, and scalability for various applications.

Terminal Form: GULL WING

Gull wing terminals provide excellent solderability and mechanical strength, enhancing durability in electronic connections.

Packing Method: TR

Tape and reel packing facilitates automated assembly processes, improving manufacturing efficiency.

Terminal Pitch: 1.27 mm

Standard terminal pitch supports compatibility with a variety of PCB designs and promotes flexible layout configurations.

Minimum fmax: 28 MHz

Minimum frequency capability enables operation in a wide range of applications, enhancing versatility for diverse tasks.

Moisture Sensitivity Level (MSL): 3

MSL 3 classification indicates moderate sensitivity to moisture, guiding appropriate storage conditions and handling procedures.

Maximum Supply Voltage (Vsup): 6 V

Maximum voltage rating supports a wide range of applications, adding flexibility for different circuit designs.

Technical Specifications

Latches & Flip-Flops M74HC174RM13TR attributes and parameters. Explore more Latches & Flip-Flops devices from STMicroelectronics

Specs

Family:

HC/UH

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

24000000 Hz

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

3

No. of Bits:

6

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Propagation Delay (tpd):

205 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

3.9 mm

Minimum fmax:

28 MHz

Trade Compliance

M74HC174RM13TR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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