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M29F800DB55N1

STMicroelectronics

M29F800DB55N1 by STMicroelectronics

M29F800DB55N1 from STMicroelectronics is a 5V NOR Flash memory with a density of 8Mbit and an access time of 55ns. It features a compact SOIC package, operates asynchronously, and supports data polling for efficient programming. Ideal for embedded applications requiring reliable storage.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,908 parts In-Stock

1+ parts

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2,908

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Anansix

USA . 2,105 parts In-Stock

1+ parts

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2,105

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Digiode

USA . 1,683 parts In-Stock

1+ parts

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1,683

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,970 parts In-Stock

1+ parts

$4.674

100+ parts

-

1k+ parts

$4.206

10k+ parts

-

1,970

$4.674

-

$4.206

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MKK Technologies

India . 1,456 parts In-Stock

1+ parts

$8.788

100+ parts

-

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1,456

$8.788

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DigiPath Technology Company

USA . 1,456 parts In-Stock

1+ parts

$8.788

100+ parts

-

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-

10k+ parts

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1,456

$8.788

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AZTECH Wire

Italy . 1,020 parts In-Stock

1+ parts

$12.640

100+ parts

-

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1,020

$12.640

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Component Stockers USA

USA . 209 parts In-Stock

1+ parts

$99.990

100+ parts

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209

$99.990

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Corphita

USA . 3,665 parts In-Stock

1+ parts

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3,665

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Parana Technologies

USA . 821 parts In-Stock

1+ parts

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$5.588

1k+ parts

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821

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$5.588

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Microchip USA

USA . 441 parts In-Stock

1+ parts

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441

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Overview

Elevate your designs with the M29F800DB55N1 Flash Memory from STMicroelectronics, a trusted leader in innovative technology. This high-performance NOR flash memory ensures reliability and efficiency, perfect for applications ranging from consumer electronics to automotive systems. With its compact, surface-mount design and robust operating range, it delivers exceptional value and speed, empowering engineers to create cutting-edge solutions that stand the test of time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and protection against environmental factors, making this flash memory reliable for various applications.

Surface Mount: YES

Surface mount technology allows for a compact design, enabling higher density in circuit layouts and easier integration into modern electronic devices.

Package Shape: RECTANGULAR

The rectangular package shape optimizes space on the PCB, improving overall design efficiency.

Operating Mode: ASYNCHRONOUS

Asynchronous operation ensures faster access times and more flexible integration with different processors.

Nominal Supply Voltage / Vsup (V): 5

Operates efficiently at a standard supply voltage of 5V, making it suitable for a wide range of electronic devices.

Power Supplies (V): 5

Single voltage power supply simplifies circuit design, reducing component count and increasing reliability.

No. of Terminals: 48

A higher number of terminals allows for better connectivity and more functions in a single chip.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE

The small outline and thin profile make it ideal for space-constrained applications, ensuring seamless integration.

Alternate Memory Width: 8

An alternate memory width provides flexibility for various applications, catering to different design requirements.

Maximum Operating Temperature: 70 °C

A maximum operating temperature of 70 °C ensures reliability in various environments, making it suitable for industrial applications.

Organization: 512KX16

The organization supports 16-bit data bus width, optimizing data transfer rates and performance for high-speed applications.

Minimum Operating Temperature: 0 °C

Can function in environments as cold as 0 °C, enhancing usability in diverse climatic conditions.

No. of Sectors/Size: 1,2,1,15

Flexible sector sizing allows for efficient data management and storage, improving application versatility.

Terminal Finish: TIN LEAD

TIN LEAD terminal finish ensures good solderability and reliable metal-to-metal connections.

Terminal Position: DUAL

Dual terminal position allows for more versatile mounting options on the PCB.

Maximum Seated Height: 1.2 mm

A low seated height enhances compatibility with various mounting technologies while saving space.

Width: 12 mm

Compact width supports space optimization on circuit boards, essential for today's smaller electronic devices.

Minimum Supply Voltage (Vsup): 4.5 V

A low minimum supply voltage makes it viable for battery-operated devices and energy-efficient applications.

