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LEOAC08PT

STMicroelectronics

LEOAC08PT by STMicroelectronics

LEOAC08PT by STMicroelectronics is a CMOS logic gate with a 12.5 ns propagation delay and operates b/w 2-6 V. It features 4 functions, dual inputs, and is AEC-Q100 qualified for automotive applications. Its compact design ensures efficient performance in space-constrained environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,385 parts In-Stock

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Anansix

USA . 2,165 parts In-Stock

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2,165

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Digiode

USA . 1,914 parts In-Stock

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1,914

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 1,907 parts In-Stock

1+ parts

$7.689

100+ parts

-

1k+ parts

$6.920

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1,907

$7.689

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$6.920

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MKK Technologies

India . 1,978 parts In-Stock

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$14.459

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$14.459

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DigiPath Technology Company

USA . 1,978 parts In-Stock

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$14.459

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$14.459

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Corphita

USA . 1,327 parts In-Stock

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1,327

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Parana Technologies

USA . 682 parts In-Stock

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$9.194

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Overview

Elevate your designs with the LEOAC08PT from STMicroelectronics—a trusted leader in semiconductor innovation. This versatile logic gate offers exceptional performance and reliability, perfect for automotive applications requiring AEC-Q100 screening. With a compact design and low propagation delay, it ensures swift signal processing, enhancing overall system efficiency. Choose LEOAC08PT to unlock superior functionality while enjoying the peace of mind that comes from using a top-tier manufacturer.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material ensures durability and resistance to environmental factors, making it suitable for various applications.

Propagation Delay At Nominal Supply: 12.5 ns

A low propagation delay enhances the speed of signal processing, making this logic gate ideal for high-speed applications.

Surface Mount: YES

Surface mount technology allows for compact designs and easy integration into modern circuit boards, saving space.

No. of Functions: 4

Multiple functions in one chip reduce component count, streamlining design and potentially lowering costs.

Screening Level: AEC-Q100

Complies with automotive quality standards, ensuring reliability in critical automotive applications.

No. of Inputs: 2

Dual input capability allows for versatile applications in various logic configurations.

Package Shape: RECTANGULAR

The rectangular shape optimizes board layout options, facilitating efficient use of PCB space.

Nominal Supply Voltage / Vsup (V): 3

Standard operating voltage of 3V aligns with many modern devices, promoting compatibility and efficiency.

Load Capacitance (CL): 50 pF

A manageable load capacitance supports reliable operation in various circuitry while minimizing signal degradation.

No. of Terminals: 20

A higher number of terminals facilitates greater connectivity options, enhancing functionality in complex circuits.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

This compact package style aids in space conservation on PCBs, making it ideal for space-constrained applications.

Maximum I (ol): 24 Amp

High output current capacity permits powering a variety of loads, increasing the versatility of this logic gate.

Propagation Delay (tpd): 12.5 ns

Reiterating low propagation delay emphasizes the speed and efficiency, crucial for fast digital circuits.

Maximum Operating Temperature: 125 °C

A wide operating temperature range enhances reliability in extreme conditions, suitable for industrial applications.

Minimum Operating Temperature: -40 °C

The ability to function at low temperatures increases adaptability to various environmental scenarios.

Terminal Position: DUAL

Dual terminal positioning allows for easy integration into diverse PCB layouts and configurations.

Maximum Seated Height: 1.2 mm

Low seated height favors compact designs and helps maintain low profiles for devices.

Width: 4.4 mm

A narrow width is beneficial for high-density PCB designs, facilitating efficient spatial distribution.

Minimum Supply Voltage (Vsup): 2 V

Compatibility with lower supply voltages enhances efficiency and makes it suitable for battery-operated devices.

Length: 6.5 mm

The short length aids in minimizing space usage on PCBs, crucial for modern electronics.

Total Dose (V): 50k Rad(Si)

High radiation tolerance makes this product suitable for aerospace and medical applications where radiation exposure is a concern.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, promoting energy efficiency and reliability.

Terminal Form: GULL WING

Gull wing terminals enhance solderability and contribute to reliable electrical connections on PCBs.

Packing Method: TR

Tape and reel packaging simplifies handling and automated assembly processes, ensuring efficient production.

Terminal Pitch: 0.65 mm

A smaller terminal pitch allows for denser layouts, optimizing PCB real estate for advanced designs.

Maximum Supply Voltage (Vsup): 6 V

The capability to operate at a higher voltage provides flexibility in various applications and designs.

Technical Specifications

Logic Gates LEOAC08PT attributes and parameters. Explore more Logic Gates devices from STMicroelectronics

Specs

Family:

AC

JESD-30 Code:

R-PDSO-G20

Length:

6.5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Propagation Delay At Nominal Supply:

12.5 ns

Propagation Delay (tpd):

12.5 ns

Schmitt Trigger:

NO

Screening Level:

AEC-Q100

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Total Dose (V):

50k Rad(Si)

Width:

4.4 mm

Trade Compliance

LEOAC08PT Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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