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LEOAC14PT-D

STMicroelectronics

LEOAC14PT-D by STMicroelectronics

LEOAC14PT-D by STMicroelectronics is a CMOS logic gate with a 16 ns propagation delay and operates b/w 2-6 V. It features 6 functions, AEC-Q100 screening, and supports high temperatures up to 125 °C. Ideal for automotive applications due to its robust design.

Median Price

$215.950

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 11 parts In-Stock

1+ parts

$211.000

100+ parts

$167.910

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-

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11

$211.000

$167.910

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Arrow

USA . 30 parts In-Stock

1+ parts

$215.950

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30

$215.950

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Verical

USA . 30 parts In-Stock

1+ parts

$215.950

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30

$215.950

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-

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Chip1Stop

Japan . 30 parts In-Stock

1+ parts

$243.000

100+ parts

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30

$243.000

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Digiode

USA . 3,254 parts In-Stock

1+ parts

$187.378

100+ parts

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3,254

$187.378

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Vyrian

USA . 6,014 parts In-Stock

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6,014

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Anansix

USA . 1,964 parts In-Stock

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1,964

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,525 parts In-Stock

1+ parts

$12.742

100+ parts

-

1k+ parts

$11.468

10k+ parts

-

1,525

$12.742

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$11.468

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MKK Technologies

India . 735 parts In-Stock

1+ parts

$23.960

100+ parts

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735

$23.960

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DigiPath Technology Company

USA . 735 parts In-Stock

1+ parts

$23.960

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735

$23.960

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Corphita

USA . 3,336 parts In-Stock

1+ parts

$177.516

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3,336

$177.516

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Parana Technologies

USA . 827 parts In-Stock

1+ parts

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$15.235

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827

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$15.235

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Overview

Elevate your designs with the LEOAC14PT-D from STMicroelectronics, a standout in the world of logic gates. Renowned for its exceptional quality and reliability, STMicroelectronics delivers a product that excels in automotive and industrial applications, ensuring optimal performance even in extreme conditions. With its compact design and efficient functionality, the LEOAC14PT-D offers unparalleled versatility, making it the smart choice for engineers seeking innovation without compromise. Unlock new possibilities today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material contributes to durability and thermal stability, making this product reliable in various environments.

Propagation Delay At Nominal Supply: 16 ns

With a low propagation delay of 16 ns, this logic gate ensures fast signal processing, which is essential for high-speed applications.

Surface Mount: YES

Being a surface mount device (SMD) allows for easier integration into compact electronic circuits, making it ideal for modern, space-constrained designs.

No. of Functions: 6

Having 6 functions in a single chip reduces the need for multiple components, simplifying circuit design and saving space.

Screening Level: AEC-Q100

This AEC-Q100 screening level ensures high reliability and performance in automotive applications, making it suitable for critical systems.

Package Shape: RECTANGULAR

The rectangular package shape offers efficient space utilization on PCBs, facilitating easier layout for designers.

Nominal Supply Voltage / Vsup (V): 3

The nominal supply voltage is standard for many digital circuits, ensuring compatibility with a wide range of applications.

Load Capacitance (CL): 50 pF

A load capacitance of 50 pF indicates good performance with minimal loading effects, allowing for robust integration with other components.

No. of Terminals: 20

With 20 terminals, this logic gate provides ample connectivity options, making it versatile for various circuit topologies.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

This design optimizes space and weight, making the product suitable for compact devices and applications.

Maximum I (ol): 24 Amp

A maximum output current of 24 A represents excellent driving capability, enabling the logic gate to drive larger loads directly.

Propagation Delay (tpd): 16 ns

The repeated specification of a 16 ns propagation delay highlights its consistency, reinforcing reliability in timing-critical applications.

Maximum Operating Temperature: 125 °C

The capability of operating up to 125 °C makes this product suitable for harsh environments commonly found in industrial and automotive sectors.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, the product can function in extreme cold conditions, widening its application range.

Terminal Position: DUAL

The dual terminal position facilitates straightforward PCB routing and layout flexibility for different designs.

Maximum Seated Height: 1.2 mm

A low seated height of 1.2 mm allows for thin-profile installation, which is advantageous for slim devices.

Width: 4.4 mm

A width of 4.4 mm contributes to a compact design, suitable for densely packed boards.

Minimum Supply Voltage (Vsup): 2 V

The minimum supply voltage of 2 V ensures compatibility with low-voltage applications, catering to power-sensitive designs.

Length: 6.5 mm

With a length of 6.5 mm, this chip can easily fit into space-constrained environments while providing functionality.

Total Dose (V): 50k Rad(Si)

Able to withstand a total dose of 50k Rad(Si), this logic gate is suitable for radiation-sensitive applications, such as satellite or aerospace uses.

Schmitt Trigger: YES

Incorporating Schmitt trigger functionality enhances noise immunity and ensures stable transitions, making it ideal for noisy environments.

Technology: CMOS

CMOS technology allows for low power consumption and high density, making this product efficient for modern electronic circuits.

Terminal Form: GULL WING

Gull wing terminals provide excellent soldering reliability and ease of assembly in automated processes.

Packing Method: TR

Using a Tape and Reel (TR) packing method facilitates automated handling and assembly processes for high-volume production.

Terminal Pitch: 0.65 mm

A terminal pitch of 0.65 mm allows for compact designs and efficient use of PCB space, keeping components closely integrated.

Maximum Supply Voltage (Vsup): 6 V

The maximum supply voltage of 6 V makes it versatile for a variety of applications, accommodating higher voltage needs without compromising performance.

Technical Specifications

Logic Gates LEOAC14PT-D attributes and parameters. Explore more Logic Gates devices from STMicroelectronics

Specs

Family:

AC

JESD-30 Code:

R-PDSO-G20

Length:

6.5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

No. of Functions:

6

No. of Inputs:

1

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Propagation Delay At Nominal Supply:

16 ns

Propagation Delay (tpd):

16 ns

Schmitt Trigger:

YES

Screening Level:

AEC-Q100

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Total Dose (V):

50k Rad(Si)

Width:

4.4 mm

Trade Compliance

LEOAC14PT-D Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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