Type: NOR TYPE

NOR type flash memories are known for fast read speeds and reliable performance, making them ideal for code storage.

Common Flash Interface: YES

Compatibility with common flash interfaces facilitates easier integration and widespread usage across numerous platforms.

Length: 18.4 mm

The compact length is conducive for integration in tight spaces, crucial for advanced electronic devices.

Programming Voltage (V): 5

Standard programming voltage of 5V simplifies design and reduces complexity in circuit boards.

Temperature Grade: COMMERCIAL

Commercial temperature grade assures reliable performance in general applications, catering to a wide market.

Technology: CMOS

CMOS technology enhances power efficiency and performance, making the chip suitable for modern high-speed applications.

Parallel or Serial: PARALLEL

Supports parallel connections, improving data transfer rates and efficiency compared to serial configurations.

Terminal Form: GULL WING

Gull wing terminals provide enhanced stability and ease of soldering, ensuring reliable circuit connections.

Sector Size (Words): 16K,8K,32K,64K

Variety of sector sizes improves data management capabilities, lending flexibility for different application needs.

Maximum Supply Current: 20 mA

Low maximum supply current supports power efficiency, suitable for battery-operated designs.

No. of Words: 524288 words

Significant word count allows for ample storage capacity, accommodating larger applications.

Toggle Bit: YES

Toggle bit functionality enhances the efficiency of read and write operations, improving performance.

Memory Width: 16

16-bit memory width allows for optimized data transfer and processing within various applications.

Terminal Pitch: 0.5 mm

Fine terminal pitch enables high density and space-saving PCB design, crucial for contemporary electronics.

No. of Words Code: 512K

512K words of code storage provides sufficient capacity for various embedded applications, making it highly versatile.

Command User Interface: YES

User interface support facilitates easier access and manipulation of the memory, enhancing usability for developers.

Ready or Busy: YES

The ready/busy signal feature allows for efficient data processing by precisely indicating when the memory is ready for the next operation.

Maximum Supply Voltage (Vsup): 5.5 V

Allows for flexible power supply options while maintaining performance and reliability.

Boot Block: BOTTOM

Boot block configuration allows for secure storage and quick access to essential boot code, crucial for system reliability.

Memory Density: 8388608 bit

High memory density supports complex applications, offering ample storage capability for program code and data.

Memory IC Type: FLASH

Flash memory type is non-volatile and ideal for applications requiring data retention without power.

Maximum Standby Current: 0.00015 Amp

Extremely low standby current enhances energy efficiency, making this memory suitable for low-power applications.

Maximum Access Time: 55 ns

Fast access time ensures efficient data retrieval and operation, essential for high-speed applications.

Data Polling: YES

Data polling capability increases reliability in data retrieval processes, ensuring consistency and performance.

Technical Specifications

Flash Memory M29F800DB55N1 attributes and parameters. Explore more Flash Memory devices from STMicroelectronics

Specs

Maximum Access Time:

55 ns

Additional Features:

BOTTOM BOOT BLOCK

Alternate Memory Width:

8

Boot Block:

BOTTOM

Command User Interface:

YES

Common Flash Interface:

YES

Data Polling:

YES

JESD-30 Code:

R-PDSO-G48

JESD-609 Code:

e0

Length:

18.4 mm

Memory Density:

8388608 bit

Memory IC Type:

Memory Width:

16

No. of Functions:

1

No. of Sectors/Size:

1,2,1,15

No. of Terminals:

48

No. of Words:

524288 words

No. of Words Code:

512K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

512KX16

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP48,.8,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE

Parallel or Serial:

PARALLEL

Power Supplies (V):

5

Programming Voltage (V):

5

Qualification:

Not Qualified

Ready or Busy:

YES

Maximum Seated Height:

1.2 mm

Sector Size (Words):

16K,8K,32K,64K

Maximum Standby Current:

.00015 Amp

Sub-Category:

Flash Memories

Maximum Supply Current:

20 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Toggle Bit:

YES

Type:

NOR TYPE

Width:

12 mm

Trade Compliance

M29F800DB55N1 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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