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L9350

STMicroelectronics

L9350 by STMicroelectronics

L9350 by STMicroelectronics is a robust peripheral driver designed for automotive applications, operating b/w -40 °C and 125°C. It supports power supplies from 4.5V to 24V and delivers a max output current of 0.55A. Its in-line, zig-zag terminal design ensures reliable performance in demanding environments.

Median Price

$21.000

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DF Sales Co.

USA . 50 parts In-Stock

1+ parts

$21.000

100+ parts

-

1k+ parts

-

10k+ parts

-

50

$21.000

-

-

-

DF Sales Co.

USA . 50 parts In-Stock

1+ parts

$21.000

100+ parts

-

1k+ parts

-

10k+ parts

-

50

$21.000

-

-

-

Anansix

USA . 2,245 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,245

-

-

-

-

Vyrian

USA . 1,563 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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1,563

-

-

-

-

Digiode

USA . 1,404 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,404

-

-

-

-

Electronics Depot

USA . 45 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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45

-

-

-

-

EMSNET

USA . 25 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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25

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-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 443 parts In-Stock

1+ parts

$6.299

100+ parts

-

1k+ parts

$5.669

10k+ parts

-

443

$6.299

-

$5.669

-

MKK Technologies

India . 954 parts In-Stock

1+ parts

$11.845

100+ parts

-

1k+ parts

-

10k+ parts

-

954

$11.845

-

-

-

DigiPath Technology Company

USA . 954 parts In-Stock

1+ parts

$11.845

100+ parts

-

1k+ parts

-

10k+ parts

-

954

$11.845

-

-

-

Corphita

USA . 2,282 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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2,282

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-

-

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Parana Technologies

USA . 1,350 parts In-Stock

1+ parts

-

100+ parts

$7.532

1k+ parts

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10k+ parts

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1,350

-

$7.532

-

-

Assy Fe

Spain . 20 parts In-Stock

1+ parts

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100+ parts

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20

-

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Overview

Unlock the potential of your automotive designs with the L9350 from STMicroelectronics, a trusted leader in cutting-edge technology. This robust peripheral driver excels in delivering reliable performance across diverse applications, ensuring efficiency and longevity even in extreme conditions. With its superior temperature resilience and proven bipolar technology, the L9350 enhances operational integrity while simplifying integration, ultimately driving value and innovation for your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and resistance to environmental factors, making the product suitable for long-term use.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient space utilization on PCBs, facilitating easier design integration.

Power Supplies (V): 4.5/24

The wide voltage range makes this product versatile, compatible with various power supply applications.

No. of Terminals: 5

Having 5 terminals allows for multiple connections, enhancing functionality and integration capabilities.

Package Style (Meter): IN-LINE

Inline package style improves alignment for PCB assembly, ensuring a more reliable connection.

Maximum Operating Temperature: 125 °C

A high maximum operating temperature allows this product to function reliably in demanding environments.

Minimum Operating Temperature: -40 °C

A low minimum operating temperature ensures that the product can perform in cold weather applications.

Terminal Finish: TIN LEAD

The tin-lead terminal finish provides good solderability and resistance to corrosion, ensuring long-lasting connections.

Terminal Position: ZIG-ZAG

The zig-zag terminal position aids in space optimization on circuit boards, enabling compact designs.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, this product meets industry standards required for reliability in vehicles.

Maximum Output Current: 0.55 A

With a maximum output current of 0.55 A, this product is capable of handling moderate loads effectively.

Technology: BIPOLAR

Utilizing bipolar technology allows for efficient signal amplification and improved performance characteristics.

Terminal Form: THROUGH-HOLE

Through-hole terminal form provides robust mechanical connections, enhancing reliability in demanding applications.

Terminal Pitch: 1.7 mm

A terminal pitch of 1.7 mm offers compatibility with various PCB designs while maintaining a compact layout.

Technical Specifications

Peripheral Drivers L9350 attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Driver No. of Bits:

1

JESD-30 Code:

R-PZIP-T5

JESD-609 Code:

e0

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

.55 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

ZIP

Package Equivalence Code:

ZIP5,.15,.2,67TB

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

4.5/24

Qualification:

Not Qualified

Sub-Category:

Peripheral Drivers

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.7 mm

Terminal Position:

ZIG-ZAG

Trade Compliance

L9350 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

6685-99-877-1371, 6685998771371

NIIN

998771371

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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