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LEOAC32PT

STMicroelectronics

LEOAC32PT by STMicroelectronics

LEOAC32PT by STMicroelectronics is a CMOS logic gate with a 12 ns propagation delay and operates b/w 2-6 V. It features 4 functions, dual inputs, and is AEC-Q100 certified for automotive applications. Its compact design suits space-constrained environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 4,564 parts In-Stock

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Vyrian

USA . 1,504 parts In-Stock

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1,504

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Anansix

USA . 993 parts In-Stock

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993

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 1,878 parts In-Stock

1+ parts

$11.591

100+ parts

-

1k+ parts

$10.432

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1,878

$11.591

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$10.432

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MKK Technologies

India . 831 parts In-Stock

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$21.796

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831

$21.796

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DigiPath Technology Company

USA . 831 parts In-Stock

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$21.796

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831

$21.796

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Corphita

USA . 1,883 parts In-Stock

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Parana Technologies

USA . 760 parts In-Stock

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$13.859

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760

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Overview

Unlock unparalleled performance with the LEOAC32PT from STMicroelectronics, your trusted partner in cutting-edge logic solutions. Designed for automotive and industrial applications, this high-quality logic gate excels in reliability, ensuring seamless integration into your systems. With its compact design and impressive operating range, it delivers swift responses under challenging conditions. Experience efficiency and innovation that elevate your projects to new heights!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material ensures reliable performance and protection against environmental factors, making it suitable for various applications.

Propagation Delay At Nominal Supply: 12 ns

A low propagation delay allows for faster signal transmission, enhancing the overall speed and efficiency of digital circuits.

Surface Mount: YES

Surface mount capability facilitates compact designs and easier automated assembly, reducing production costs and space required on PCBs.

No. of Functions: 4

With multiple functions integrated within a single package, this product saves space and offers versatility in applications.

Screening Level: AEC-Q100

Compliance with AEC-Q100 suggests high reliability and suitability for automotive applications, ensuring long-term performance under harsh conditions.

No. of Inputs: 2

Having two inputs allows for more complex logic operations within a compact package, enabling efficient circuit design.

Package Shape: RECTANGULAR

The rectangular shape is widely used and compatible with existing PCB layouts, simplifying integration into designs.

Nominal Supply Voltage / Vsup (V): 3

A nominal supply voltage of 3V is common in low-power applications, optimizing energy consumption.

Load Capacitance (CL): 50 pF

A moderate load capacitance allows for stable operation and compatibility with a variety of devices, enhancing circuit performance.

No. of Terminals: 20

20 terminals provide ample connectivity options, allowing versatile integration into different digital circuits.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The thin profile and shrunk pitch enable high-density circuit designs, making this product ideal for space-constrained applications.

Maximum I (ol): 24 Amp

The high output current capability ensures that it can drive loads effectively, making it suitable for a wide range of applications.

Maximum Operating Temperature: 125 °C

A high maximum operating temperature ensures performance stability in demanding environments, enhancing the product's reliability.

Minimum Operating Temperature: -40 °C

The wide temperature range allows this product to operate in extreme conditions, suitable for applications in varying climates.

Terminal Position: DUAL

Dual terminal positions offer flexibility in PCB layout designs and can ease the routing complexity.

Maximum Seated Height: 1.2 mm

A low seated height is advantageous for applications requiring minimal profile components, preserving space on the PCB.

Width: 4.4 mm

The compact width allows for placement in tight layouts, suitable for modern electronic devices.

Minimum Supply Voltage (Vsup): 2 V

The ability to operate at low voltages makes this product energy efficient, ideal for battery-powered applications.

Length: 6.5 mm

The moderate length helps maintain a small footprint on circuit boards without compromising functionality.

Total Dose (V): 50k Rad(Si)

High radiation tolerance makes this product suitable for aerospace and high-radiation applications, ensuring reliability in critical environments.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, making it a preferred choice for modern digital electronics.

Terminal Form: GULL WING

The gull-wing terminal form enhances soldering reliability and PCB mounting stability, making assembly processes more efficient.

Packing Method: TR

Tape and reel packaging facilitates automated assembly processes, reducing manufacturing time and costs.

Terminal Pitch: 0.65 mm

A compact terminal pitch allows for dense layout designs, accommodating more components in smaller PCBs.

Maximum Supply Voltage (Vsup): 6 V

The flexibility to operate at a maximum of 6V allows compatibility with a wider range of applications and devices.

Technical Specifications

Logic Gates LEOAC32PT attributes and parameters. Explore more Logic Gates devices from STMicroelectronics

Specs

Family:

AC

JESD-30 Code:

R-PDSO-G20

Length:

6.5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Propagation Delay At Nominal Supply:

12 ns

Propagation Delay (tpd):

12 ns

Schmitt Trigger:

NO

Screening Level:

AEC-Q100

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Total Dose (V):

50k Rad(Si)

Width:

4.4 mm

Trade Compliance

LEOAC32PT Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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