Loading...

M29F400BT70N6E

STMicroelectronics

M29F400BT70N6E by STMicroelectronics

M29F400BT70N6E from STMicroelectronics is a 5V NOR Flash memory with a 256Kx16 organization, ideal for industrial applications. It features a max access time of 70 ns and supports up to 100k write/erase cycles. Its compact SOIC package ensures efficient surface mounting.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip Stock

USA . 22,800 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

22,800

-

-

-

-

Vyrian

USA . 4,628 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,628

-

-

-

-

Anansix

USA . 1,931 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,931

-

-

-

-

Digiode

USA . 1,694 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,694

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,443 parts In-Stock

1+ parts

$3.555

100+ parts

-

1k+ parts

$3.199

10k+ parts

-

1,443

$3.555

-

$3.199

-

MKK Technologies

India . 22 parts In-Stock

1+ parts

$6.685

100+ parts

-

1k+ parts

-

10k+ parts

-

22

$6.685

-

-

-

DigiPath Technology Company

USA . 22 parts In-Stock

1+ parts

$6.685

100+ parts

-

1k+ parts

-

10k+ parts

-

22

$6.685

-

-

-

AZTECH Wire

Italy . 721 parts In-Stock

1+ parts

$15.620

100+ parts

-

1k+ parts

-

10k+ parts

-

721

$15.620

-

-

-

Component Stockers USA

USA . 345 parts In-Stock

1+ parts

$99.990

100+ parts

-

1k+ parts

-

10k+ parts

-

345

$99.990

-

-

-

A-Z Elektronik GmbH

Germany . 5,117 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,117

-

-

-

-

Microchip USA

USA . 4,195 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,195

-

-

-

-

Authorized Procurement Solutions

USA . 4,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,000

-

-

-

-

Kepictronics

USA . 3,767 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,767

-

-

-

-

Corphita

USA . 3,669 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,669

-

-

-

-

Alle Elektronik GmbH

Germany . 3,411 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,411

-

-

-

-

Parana Technologies

USA . 1,596 parts In-Stock

1+ parts

-

100+ parts

$4.250

1k+ parts

-

10k+ parts

-

1,596

-

$4.250

-

-

Overview

Unlock a world of innovation with the M29F400BT70N6E Flash Memory from STMicroelectronics. Renowned for their quality and reliability, STMicroelectronics delivers unmatched performance in a compact design, perfect for a variety of applications—from industrial automation to consumer electronics. With exceptional endurance and rapid access times, this memory solution ensures your projects run smoothly and efficiently, maximizing value and driving success. Elevate your designs today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable construction ensures reliability and protection from environmental factors.

Surface Mount: YES

Facilitates compact design and easy integration into modern electronics.

Package Shape: RECTANGULAR

Standard shape for easy compatibility with various designs and PCB layouts.

Operating Mode: ASYNCHRONOUS

Allows for independent operation, enhancing performance in high-speed applications.

Nominal Supply Voltage / Vsup: 5 V

Common supply voltage ensures easy integration with existing systems.

Power Supplies (V): 5

Standard power supply requirements make it a versatile choice for many applications.

No. of Terminals: 48

Provides ample connections for complex circuit integration and functionality.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Space-efficient design ideal for compact devices where size is a critical factor.

Alternate Memory Width: 8

Compatible with various systems, enhancing flexibility and adaptability in applications.

Maximum Operating Temperature: 85 °C

Suitable for industrial applications that experience higher temperatures.

Organization: 256KX16

Efficient memory organization for optimized performance in data storage and retrieval.

Minimum Operating Temperature: -40 °C

Operational in extreme cold, making it suitable for outdoor and harsh environment applications.

No. of Sectors/Size: 1,2,1,7

Allows for flexible memory allocation and management, enhancing usability.

Terminal Position: DUAL

Dual terminal position supports versatile mounting options for diverse applications.

Maximum Seated Height: 1.2 mm

Ultra-thin profile saves space in crowded PCB designs.

