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L9352B

STMicroelectronics

L9352B by STMicroelectronics

L9352B by STMicroelectronics is a versatile peripheral driver with a max supply voltage of 18V and supports up to 4 functions. It features built-in overcurrent and thermal protections, making it ideal for automotive applications. Its compact design includes 36 terminals in a small outline package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 2,696 parts In-Stock

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2,696

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Vyrian

USA . 519 parts In-Stock

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519

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Anansix

USA . 219 parts In-Stock

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219

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 1,859 parts In-Stock

1+ parts

$8.805

100+ parts

-

1k+ parts

$7.925

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1,859

$8.805

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$7.925

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MKK Technologies

India . 1,184 parts In-Stock

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$16.558

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1,184

$16.558

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DigiPath Technology Company

USA . 1,184 parts In-Stock

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$16.558

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1,184

$16.558

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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2,500

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Corphita

USA . 2,017 parts In-Stock

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2,017

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A-Z Elektronik GmbH

Germany . 1,956 parts In-Stock

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1,956

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Parana Technologies

USA . 1,936 parts In-Stock

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$10.528

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1,936

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$10.528

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Alle Elektronik GmbH

Germany . 1,304 parts In-Stock

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Kepictronics

USA . 521 parts In-Stock

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521

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Overview

Elevate your design with the L9352B from STMicroelectronics, a leader renowned for innovation and quality. This versatile peripheral driver offers robust built-in protections against overcurrent and thermal issues, ensuring optimal performance in various applications—from automotive to industrial automation. With its compact size and reliable functionality, the L9352B not only enhances energy efficiency but also simplifies integration, delivering exceptional value and peace of mind to engineers and developers alike.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material ensures reliable performance and protection against environmental factors.

Surface Mount: YES

Surface mount capability allows for efficient and compact assembly, saving valuable PCB space.

Maximum Supply Voltage: 5.5 V

The versatile maximum supply voltage supports a wide range of applications, enhancing compatibility.

No. of Functions: 4

Multiple functions in a single device streamline design and reduce component count, leading to cost savings and simplicity.

Package Shape: RECTANGULAR

Rectangular package shape optimizes space and fits standard PCB design layouts efficiently.

Built-in Protections: OVER CURRENT; THERMAL

Integrated over current and thermal protections enhance device reliability and prevent damage during operation.

Maximum Supply Voltage-1: 18 V

An expanded supply voltage range allows for versatile application in higher voltage environments.

Power Supplies (V): 5, 4.8/18

The flexible supply voltage options increase the adaptability of this driver in various circuit designs.

No. of Terminals: 36

A higher number of terminals provides versatility in connection options for complex circuit integrations.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

The small outline style with heat sink capability allows for effective thermal management in compact designs.

Minimum Supply Voltage-1: 4.8 V

The minimum supply voltage ensures compatibility with low voltage systems, catering to energy-efficient designs.

Minimum Supply Voltage: 4.5 V

Lowest operational voltage helps to accommodate a broader range of application requirements.

Terminal Position: DUAL

Dual terminal positioning provides flexibility in PCB layout and simplifies routing in compact designs.

Maximum Seated Height: 3.6 mm

A low seated height contributes to a slim profile, making it suitable for space-constrained applications.

Width: 11 mm

The compact width allows for efficient design integration within limited space on circuit boards.

Length: 15.9 mm

Short length aids in layout density, optimizing the use of available PCB area.

Terminal Form: GULL WING

Gull wing terminals offer ease of soldering and enhanced mechanical stability during thermal cycling.

Nominal Supply Voltage: 5 V

The nominal supply voltage is standard for many digital circuits, promoting high compatibility with existing designs.

Turn-on Time: 20 us

Quick turn-on time enhances responsiveness in applications requiring fast switching capabilities.

Terminal Pitch: 0.65 mm

The fine terminal pitch allows for dense circuit layout, facilitating modern, miniature electronics design.

Driver No. of Bits: 4

Four-bit driver capability enables control of multiple outputs from a single device, simplifying circuit complexity.

Nominal Output Peak Current Limit: 5 A

A peak current limit of 5 A allows the driver to handle demanding loads, making it suitable for high-performance applications.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

This specific interface IC type ensures reliable signal integrity and effective peripheral control in various applications.

Turn-off Time: 30 us

Reasonable turn-off time enables effective control in timing-sensitive applications without introducing delay.

Output Current Flow Direction: SINK

The sink current output configuration is essential for interfacing with various loads and provides flexibility in circuit design.

Technical Specifications

Peripheral Drivers L9352B attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

OVER CURRENT; THERMAL

Driver No. of Bits:

4

JESD-30 Code:

R-PDSO-G36

Length:

15.9 mm

No. of Functions:

4

No. of Terminals:

36

Output Current Flow Direction:

SINK

Nominal Output Peak Current Limit:

5 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP36,.56

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5,4.8/18

Qualification:

Not Qualified

Maximum Seated Height:

3.6 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Maximum Supply Voltage-1:

18 V

Minimum Supply Voltage-1:

4.8 V

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Turn-off Time:

30 us

Turn-on Time:

20 us

Width:

11 mm

Trade Compliance

L9352B Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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