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M74HC14RM13TR

STMicroelectronics

M74HC14RM13TR by STMicroelectronics

STMicroelectronics M74HC14RM13TR is a CMOS Logic Gates IC with 6 functions. It has a propagation delay of 38ns at 4.5V, suitable for military-grade applications. With Schmitt Trigger technology and surface-mount packaging, it operates b/w -55 to 125°C.

Median Price

$0.246

Lifecycle Status

Suppliers In-Stock

20

In-Stock Inventory

1k+

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Nova Conductors

Japan . 50 parts In-Stock

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Mobius Materials

USA . 3,398 parts In-Stock

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$0.380

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$0.310

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Pegasus Components GmbH

Germany . 38,784 parts In-Stock

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Vyrian

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Ack Elektronik San.Tic.Ltd.Sti

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Digiode

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ComSIT Distribution GmbH

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LIBRA Elektronik GmbH

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Holdelec - ElecDif-Pro

France . 2,090 parts In-Stock

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Goldney Electronics S.L.

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Component Sense

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SPM Sales

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Odintec Ltd.

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Florida Circuit

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Anansix

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Bristol Electronics

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Semi Source

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Prism Electronics

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Netroflash

USA . 100 parts In-Stock

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$0.111

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$0.109

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Microchip USA

USA . 308 parts In-Stock

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$2.990

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AZTECH Wire

Italy . 862 parts In-Stock

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IDEA Electronic Components Group

UK . 37 parts In-Stock

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$29.830

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Ampacity Inc.

Singapore . 878 parts In-Stock

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MKK Technologies

India . 27 parts In-Stock

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DigiPath Technology Company

USA . 27 parts In-Stock

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Perfect Parts

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Lixinc

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Alle Elektronik GmbH

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Authorized Procurement Solutions

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Corphita

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Parana Technologies

USA . 1,127 parts In-Stock

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Technoshack Inc. (Excess)

Canada . 109 parts In-Stock

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Speed Components Ltd (Excess)

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Overview

Enhance your electronic projects with the M74HC14RM13TR by STMicroelectronics. As a leading manufacturer in the industry, STMicroelectronics guarantees top-notch quality and reliability. This logic gate is versatile, offering 6 functions for various applications. With a fast propagation delay of 38 ns and a wide operating temperature range, this product ensures efficient performance in any environment. Trust STMicroelectronics to deliver exceptional value and benefits with the M74HC14RM13TR, perfect for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable.

Propagation Delay At Nominal Supply: 38 ns

Low propagation delay ensures fast signal processing, making the product suitable for applications requiring high speed operation.

Surface Mount: YES

Surface mount capability allows for easy and convenient mounting on PCBs, saving space and simplifying assembly.

No. of Functions: 6

The product offers multiple logic functions in a single package, providing flexibility and versatility in circuit design.

Nominal Supply Voltage / Vsup (V): 4.5

Operates efficiently at a standard supply voltage of 4.5V, making it compatible with a wide range of systems.

Maximum Operating Temperature: 125 °C

Capable of withstanding high temperatures, ensuring reliable performance even in harsh environmental conditions.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of supply voltages, making the product energy-efficient and versatile.

Technical Specifications

Logic Gates M74HC14RM13TR attributes and parameters. Explore more Logic Gates devices from STMicroelectronics

Specs

Family:

HC/UH

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

8.65 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

6

No. of Inputs:

1

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Propagation Delay At Nominal Supply:

38 ns

Propagation Delay (tpd):

190 ns

Qualification:

Not Qualified

Schmitt Trigger:

YES

Maximum Seated Height:

1.75 mm

Sub-Category:

Gate

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

3.9 mm

Trade Compliance

M74HC14RM13TR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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