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M74HC173RM13TR

STMicroelectronics

M74HC173RM13TR by STMicroelectronics

M74HC173RM13TR by STMicroelectronics is a 4-bit CMOS latch with a max supply voltage of 6V and operates at temperatures from -55 °C to 125 °C. It features a propagation delay of 220 ns and supports 3-state output. Ideal for high-speed digital applications, it ensures reliable data storage.

Median Price

$0.570

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 6 parts In-Stock

1+ parts

$0.570

100+ parts

-

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-

10k+ parts

$0.205

6

$0.570

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$0.205

Distributors (In-Stock)

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Digiode

USA . 3,927 parts In-Stock

1+ parts

$0.542

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3,927

$0.542

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Pegasus Components GmbH

Germany . 30,000 parts In-Stock

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Vyrian

USA . 8,801 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 2,500 parts In-Stock

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2,500

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Anansix

USA . 2,150 parts In-Stock

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2,150

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Corel Iberica Componentes, S.L.

Spain . 1,928 parts In-Stock

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1,928

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Semi Source

USA . 1,731 parts In-Stock

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1,731

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Sensible Micro Corp

USA . 1,609 parts In-Stock

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1,609

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J2 Sourcing AB

Sweden . 1,211 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 4,180 parts In-Stock

1+ parts

$0.513

100+ parts

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4,180

$0.513

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Microchip USA

USA . 424 parts In-Stock

1+ parts

$3.016

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424

$3.016

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IDEA Electronic Components Group

UK . 1,783 parts In-Stock

1+ parts

$27.670

100+ parts

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$24.903

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1,783

$27.670

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$24.903

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MKK Technologies

India . 2,033 parts In-Stock

1+ parts

$52.031

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2,033

$52.031

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DigiPath Technology Company

USA . 2,033 parts In-Stock

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$52.031

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2,033

$52.031

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QUARKTWIN TECHNOLOGY LTD

USA . 15,063 parts In-Stock

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15,063

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Perfect Parts

USA . 8,532 parts In-Stock

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8,532

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Cyclops Electronics Ltd (Excess)

UK . 3,806 parts In-Stock

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3,806

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Assy Fe

Spain . 1,928 parts In-Stock

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1,928

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Parana Technologies

USA . 1,129 parts In-Stock

1+ parts

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$33.084

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1,129

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$33.084

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Overview

Unlock the potential of your designs with the M74HC173RM13TR latch from STMicroelectronics, a trusted leader in semiconductor innovation. This high-performance flip-flop offers remarkable reliability and efficiency for a variety of applications, from consumer electronics to industrial automation. With its compact design and superior thermal stability, it ensures seamless integration into your projects while delivering outstanding signal integrity. Elevate your solutions with unmatched quality and performance that only STMicroelectronics can provide!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures lightweight and durable construction, making it ideal for various applications.

Surface Mount: YES

Surface mount technology allows for compact designs and easy integration into modern PCB layouts.

Package Shape: RECTANGULAR

The rectangular package shape optimizes space and provides efficient thermal dissipation.

No. of Bits: 4

Supporting 4 bits makes this latch/flip-flop suitable for a variety of applications requiring multiple bit processing.

Nominal Supply Voltage / Vsup (V): 4.5

A nominal supply voltage of 4.5V balances performance with power efficiency, suitable for diverse circuits.

Load Capacitance (CL): 50 pF

A moderate load capacitance helps in maintaining signal integrity and reducing power consumption.

Power Supplies (V): 2/6

The flexible supply voltage range of 2V to 6V allows for versatile use in different electronic systems.

No. of Terminals: 16

With 16 terminals, this device enables complex connectivity and integration into advanced circuit designs.

Package Style (Meter): SMALL OUTLINE

The small outline design allows for higher density PCB layouts and reduces overall device footprint.

Maximum I (ol): 4 Amp

A maximum output current of 4 Amps ensures this device can drive significant loads effectively.

Propagation Delay (tpd): 220 ns

The relatively low propagation delay supports high-speed operation, making it suitable for fast digital circuits.

Maximum Operating Temperature: 125 °C

A high maximum operating temperature ensures reliability in harsh environments and extended operational capabilities.

Output Characteristics: 3-STATE

3-state output allows for more flexible bus communication and reduced contention in digital circuits.

Trigger Type: POSITIVE EDGE

Positive edge triggering provides clean transitions and enhances timing accuracy in synchronous designs.

Minimum Operating Temperature: -55 °C

With a wide temperature range, this product can be used in extreme conditions, making it suitable for military and aerospace applications.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold finish ensures excellent solderability and long-term reliability of connections.

Terminal Position: DUAL

Dual terminal positioning allows for more versatile PCB designs and easier access to connections.

Maximum Seated Height: 1.75 mm

A low seated height contributes to a low-profile design, allowing for compact device integration.

Width: 3.9 mm

The narrow width simplifies placement on PCBs, aiding in space optimization for intricate circuit layouts.

Output Polarity: TRUE

True output polarity ensures straightforward implementation in standard digital circuits.

Minimum Supply Voltage (Vsup): 2 V

Supporting a minimum supply voltage of 2V enhances compatibility with low-power applications.

Length: 9.9 mm

A modest length aids in maintaining a compact design while providing ample connection points.

Temperature Grade: MILITARY

MILITARY temperature grading guarantees robustness and reliability across challenging environments.

Maximum Frequency At Nominal Supply: 29000000 Hz

The capability to handle high frequencies makes this product suitable for high-speed data applications.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, making it ideal for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and assembly, improving manufacturing efficiency.

Packing Method: TR

The TR packing method allows for easier handling and placement during assembly processes.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm is standard for many PCBs, ensuring compatibility with a wide range of designs.

Minimum fmax: 34 MHz

A minimum frequency maximum of 34 MHz supports basic digital signals and applications, providing versatility.

Maximum Supply Voltage (Vsup): 6 V

A maximum supply voltage of 6V allows the product to be used in higher voltage applications, enhancing versatility.

Technical Specifications

Latches & Flip-Flops M74HC173RM13TR attributes and parameters. Explore more Latches & Flip-Flops devices from STMicroelectronics

Specs

Family:

HC/UH

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

29000000 Hz

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

4

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Power Supplies (V):

2/6

Propagation Delay (tpd):

220 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trigger Type:

POSITIVE EDGE

Width:

3.9 mm

Minimum fmax:

34 MHz

Trade Compliance

M74HC173RM13TR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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