Width: 12 mm

Compact width supports space-saving designs in electronic applications.

Minimum Supply Voltage (Vsup): 4.5 V

Wide operational voltage range increases compatibility with various circuitry.

Maximum Time At Peak Reflow Temperature: 40 s

Meets industry standards for soldering processes, ensuring reliability.

Peak Reflow Temperature: 260 °C

High temperature tolerance enables robust assembly processes.

Type: NOR TYPE

Offers fast read speeds and enables random access, making it ideal for specific applications.

Length: 18.4 mm

Compact length allows for ease of fitting in various designs.

Programming Voltage: 5 V

Standard programming voltage simplifies integration with existing systems.

Temperature Grade: INDUSTRIAL

Designed for reliable performance in industrial applications with extended temperature ranges.

Technology: CMOS

Low power consumption and high speed make it ideal for energy-efficient applications.

Parallel or Serial: PARALLEL

Parallel configuration allows for faster data access and processing, improving overall system performance.

Terminal Form: GULL WING

Facilitates better solder joint reliability and easier mounting on PCBs.

Sector Size (Words): 16K, 8K, 32K, 64K

Flexible sector sizing allows for tailored memory management to suit various applications.

Maximum Supply Current: 20 mA

Low current draw enhances energy efficiency in battery-operated devices.

No. of Words: 262144 words

Provides significant storage capacity, suitable for higher data requirements in applications.

Toggle Bit: YES

Allows for easy implementation of status checking, simplifying error handling.

Memory Width: 16

Wide memory interface supports efficient data transfer rates.

Terminal Pitch: 0.5 mm

Fine pitch enables high-density PCB layouts, saving space on the board.

No. of Words Code: 256K

Sufficient capacity for various applications including consumer electronics and industrial controls.

Command User Interface: YES

Enhances usability by providing easy-to-implement command structures for developers.

Ready or Busy: YES

Status signals ease timing and synchronization in multi-device systems.

Maximum Supply Voltage (Vsup): 5.5 V

Flexible voltage tolerance ensures compatibility with a range of power sources.

Endurance: 100000 Write/Erase Cycles

Long endurance makes it reliable for applications with frequent data updates.

Boot Block: TOP

Top boot block configuration supports efficient initialization sequences.

Memory Density: 4194304 bit

High memory density accommodates complex applications requiring substantial data storage.

Memory IC Type: FLASH

Flash memory provides non-volatile data storage, essential for power-sensitive applications.

Maximum Standby Current: 0.0001 Amp

Minimized power consumption during standby enhances battery life in portable devices.

Maximum Access Time: 70 ns

Fast access time improves system performance, especially in time-critical applications.

Data Polling: YES

Data polling feature allows real-time monitoring of memory status, simplifying data integrity checks.

Technical Specifications

Flash Memory M29F400BT70N6E attributes and parameters. Explore more Flash Memory devices from STMicroelectronics

Specs

Maximum Access Time:

70 ns

Additional Features:

TOP BOOT BLOCK

Alternate Memory Width:

8

Boot Block:

TOP

Command User Interface:

YES

Data Polling:

YES

Endurance:

100000 Write/Erase Cycles

JESD-30 Code:

R-PDSO-G48

JESD-609 Code:

e3/e6

Length:

18.4 mm

Memory Density:

4194304 bit

Memory IC Type:

Memory Width:

16

No. of Functions:

1

No. of Sectors/Size:

1,2,1,7

No. of Terminals:

48

No. of Words:

262144 words

No. of Words Code:

256K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

256KX16

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP48,.8,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Programming Voltage (V):

5

Qualification:

Not Qualified

Ready or Busy:

YES

Maximum Seated Height:

1.2 mm

Sector Size (Words):

16K,8K,32K,64K

Maximum Standby Current:

.0001 Amp

Sub-Category:

Flash Memories

Maximum Supply Current:

20 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Toggle Bit:

YES

Type:

NOR TYPE

Width:

12 mm

Trade Compliance

M29F400BT70N6E Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20