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L9352PD

STMicroelectronics

L9352PD by STMicroelectronics

L9352PD by STMicroelectronics is a versatile peripheral driver with a max supply voltage of 18V and built-in protections against overcurrent and thermal issues. It features 4 functions, operates at nominal 5V, and is ideal for driving applications in compact designs. Its small outline package ensures efficient space utilization in electronic circuits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 2,709 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,709

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Vyrian

USA . 1,922 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,922

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Digiode

USA . 470 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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470

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-

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,332 parts In-Stock

1+ parts

$6.427

100+ parts

-

1k+ parts

$5.784

10k+ parts

-

2,332

$6.427

-

$5.784

-

MKK Technologies

India . 404 parts In-Stock

1+ parts

$12.086

100+ parts

-

1k+ parts

-

10k+ parts

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404

$12.086

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-

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DigiPath Technology Company

USA . 404 parts In-Stock

1+ parts

$12.086

100+ parts

-

1k+ parts

-

10k+ parts

-

404

$12.086

-

-

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Corphita

USA . 3,293 parts In-Stock

1+ parts

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100+ parts

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3,293

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-

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Parana Technologies

USA . 99 parts In-Stock

1+ parts

-

100+ parts

$7.685

1k+ parts

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10k+ parts

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99

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$7.685

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Overview

Elevate your projects with the L9352PD from STMicroelectronics, a leader in high-quality semiconductor solutions. This versatile peripheral driver boasts built-in protections against overcurrent and thermal issues, ensuring reliability in demanding applications. With its compact design and efficient power handling, it’s perfect for automotive, industrial, and consumer electronics. Experience unparalleled performance and peace of mind with this robust solution that enhances innovation while delivering exceptional value.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy body material ensures long-lasting performance and resistance to environmental factors.

Surface Mount: YES

Surface mount capability makes this product easy to integrate into modern PCB designs, saving space and increasing assembly efficiency.

Maximum Supply Voltage: 5.5 V

A maximum supply voltage of 5.5 V provides compatibility with a wide range of logic levels, ideal for various applications.

No. of Functions: 4

With four functions, this driver offers versatility and flexibility for various peripheral applications.

Package Shape: RECTANGULAR

The rectangular package shape is optimal for compact layouts and efficient thermal management.

Built-in Protections: OVER CURRENT; THERMAL; ZENER CLAMP

Integrated protections safeguard against overcurrent and thermal issues, enhancing reliability and safety in use.

Maximum Supply Voltage-1: 18 V

Having a higher maximum supply voltage allows for flexibility in using different voltage levels in multiple applications.

Power Supplies (V): 5, 4.8/18

Dual supply options provide design flexibility, catering to diverse requirements across peripheral devices.

No. of Terminals: 36

A total of 36 terminals offers ample connectivity options, suitable for complex and varied circuit designs.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

This package style supports better heat dissipation and efficient PCB layout, crucial for high-performance applications.

Minimum Supply Voltage-1: 4.8 V

The minimum supply voltage of 4.8 V ensures stable operation in lower voltage scenarios, which is essential for battery-operated devices.

Minimum Supply Voltage: 4.5 V

A minimum voltage threshold of 4.5 V accommodates a wide range of power supplies, enhancing compatibility.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides excellent solderability and long-term reliability in connection quality.

Terminal Position: DUAL

The dual terminal position aids in ease of layout and facilitates suitable placement in diverse designs.

Maximum Seated Height: 3.6 mm

A compact seated height is ideal for space-constrained applications, ensuring ease of use without sacrificing performance.

Width: 11 mm

A width of 11 mm strikes a good balance between compact design and functional layout on the PCB.

Length: 15.9 mm

With a length of 15.9 mm, this product is compact enough for tight spaces while providing necessary features.

Terminal Form: GULL WING

The gull wing terminal form enhances soldering reliability and enables efficient automated assembly processes.

Nominal Supply Voltage: 5 V

A nominal supply voltage of 5 V is common in many applications, making this driver a versatile choice for designers.

Turn-on Time: 20 us

A quick turn-on time of 20 microseconds allows for rapid response in time-sensitive applications, improving overall system performance.

Terminal Pitch: 0.65 mm

The 0.65 mm terminal pitch ensures compatibility with various PCB layouts while still fitting within tight spaces.

Driver No. of Bits: 4

The 4-bit driver configuration allows for efficient data transfer and control in applications requiring multiple signals.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

This interface type offers flexibility for designers, accommodating a wide range of applications from simple to complex.

Turn-off Time: 30 us

A turn-off time of 30 microseconds supports quick deactivation in sensitive electronics, maintaining performance integrity.

Output Current Flow Direction: SINK

Output current sinking capability is essential for driving loads in various electronic applications, ensuring effective operation.

Technical Specifications

Peripheral Drivers L9352PD attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

OVER CURRENT; THERMAL; ZENER CLAMP

Driver No. of Bits:

4

JESD-30 Code:

R-PDSO-G36

JESD-609 Code:

e3

Length:

15.9 mm

No. of Functions:

4

No. of Terminals:

36

Output Current Flow Direction:

SINK

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP36,.5

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

Power Supplies (V):

5,4.8/18

Qualification:

Not Qualified

Maximum Seated Height:

3.6 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Maximum Supply Voltage-1:

18 V

Minimum Supply Voltage-1:

4.8 V

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Turn-off Time:

30 us

Turn-on Time:

20 us

Width:

11 mm

Trade Compliance

L9352PD Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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