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L9352B-DIE1

STMicroelectronics

L9352B-DIE1 by STMicroelectronics

L9352B-DIE1 by STMicroelectronics is a versatile peripheral driver with a max supply voltage of 18V and built-in protections against overcurrent and thermal issues. It features 4 functions, operates at nominal 5V, and has fast turn-on/off times of 20µs and 30µs. Ideal for applications requiring reliable buffering or inversion in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,380 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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3,380

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Digiode

USA . 2,192 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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2,192

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Anansix

USA . 91 parts In-Stock

1+ parts

-

100+ parts

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91

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 628 parts In-Stock

1+ parts

$3.259

100+ parts

-

1k+ parts

$2.933

10k+ parts

-

628

$3.259

-

$2.933

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MKK Technologies

India . 269 parts In-Stock

1+ parts

$6.128

100+ parts

-

1k+ parts

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10k+ parts

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269

$6.128

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DigiPath Technology Company

USA . 269 parts In-Stock

1+ parts

$6.128

100+ parts

-

1k+ parts

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269

$6.128

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-

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Corphita

USA . 2,806 parts In-Stock

1+ parts

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2,806

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Parana Technologies

USA . 1,380 parts In-Stock

1+ parts

-

100+ parts

$3.896

1k+ parts

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10k+ parts

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1,380

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$3.896

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Overview

Unlock the potential of your designs with the L9352B-DIE1 from STMicroelectronics, a leader in high-quality semiconductor solutions. This versatile peripheral driver combines robust performance with built-in protections against overcurrent and thermal issues, ensuring reliability in every application. Ideal for automotive, industrial, and consumer electronics, it streamlines your projects while enhancing efficiency and longevity, making it the smart choice for engineers seeking excellence.

Feature Benefit Bullets

Surface Mount: YES

The surface mount design enables compact and efficient PCB layout, making this product ideal for space-sensitive applications.

Maximum Supply Voltage: 5.5 V

A maximum supply voltage of 5.5 V allows for compatibility with a variety of systems while ensuring reliable performance.

No. of Functions: 4

With four functions integrated into a single device, this peripheral driver offers versatility and helps reduce system complexity.

Built-in Protections: OVER CURRENT; THERMAL

The inclusion of over-current and thermal protection safeguards against damage, enhancing reliability and safety in your application.

Maximum Supply Voltage-1: 18 V

The ability to handle up to 18 V broadens the range of applications, allowing use in higher voltage systems without compromising performance.

Package Style (Meter): UNCASED CHIP

The uncased chip packaging is suitable for direct PCB mounting, enabling better heat dissipation and component integration.

Minimum Supply Voltage-1: 4.8 V

A minimum supply voltage of 4.8 V provides flexibility for a wide range of power supply options.

Minimum Supply Voltage: 4.5 V

This low minimum supply voltage ensures that the device can operate efficiently even with limited power supply variability.

Terminal Position: UPPER

Upper terminal position facilitates easier connectivity during assembly, improving manufacturability.

Terminal Form: NO LEAD

The no-lead terminal design minimizes footprint on printed circuit boards, promoting high-density layouts.

Nominal Supply Voltage: 5 V

Operating at a nominal supply voltage of 5 V makes it compatible with many common electronic systems, enhancing usability.

Turn-on Time: 20 us

A quick turn-on time of 20 microseconds ensures fast response in applications requiring rapid switching.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

Being based on buffer or inverter technology, this IC can effectively isolate and drive loads, enhancing overall system robustness.

Turn-off Time: 30 us

The turn-off time of 30 microseconds also contributes to efficient operation, allowing the device to reset quickly for repeated use.

Output Current Flow Direction: SINK

The sink output current configuration is useful for driving loads grounded to the system, simplifying circuit design.

Technical Specifications

Peripheral Drivers L9352B-DIE1 attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

OVER CURRENT; THERMAL

JESD-30 Code:

X-XUUC-N

No. of Functions:

4

Output Current Flow Direction:

SINK

Package Body Material:

UNSPECIFIED

Package Code:

DIE

Package Shape:

Package Style (Meter):

UNCASED CHIP

Qualification:

Not Qualified

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Maximum Supply Voltage-1:

18 V

Minimum Supply Voltage-1:

4.8 V

Surface Mount:

YES

Terminal Form:

Terminal Position:

UPPER

Turn-off Time:

30 us

Turn-on Time:

20 us

Trade Compliance

L9352B-DIE1 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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