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LEOAC14PT

STMicroelectronics

LEOAC14PT by STMicroelectronics

LEOAC14PT by STMicroelectronics is a CMOS logic gate with 6 functions, featuring a 16 ns propagation delay and operating b/w 2-6 V. It supports AEC-Q100 screening for automotive applications, with a max temp of 125 °C. Ideal for compact designs due to its small outline package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 2,887 parts In-Stock

1+ parts

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2,887

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Digiode

USA . 2,468 parts In-Stock

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2,468

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Vyrian

USA . 747 parts In-Stock

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747

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 48 parts In-Stock

1+ parts

$7.886

100+ parts

-

1k+ parts

$7.098

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48

$7.886

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$7.098

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MKK Technologies

India . 1,745 parts In-Stock

1+ parts

$14.830

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1,745

$14.830

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DigiPath Technology Company

USA . 1,745 parts In-Stock

1+ parts

$14.830

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1,745

$14.830

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Corphita

USA . 3,090 parts In-Stock

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3,090

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Parana Technologies

USA . 125 parts In-Stock

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$9.429

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125

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$9.429

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Overview

Unlock the potential of your designs with the LEOAC14PT from STMicroelectronics—a leader in innovation and quality. This versatile CMOS logic gate offers superior performance in compact applications, ensuring reliability under extreme conditions. With its AEC-Q100 certification, it’s perfect for automotive and industrial uses, supporting seamless integration into your projects. Elevate your development with a trusted partner that delivers excellence, efficiency, and cutting-edge technology!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This durable material ensures reliability and protection against environmental factors, making the component suitable for various applications.

Propagation Delay At Nominal Supply: 16 ns

The short propagation delay allows for fast signal processing, making this logic gate ideal for high-speed digital circuits.

Surface Mount: YES

Surface mount technology allows for compact designs and efficient PCB layout, saving space in electronic applications.

No. of Functions: 6

Offering multiple functions in a single chip increases versatility, reducing the need for additional components in circuit design.

Screening Level: AEC-Q100

Compliance with AEC-Q100 ensures that the device meets automotive standards, enhancing reliability in automotive applications.

Package Shape: RECTANGULAR

The rectangular package shape aids in efficient placement on PCBs, optimizing the assembly process.

Nominal Supply Voltage / Vsup (V): 3

Operating at a nominal voltage of 3V makes it compatible with common low-power applications.

Load Capacitance (CL): 50 pF

The load capacitance is suitable for a variety of logic applications, supporting efficient operations in multiple circuits.

No. of Terminals: 20

The presence of 20 terminals allows for complex connections while maintaining a manageable footprint.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The thin profile and shrink pitch design promote space-saving and high-density layouts on the PCB.

Maximum I (ol): 24 Amp

A high output current rating of 24 Amps enables this product to drive large loads efficiently, making it suitable for power applications.

Propagation Delay (tpd): 16 ns

Reiterating the short propagation delay, this enhances the product's performance in high-speed applications.

Maximum Operating Temperature: 125 °C

With a high operating temperature limit, this logic gate is suitable for use in harsh environments.

Minimum Operating Temperature: -40 °C

This wide temperature range allows the device to function reliably in extreme conditions, suitable for automotive and industrial applications.

Terminal Position: DUAL

Dual terminal positions are ideal for layout flexibility in PCB design.

Maximum Seated Height: 1.2 mm

A low seated height aids in achieving minimal clearance requirements in compact designs.

Width: 4.4 mm

A compact width enhances layout efficiency while providing sufficient connection points.

Minimum Supply Voltage (Vsup): 2 V

Being operational at a low voltage enhances its compatibility with battery-powered devices.

Length: 6.5 mm

A manageable length ensures ease of integration into smaller PCBs.

Total Dose (V): 50k Rad(Si)

This total dose rating indicates high radiation tolerance, which is essential for use in space and nuclear environments.

Schmitt Trigger: YES

The built-in Schmitt trigger function improves noise immunity and signal integrity in digital circuits.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making it suitable for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminals provide easy soldering and enhanced surface contact, improving reliability in connections.

Packing Method: TR

Tape and reel packing ensures easy handling and smooth automated assembly processes.

Terminal Pitch: 0.65 mm

A terminal pitch of 0.65 mm allows for high-density soldering and efficient PCB layout.

Maximum Supply Voltage (Vsup): 6 V

Able to operate at up to 6V makes this component versatile for a wide range of applications.

Technical Specifications

Logic Gates LEOAC14PT attributes and parameters. Explore more Logic Gates devices from STMicroelectronics

Specs

Family:

AC

JESD-30 Code:

R-PDSO-G20

Length:

6.5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

No. of Functions:

6

No. of Inputs:

1

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

NOT SPECIFIED

Propagation Delay At Nominal Supply:

16 ns

Propagation Delay (tpd):

16 ns

Schmitt Trigger:

YES

Screening Level:

AEC-Q100

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Total Dose (V):

50k Rad(Si)

Width:

4.4 mm

Trade Compliance

LEOAC14PT Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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