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LEOAC32PT-D

STMicroelectronics

LEOAC32PT-D by STMicroelectronics

LEOAC32PT-D by STMicroelectronics is a CMOS logic gate with a 12 ns propagation delay and operates b/w 2-6 V. It features 4 functions, dual inputs, and supports AEC-Q100 screening for automotive applications. Its compact design ensures efficient performance in space-constrained environments.

Median Price

$223.400

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 20 parts In-Stock

1+ parts

$218.870

100+ parts

$174.720

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20

$218.870

$174.720

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DigiKey

USA . 26 parts In-Stock

1+ parts

$219.240

100+ parts

$174.726

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-

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26

$219.240

$174.726

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Arrow

USA . 30 parts In-Stock

1+ parts

$223.400

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-

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30

$223.400

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Verical

USA . 30 parts In-Stock

1+ parts

$223.400

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30

$223.400

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Chip1Stop

Japan . 30 parts In-Stock

1+ parts

$248.000

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30

$248.000

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Distributors (In-Stock)

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Digiode

USA . 2,448 parts In-Stock

1+ parts

$235.600

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2,448

$235.600

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Anansix

USA . 2,548 parts In-Stock

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2,548

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Vyrian

USA . 2,476 parts In-Stock

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2,476

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 1,804 parts In-Stock

1+ parts

$26.762

100+ parts

-

1k+ parts

$24.086

10k+ parts

-

1,804

$26.762

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$24.086

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MKK Technologies

India . 1,154 parts In-Stock

1+ parts

$50.324

100+ parts

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1,154

$50.324

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DigiPath Technology Company

USA . 1,154 parts In-Stock

1+ parts

$50.324

100+ parts

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1,154

$50.324

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Corphita

USA . 1,308 parts In-Stock

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$223.200

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1,308

$223.200

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Parana Technologies

USA . 711 parts In-Stock

1+ parts

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$31.998

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711

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$31.998

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Overview

Unlock unparalleled performance with the LEOAC32PT-D from STMicroelectronics, a leader in innovative semiconductor solutions. Designed for reliability in demanding environments, this advanced logic gate excels in automotive and industrial applications, ensuring your projects meet the highest quality standards. Experience superior speed and efficiency with quick propagation delays, empowering you to enhance your designs while benefiting from ST's trusted expertise and commitment to excellence. Elevate your projects today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material ensures durability and resistance to environmental factors, making it a reliable choice for various applications.

Propagation Delay At Nominal Supply: 12 ns

A low propagation delay of 12 ns indicates high-speed performance, allowing for faster signal processing in digital circuits.

Surface Mount: YES

Being surface mount compatible allows for easier integration into compact designs, saving space on printed circuit boards.

No. of Functions: 4

With four functions in a single unit, it increases versatility and reduces the number of necessary components for complex logic implementations.

Screening Level: AEC-Q100

This screening level means the product is automotive grade, ensuring it meets rigorous reliability standards for automotive applications.

No. of Inputs: 2

The dual-input configuration provides flexibility for integrating multiple logic functions, suitable for various digital applications.

Package Shape: RECTANGULAR

Rectangular packaging allows for efficient layout design in circuits, optimizing space and routing.

Nominal Supply Voltage / Vsup (V): 3

Operating at a nominal supply voltage of 3V is advantageous for low-power applications, enhancing battery life in portable devices.

Load Capacitance (CL): 50 pF

A load capacitance of 50 pF allows for compatibility with a wide range of circuit designs while minimizing signal distortion.

No. of Terminals: 20

The presence of 20 terminals facilitates multiple connections and greater versatility in circuit integration.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

This package style provides a compact form factor essential for modern electronics where space is a premium.

Maximum I (ol): 24 Amp

A maximum output current of 24 Amps indicates strong drive capabilities, making it suitable for controlling various loads.

Propagation Delay (tpd): 12 ns

Reiterating the excellent propagation delay, it confirms quick response time essential for high-speed digital operations.

Maximum Operating Temperature: 125 °C

Ability to operate at up to 125 °C ensures durability and reliability even in demanding thermal environments.

Minimum Operating Temperature: -40 °C

A low operating temperature of -40 °C allows for deployment in extreme conditions, enhancing application flexibility.

Terminal Position: DUAL

Dual terminal positioning supports easier PCB layout and reduces potential errors during assembly.

Maximum Seated Height: 1.2 mm

A low seated height ensures compatibility with tight spacing in modern electronics, enabling more compact designs.

Width: 4.4 mm

The narrow width allows for denser circuit designs, making the product a practical choice for space-efficient applications.

Minimum Supply Voltage (Vsup): 2 V

Operating down to 2V enhances versatility for low-power designs, making it suitable for energy-efficient applications.

Length: 6.5 mm

The 6.5 mm length contributes to a compact footprint, ideal for modern electronic devices where space is limited.

Total Dose (V): 50k Rad(Si)

A high total dose rating makes this component suitable for use in radiation-prone environments, such as space applications.

Technology: CMOS

Using CMOS technology ensures low power consumption and high noise immunity, making it advantageous for many digital circuits.

Terminal Form: GULL WING

Gull-wing terminals support reliable soldering and easy PCB assembly, enhancing manufacturing efficiency.

Packing Method: TR

The TR packing method is efficient for automated handling and placement, ensuring reliability in the manufacturing process.

Terminal Pitch: 0.65 mm

A terminal pitch of 0.65 mm allows for high density of connections, facilitating compact designs without compromising performance.

Maximum Supply Voltage (Vsup): 6 V

The flexibility of a maximum supply voltage of 6V provides compatibility with a wide range of power supply scenarios.

Technical Specifications

Logic Gates LEOAC32PT-D attributes and parameters. Explore more Logic Gates devices from STMicroelectronics

Specs

Family:

AC

JESD-30 Code:

R-PDSO-G20

Length:

6.5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Propagation Delay At Nominal Supply:

12 ns

Propagation Delay (tpd):

12 ns

Schmitt Trigger:

NO

Screening Level:

AEC-Q100

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Total Dose (V):

50k Rad(Si)

Width:

4.4 mm

Trade Compliance

LEOAC32PT-D Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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