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M48Z35AV-10MH1E

STMicroelectronics

M48Z35AV-10MH1E by STMicroelectronics

M48Z35AV-10MH1E by STMicroelectronics is a 32Kx8 non-volatile SRAM with a 3.3V supply, ideal for applications requiring fast data access and reliability. It features asynchronous operation with a max access time of 100 ns and operates b/w 0 °C to 70 °C. This compact, surface-mount device is perfect for commercial electronics needing efficient memory solutions.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,593 parts In-Stock

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2,593

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Vyrian

USA . 1,932 parts In-Stock

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1,932

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Anansix

USA . 1,886 parts In-Stock

1+ parts

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1,886

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Martec Srl

Italy . 302 parts In-Stock

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302

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NAC Semi

USA . 1 parts In-Stock

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1

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 306 parts In-Stock

1+ parts

$2.051

100+ parts

-

1k+ parts

$1.846

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306

$2.051

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$1.846

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MKK Technologies

India . 2,362 parts In-Stock

1+ parts

$3.856

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2,362

$3.856

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DigiPath Technology Company

USA . 2,362 parts In-Stock

1+ parts

$3.856

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2,362

$3.856

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Microchip USA

USA . 336 parts In-Stock

1+ parts

$5.829

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336

$5.829

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AZTECH Wire

Italy . 630 parts In-Stock

1+ parts

$22.120

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630

$22.120

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Kepictronics

USA . 5,500 parts In-Stock

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5,500

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Corphita

USA . 2,779 parts In-Stock

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2,779

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Parana Technologies

USA . 387 parts In-Stock

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$2.452

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387

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$2.452

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Perfect Parts

USA . 338 parts In-Stock

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338

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Overview

Unlock unparalleled performance with the M48Z35AV-10MH1E from STMicroelectronics, a leader in innovative semiconductor solutions. This high-quality non-volatile SRAM offers exceptional reliability and efficiency for a range of applications, from industrial automation to consumer electronics. With its compact design and low power consumption, you gain faster access to critical data while optimizing space and energy use. Trust in STMicroelectronics' legacy of excellence to elevate your projects!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material enhances the product's resistance to environmental factors, making it reliable for various applications.

Surface Mount: YES

Surface mount technology allows for compact designs and easy assembly, making this SRAM suitable for space-constrained applications.

Package Shape: RECTANGULAR

The rectangular shape optimizes space on the PCB, facilitating better layout options in electronic designs.

Operating Mode: ASYNCHRONOUS

Asynchronous operation ensures quick data access without clock synchronization, making this SRAM ideal for high-speed applications.

Nominal Supply Voltage / Vsup (V): 3.3

A nominal supply voltage of 3.3V balances power efficiency and performance, suitable for modern electronic circuits.

Power Supplies (V): 3.3

Compatibility with a standard power supply simplifies integration into existing designs.

No. of Terminals: 28

A 28-terminal design offers adequate connectivity options for multiple functionalities in different configurations.

Package Style (Meter): SMALL OUTLINE

Small outline package style enhances thermal performance and is ideal for high-density PCB designs.

Maximum Operating Temperature: 70 °C

A maximum operating temperature of 70 °C ensures reliable operation in typical commercial environments.

Organization: 32KX8

32Kx8 organization provides a good balance between density and access time, making it versatile for various applications.

Minimum Operating Temperature: 0 °C

With a minimum operating temperature of 0 °C, this SRAM is suitable for standard room-temperature applications.

Terminal Finish: TIN

A tin terminal finish ensures good solderability and long-term reliability in various operating conditions.

Terminal Position: DUAL

Dual-terminal positioning allows for flexible layout designs on PCBs, enhancing versatility in application.

Maximum Seated Height: 3.05 mm

A maximum seated height of 3.05 mm ensures compatibility with low-profile PCB designs.

Width: 8.56 mm

This width facilitates space-efficient designs, making it easier to integrate into densely packed systems.

Minimum Supply Voltage (Vsup): 3 V

The minimum supply voltage of 3 V allows for a broader range of operating conditions, enhancing flexibility.

Length: 18.1 mm

A compact length of 18.1 mm supports space-saving PCB layouts while maintaining functionality.

Temperature Grade: COMMERCIAL

Commercial temperature grading makes this SRAM suitable for a wide range of consumer and industrial applications.

Technology: CMOS

Utilizing CMOS technology ensures low power consumption and high speed, enhancing overall performance.

Parallel or Serial: PARALLEL

The parallel interface allows for faster data access and throughput, making it ideal for performance-critical applications.

Terminal Form: GULL WING

Gull wing terminals facilitate easier soldering and enhance mechanical strength in solder joints, contributing to reliability.

Maximum Supply Current: 50 mA

A maximum supply current of 50 mA supports robust performance while maintaining energy efficiency.

No. of Words: 32768 words

Providing 32,768 words of storage capacity is ideal for many applications, balancing performance and storage needs.

Memory Width: 8

An 8-bit memory width enhances versatility for various embedded system architectures.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch is standard for many applications, simplifying integration and assembly.

No. of Words Code: 32K

32K words coding capacity ensures adequate data storage for numerous electronic applications.

Moisture Sensitivity Level (MSL): 3

An MSL of 3 indicates moderate humidity sensitivity, guiding proper handling and storage procedures.

Maximum Supply Voltage (Vsup): 3.6 V

A maximum supply voltage of 3.6 V offers flexibility in power supply design options for various applications.

Memory Density: 262144 bit

With a memory density of 262,144 bits, this SRAM provides ample capacity for complex computations and data handling.

Memory IC Type: NON-VOLATILE SRAM

As a non-volatile SRAM, it ensures data retention even when power is removed, offering reliability for critical applications.

Maximum Standby Current: 0.003 Amp

A low standby current aids power conservation, making it suitable for battery-operated devices.

Maximum Access Time: 100 ns

With a maximum access time of 100 ns, this SRAM ensures rapid data transactions, enhancing overall system performance.

Technical Specifications

SRAM M48Z35AV-10MH1E attributes and parameters. Explore more SRAM devices from STMicroelectronics

Specs

Maximum Access Time:

100 ns

Additional Features:

SNAPHAT BATTERY TO BE ORDERED SEPARATELY

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e3

Length:

18.1 mm

Memory Density:

262144 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

28

No. of Words:

32768 words

No. of Words Code:

32K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

32KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP28,.5

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

PARALLEL

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

3.05 mm

Maximum Standby Current:

.003 Amp

Sub-Category:

SRAMs

Maximum Supply Current:

50 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

8.56 mm

Trade Compliance

M48Z35AV-10MH1E Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.41

SB

8542.32.00.40

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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