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M48Z35Y-70MH6E

STMicroelectronics

M48Z35Y-70MH6E by STMicroelectronics

M48Z35Y-70MH6E by STMicroelectronics is a non-volatile SRAM with a 32K x 8 organization, operating at 5V. It features a max access time of 70 ns and operates in temperatures from -40 °C to 85 °C. Ideal for industrial applications requiring reliable data retention.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,660 parts In-Stock

1+ parts

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4,660

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Anansix

USA . 2,738 parts In-Stock

1+ parts

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2,738

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Digiode

USA . 1,067 parts In-Stock

1+ parts

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1,067

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,134 parts In-Stock

1+ parts

$3.275

100+ parts

-

1k+ parts

$2.948

10k+ parts

-

2,134

$3.275

-

$2.948

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MKK Technologies

India . 2,091 parts In-Stock

1+ parts

$6.159

100+ parts

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2,091

$6.159

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DigiPath Technology Company

USA . 2,091 parts In-Stock

1+ parts

$6.159

100+ parts

-

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10k+ parts

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2,091

$6.159

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AZTECH Wire

Italy . 1,081 parts In-Stock

1+ parts

$11.110

100+ parts

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1,081

$11.110

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Microchip USA

USA . 149 parts In-Stock

1+ parts

$58.485

100+ parts

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149

$58.485

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QUARKTWIN TECHNOLOGY LTD

USA . 4,301 parts In-Stock

1+ parts

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4,301

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Corphita

USA . 2,445 parts In-Stock

1+ parts

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2,445

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Parana Technologies

USA . 1,306 parts In-Stock

1+ parts

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100+ parts

$3.916

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1,306

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$3.916

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Overview

Elevate your designs with the M48Z35Y-70MH6E from STMicroelectronics—a trusted leader in innovative semiconductor solutions. This high-quality non-volatile SRAM offers unmatched reliability and performance, ideal for industrial applications where endurance matters. With its compact footprint and asynchronous operation, you gain efficiency without compromising on speed. Experience seamless integration, reduced downtime, and enhanced system longevity—choose STMicroelectronics for a smarter future!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material enhances durability and provides excellent insulation, making the SRAM suitable for various applications.

Surface Mount: YES

Surface mount technology allows for efficient use of space on PCBs, leading to more compact designs.

Package Shape: RECTANGULAR

The rectangular shape optimizes layout and integration into designs, ensuring versatility for various applications.

Operating Mode: ASYNCHRONOUS

Asynchronous operation allows for faster access times and simpler integration into systems requiring immediate data retrieval.

Nominal Supply Voltage / Vsup: 5V

A nominal supply voltage of 5V is standard for many applications, making it easy to integrate into existing systems.

Power Supplies (V): 5

The compatibility with a standard 5V power supply simplifies design and minimizes additional components.

No. of Terminals: 28

With 28 terminals, this SRAM has ample connectivity options for various data and control signals.

Package Style (Meter): SMALL OUTLINE

The small outline package style is ideal for space-constrained applications, promoting compact designs.

Maximum Operating Temperature: 85 °C

The ability to operate at higher temperatures makes this SRAM suitable for industrial applications with varying thermal conditions.

Organization: 32KX8

The organization facilitates easier data handling, providing a balance of memory capacity and access efficiency.

Minimum Operating Temperature: -40 °C

A wide operating temperature range ensures reliable performance in extreme conditions, enhancing product robustness.

Terminal Finish: NICKEL PALLADIUM GOLD

High-quality terminal finishes improve solderability and increase the longevity of the connections, ensuring reliability.

Terminal Position: DUAL

Dual terminal positioning allows for versatile mounting options, enhancing compatibility with various PCB layouts.

Maximum Seated Height: 3.05 mm

The compact seated height helps in maintaining low profiles in designs, beneficial for portable electronic devices.

Width: 8.56 mm

The width contributes to compact dimensions, allowing for efficient space utilization in electronic designs.

Minimum Supply Voltage (Vsup): 4.5V

Lower minimum supply voltage increases flexibility in design, allowing operation under a variety of power supply conditions.

Length: 18.1 mm

The length of 18.1 mm is well-aligned with standard PCB footprints, promoting ease of integration.

Temperature Grade: INDUSTRIAL

Industrial temperature grading ensures reliability and functionality in demanding environments, making it a robust choice.

Technology: CMOS

CMOS technology offers low power consumption while maintaining high-speed operation, making it highly efficient.

Parallel or Serial: PARALLEL

Parallel access provides faster data transfer rates, which is crucial for applications requiring high-speed memory.

Terminal Form: GULL WING

Gull wing terminals allow for easy handling and effective soldering, contributing to reliable connections.

Maximum Supply Current: 50 mA

A maximum supply current of 50 mA represents low power consumption, ideal for battery-operated devices.

No. of Words: 32768 words

With 32,768 words of memory, it provides substantial data storage capacity for various applications.

Memory Width: 8

An 8-bit memory width is versatile for processing data in standard applications, making the SRAM suitable for a variety of uses.

Terminal Pitch: 1.27 mm

A 1.27 mm terminal pitch ensures compatibility with most PCB manufacturing processes, simplifying assembly.

No. of Words Code: 32K

The 32K words code signifies adequate memory sizes for many consumer and industrial applications.

Maximum Supply Voltage (Vsup): 5.5V

The maximum supply voltage compliance ensures safe operation under varying power supply conditions.

Memory Density: 262144 bit

With a memory density of 262,144 bits, it provides a compact memory solution for data-intensive applications.

Memory IC Type: NON-VOLATILE SRAM

The non-volatile SRAM type enhances data retention, making it reliable for applications where data integrity is crucial.

Maximum Standby Current: 0.003 Amp

A low maximum standby current is effective in minimizing power consumption during idle periods, ideal for energy-sensitive devices.

Maximum Access Time: 70 ns

A maximum access time of 70 ns enables fast data access, making this SRAM suitable for high-performance applications.

Technical Specifications

SRAM M48Z35Y-70MH6E attributes and parameters. Explore more SRAM devices from STMicroelectronics

Specs

Maximum Access Time:

70 ns

Additional Features:

SNAPHAT BATTERY TO BE ORDERED SEPARATELY

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Length:

18.1 mm

Memory Density:

262144 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

28

No. of Words:

32768 words

No. of Words Code:

32K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

32KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP28,.5

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

PARALLEL

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

3.05 mm

Maximum Standby Current:

.003 Amp

Sub-Category:

SRAMs

Maximum Supply Current:

50 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

8.56 mm

Trade Compliance

M48Z35Y-70MH6E Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.41

SB

8542.32.00.40

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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