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M29W040B70N1

STMicroelectronics

M29W040B70N1 by STMicroelectronics

M29W040B70N1 from STMicroelectronics is a 4Mb NOR Flash memory with a 3.3V supply, featuring an asynchronous operating mode and a max access time of 70 ns. It supports up to 100K write/erase cycles, making it ideal for embedded applications. Its compact SOIC package ensures efficient space utilization in electronic designs.

Median Price

$3.820

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

NAC Semi

USA . 1,711 parts In-Stock

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$3.820

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J2 Sourcing AB

Sweden . 3,450 parts In-Stock

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Vyrian

USA . 3,220 parts In-Stock

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Anansix

USA . 1,333 parts In-Stock

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1,333

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Digiode

USA . 605 parts In-Stock

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SPM Sales

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Semtec, LLC

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Velocity Electronics

USA . 3 parts In-Stock

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 791 parts In-Stock

1+ parts

$1.855

100+ parts

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$1.669

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791

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$1.669

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MKK Technologies

India . 502 parts In-Stock

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$3.488

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502

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DigiPath Technology Company

USA . 502 parts In-Stock

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AZTECH Wire

Italy . 410 parts In-Stock

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$11.030

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Ampacity Inc.

Singapore . 1,352 parts In-Stock

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$16.000

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Microchip USA

USA . 419 parts In-Stock

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$20.729

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Corphita

USA . 1,883 parts In-Stock

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Assy Fe

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Kepictronics

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Perfect Parts

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Parana Technologies

USA . 91 parts In-Stock

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$2.218

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Overview

Unlock unparalleled performance with the M29W040B70N1 from STMicroelectronics – a trusted leader in flash memory solutions. This high-quality NOR flash memory delivers exceptional speed and reliability, making it ideal for a variety of applications, from consumer electronics to industrial automation. With its compact design and low power consumption, this product not only enhances your devices' efficiency but also ensures long-lasting endurance, providing you with lasting value and peace of mind.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body enhances durability and resistance to environmental factors, making it suitable for various applications.

Surface Mount: YES

Supports efficient space utilization on PCBs, which is crucial for modern compact electronic designs.

Package Shape: RECTANGULAR

The rectangular shape facilitates easy integration into standard layouts, enhancing mounting efficiency.

Operating Mode: ASYNCHRONOUS

Asynchronous operations improve access times, contributing to higher speeds for data transactions.

Nominal Supply Voltage / Vsup (V): 3.3

A nominal voltage of 3.3V aligns with typical logic levels in modern circuits, ensuring compatibility.

Power Supplies (V): 3/3.3

Supports dual supply voltage, offering flexibility for various system designs.

No. of Terminals: 32

With 32 terminals, it provides ample connectivity options for robust integration into electronic systems.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE

The small outline and thin profile are ideal for dense circuit boards, maximizing space and efficiency.

Maximum Operating Temperature: 70 °C

A maximum operating temperature of 70 °C ensures reliable performance in standard commercial applications.

Organization: 512KX8

Organized as 512KX8, it offers a balanced performance suitable for a variety of applications requiring flash memory.

Minimum Operating Temperature: 0 °C

Operates effectively in a wide range of temperatures, enabling its use in diverse environments.

No. of Sectors/Size: 8

Dividing memory into 8 sectors enhances data management flexibility and improves performance for different applications.

Terminal Finish: TIN LEAD

Tin-lead finish provides better solderability and reliability during assembly processes.

Terminal Position: DUAL

Dual terminal positioning allows for more effective routing on circuit boards.

Maximum Seated Height: 1.2 mm

A low seated height contributes to reduced profile designs, essential for compact electronic devices.

Width: 8 mm

A width of 8 mm keeps the component compact, making it suitable for space-constrained applications.

Minimum Supply Voltage (Vsup): 2.7 V

Supports a lower supply voltage, which is beneficial for power-sensitive applications.

Type: NOR TYPE

NOR type offers fast random access capabilities, suitable for applications requiring quick data access.

Length: 18.4 mm

Its length of 18.4 mm strikes a balance between size and performance, maintaining compatibility with various PCB layouts.

Programming Voltage (V): 2.7

A programming voltage of 2.7V enhances compatibility with low-voltage operations, promoting energy efficiency.

Temperature Grade: COMMERCIAL

Commercial temperature grade ensures it can function in a variety of typical environmental conditions.

Technology: CMOS

CMOS technology provides lower power consumption, making it energy-efficient for battery-powered devices.

Parallel or Serial: PARALLEL

Parallel interface allows for faster data transfer rates, improving overall system performance.

Terminal Form: GULL WING

Gull wing leads are ideal for surface mount applications, enhancing soldering reliability.

Sector Size (Words): 64K

A sector size of 64K allows for efficient memory management and quick access to data.

Maximum Supply Current: 20 mA

With a maximum supply current of 20 mA, it minimizes power consumption, suitable for energy-efficient designs.

No. of Words: 524288 words

Providing 524288 words ensures ample storage for applications ranging from simple to complex data storage needs.

Toggle Bit: YES

The inclusion of a toggle bit enhances the reliability of data operations by ensuring accurate data status monitoring.

Memory Width: 8

The 8-bit memory width allows for simple integration into standard data bus architectures.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5 mm is commonly used in compact designs, facilitating dense packing and performance.

No. of Words Code: 512K

512K words of code memory is sufficient for embedded applications, allowing for extensive program storage.

Command User Interface: YES

A command user interface simplifies control and integration into various systems, enhancing usability.

Maximum Supply Voltage (Vsup): 3.6 V

The maximum supply voltage of 3.6V allows compatibility with a wide range of circuits and systems.

Endurance: 100000 Write/Erase Cycles

An endurance of 100,000 write/erase cycles ensures longevity and reliability in data storage applications.

Memory Density: 4194304 bit

The high memory density of 4194304 bits supports complex applications requiring substantial storage capacity.

Memory IC Type: FLASH

Flash memory type indicates non-volatile storage ability, retaining data even when power is off.

Maximum Standby Current: 0.0001 Amp

Minimal standby current of 0.0001 amp ensures energy efficiency, especially important for battery-operated devices.

Maximum Access Time: 70 ns

A maximum access time of 70 ns supports high-speed data retrieval, enhancing system responsiveness.

Data Polling: YES

Data polling feature allows for efficient data transfer control and ensures data integrity during operations.

Technical Specifications

Flash Memory M29W040B70N1 attributes and parameters. Explore more Flash Memory devices from STMicroelectronics

Specs

Maximum Access Time:

70 ns

Command User Interface:

YES

Data Polling:

YES

Endurance:

100000 Write/Erase Cycles

JESD-30 Code:

R-PDSO-G32

JESD-609 Code:

e0

Length:

18.4 mm

Memory Density:

4194304 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Sectors/Size:

8

No. of Terminals:

32

No. of Words:

524288 words

No. of Words Code:

512K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

512KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP32,.8,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE

Parallel or Serial:

PARALLEL

Power Supplies (V):

3/3.3

Programming Voltage (V):

2.7

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sector Size (Words):

64K

Maximum Standby Current:

.0001 Amp

Sub-Category:

Flash Memories

Maximum Supply Current:

20 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Toggle Bit:

YES

Type:

NOR TYPE

Width:

8 mm

Trade Compliance

M29W040B70N1 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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