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HCF4049UM013TR

STMicroelectronics

HCF4049UM013TR by STMicroelectronics

HCF4049UM013TR by STMicroelectronics is a CMOS logic gate with 6 functions, 120 ns propagation delay at 5V. It operates in a temperature range of -55 to 125 °C and has a small outline package style. Ideal for military-grade applications requiring fast signal processing in compact spaces.

Median Price

$5.890

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Master Electronics

USA . 10 parts In-Stock

1+ parts

$5.890

100+ parts

$0.884

1k+ parts

$0.356

10k+ parts

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10

$5.890

$0.884

$0.356

-

Distributors (In-Stock)

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Digiode

USA . 2,229 parts In-Stock

1+ parts

$5.596

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2,229

$5.596

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Zilex Electronics Inc.

Canada . 17,500 parts In-Stock

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17,500

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Vyrian

USA . 11,906 parts In-Stock

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ComSIT Distribution GmbH

Germany . 10,518 parts In-Stock

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Chip Stock

USA . 9,140 parts In-Stock

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9,140

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Beltway Electronics Company

USA . 2,500 parts In-Stock

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2,500

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Bristol Electronics

USA . 2,492 parts In-Stock

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2,492

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Resion

USA . 1,706 parts In-Stock

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1,706

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MISTER SPROCKETS

USA . 1,130 parts In-Stock

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1,130

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Anansix

USA . 1,111 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 530 parts In-Stock

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530

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LWI Electronics Inc

India . 8 parts In-Stock

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8

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Distributors (Availability)

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Native Components

USA . 4 parts In-Stock

1+ parts

$1.613

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4

$1.613

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Northwest PG Solutions

USA . 1,759 parts In-Stock

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$1.774

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1,759

$1.774

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Microchip USA

USA . 297 parts In-Stock

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$3.152

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Corphita

USA . 598 parts In-Stock

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$5.301

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598

$5.301

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AZTECH Wire

Italy . 143 parts In-Stock

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$17.630

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143

$17.630

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IDEA Electronic Components Group

UK . 1,052 parts In-Stock

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$23.212

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$20.890

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1,052

$23.212

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$20.890

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MKK Technologies

India . 558 parts In-Stock

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$43.648

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558

$43.648

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DigiPath Technology Company

USA . 558 parts In-Stock

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$43.648

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558

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Authorized Procurement Solutions

USA . 8,500 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,320 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,213 parts In-Stock

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Parana Technologies

USA . 1,972 parts In-Stock

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$27.753

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Perfect Parts

USA . 1,187 parts In-Stock

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iodParts Technologies Inc.

India . 530 parts In-Stock

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530

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Cyclops Electronics Ltd (Excess)

UK . 530 parts In-Stock

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530

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Glotronic Ltd.

UK . 424 parts In-Stock

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Overview

Unlock the power of advanced logic gates with the HCF4049UM013TR from STMicroelectronics. Designed with precision and expertise, this product offers unparalleled quality and reliability, making it the perfect choice for a wide range of applications. Whether you're working on industrial automation or consumer electronics, this versatile component delivers exceptional performance, efficiency, and value. Trust STMicroelectronics to provide cutting-edge technology that meets your needs and exceeds your expectations. Elevate your projects with the HCF4049UM013TR and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes the product lightweight and cost-effective.

Propagation Delay At Nominal Supply: 120 ns

The low propagation delay ensures fast signal processing, making the product suitable for high-speed applications.

Surface Mount: YES

Being surface mountable allows for efficient and space-saving PCB layout, making it ideal for compact electronic devices.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V makes it compatible with standard electronic systems and power sources.

Technology: CMOS

The use of CMOS technology ensures low power consumption and high noise immunity, making the product energy efficient and reliable.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature allows for reliable performance in harsh environments or under high thermal loads.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature ensures the product can function effectively in cold conditions without any issues.

Technical Specifications

Logic Gates HCF4049UM013TR attributes and parameters. Explore more Logic Gates devices from STMicroelectronics

Specs

Additional Features:

HIGH TO LOW LEVEL TRANSLATOR

Family:

4000/14000/40000

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Moisture Sensitivity Level (MSL):

3

No. of Functions:

6

No. of Inputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/15

Propagation Delay At Nominal Supply:

120 ns

Propagation Delay (tpd):

120 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.75 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

20 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

HCF4049UM013TR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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