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L9352

STMicroelectronics

L9352 by STMicroelectronics

L9352 by STMicroelectronics is a versatile peripheral driver with a max supply voltage of 18V, supporting up to 4 functions. It features built-in protections against overcurrent and thermal issues. Ideal for applications requiring efficient MOS technology in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,187 parts In-Stock

1+ parts

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2,187

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Anansix

USA . 1,896 parts In-Stock

1+ parts

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1,896

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Digiode

USA . 539 parts In-Stock

1+ parts

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539

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 197 parts In-Stock

1+ parts

$6.607

100+ parts

-

1k+ parts

$5.947

10k+ parts

-

197

$6.607

-

$5.947

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MKK Technologies

India . 2,111 parts In-Stock

1+ parts

$12.425

100+ parts

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2,111

$12.425

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DigiPath Technology Company

USA . 2,111 parts In-Stock

1+ parts

$12.425

100+ parts

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2,111

$12.425

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Corphita

USA . 596 parts In-Stock

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596

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Parana Technologies

USA . 336 parts In-Stock

1+ parts

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$7.900

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336

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$7.900

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Overview

Unlock unparalleled control with the L9352 from STMicroelectronics, a leader in innovative semiconductor solutions. Designed for versatile peripheral driving, this compact driver excels in efficiency and reliability, featuring built-in protections against overcurrent and thermal issues. Ideal for a variety of applications, it ensures seamless performance while delivering maximum value and peace of mind to customers seeking quality and durability in their electronic designs. Transform your projects with confidence!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and protection against environmental factors, making the product reliable in various applications.

Surface Mount: YES

Surface mount capability facilitates compact design and easy integration into modern electronic systems, ideal for efficient space utilization.

Maximum Supply Voltage: 5.5 V

The maximum supply voltage offers flexibility for various applications, ensuring compatibility with standard low-voltage systems.

No. of Functions: 4

Having multiple functions allows for versatile applications, making this driver suitable for various peripheral devices.

Package Shape: RECTANGULAR

The rectangular package shape is advantageous for efficient PCB layout and optimized space in devices.

Built-in Protections: OVER CURRENT; THERMAL; ZENER CLAMP

Integrated protections enhance reliability and longevity by safeguarding the driver from common electrical issues.

Maximum Supply Voltage-1: 18 V

A higher maximum supply voltage provides additional headroom for use in more demanding applications or where voltage spikes may occur.

Power Supplies (V): 5, 4.8/18

This versatile power supply range allows the driver to function effectively in various circuit environments, catering to different design requirements.

No. of Terminals: 36

The 36 terminals provide numerous connection options, enhancing flexibility for integration with multiple devices.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

The small outline package style enables compact designs, ideal for space-constrained applications, while managing heat effectively.

Minimum Supply Voltage-1: 4.8 V

The minimum supply voltage offers flexibility for use in low-power applications, extending the range of compatible devices.

Minimum Supply Voltage: 4.5 V

Operating down to 4.5 V increases the compatibility with a wide variety of existing systems and peripherals.

Terminal Finish: TIN LEAD

The tin-lead terminal finish ensures reliable solderability, promoting robust electrical connections in various applications.

Terminal Position: DUAL

Dual terminal positioning can simplify layout and connectivity in design, improving ease of use and performance.

Maximum Seated Height: 3.6 mm

A low profile with a maximum seated height of 3.6 mm aids in maintaining a slim design for portable or compact devices.

Width: 11 mm

At 11 mm wide, the product balances performance and compactness, allowing for efficient space utilization on PCB layouts.

Length: 15.9 mm

The 15.9 mm length fits well in a variety of designs, contributing to a streamlined and efficient final product.

Technology: MOS

MOS technology provides high efficiency and fast switching capabilities, making this driver suitable for high-performance applications.

Terminal Form: GULL WING

Gull wing terminal form enhances soldering reliability and provides easier visual inspection for quality assurance.

Nominal Supply Voltage: 5 V

A nominal supply voltage of 5 V aligns with common standards in electronic devices, ensuring compatibility and ease of use.

Turn-on Time: 20 us

Fast turn-on time enhances overall system responsiveness, benefiting applications that require quick electronic switching.

Terminal Pitch: 0.65 mm

The 0.65 mm terminal pitch makes this driver suitable for densely populated PCBs, maximizing functionality without sacrificing space.

Driver No. of Bits: 4

The 4-bit driver capability allows handling of multiple signals simultaneously, ideal for applications requiring parallel processing.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

This type of interface IC design enables flexible integration into various electronic systems, enhancing overall functionality.

Turn-off Time: 30 us

The reasonably quick turn-off time contributes to effective system performance and reliability, making this driver a good choice for dynamic circuits.

Output Current Flow Direction: SINK

The ability to sink output current is beneficial for controlling peripheral devices efficiently, particularly in applications that require low power.

Technical Specifications

Peripheral Drivers L9352 attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

OVER CURRENT; THERMAL; ZENER CLAMP

Driver No. of Bits:

4

JESD-30 Code:

R-PDSO-G36

JESD-609 Code:

e0

Length:

15.9 mm

No. of Functions:

4

No. of Terminals:

36

Output Current Flow Direction:

SINK

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP36,.56

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

Power Supplies (V):

5,4.8/18

Qualification:

Not Qualified

Maximum Seated Height:

3.6 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Maximum Supply Voltage-1:

18 V

Minimum Supply Voltage-1:

4.8 V

Surface Mount:

YES

Technology:

MOS

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Turn-off Time:

30 us

Turn-on Time:

20 us

Width:

11 mm

Trade Compliance

L9352 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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