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HCF40106M013TR

STMicroelectronics

HCF40106M013TR by STMicroelectronics

HCF40106M013TR by STMicroelectronics is a CMOS logic gate with 6 functions, 280 ns propagation delay at 5V. It features Schmitt Trigger technology, operates in temperatures from -55 to 125 °C, and has a small outline package for surface mount applications.

Median Price

$0.568

Lifecycle Status

Suppliers In-Stock

22

In-Stock Inventory

1k+

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Ozdisan Elektronik

Türkiye . 220 parts In-Stock

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$0.761

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ComSIT Distribution GmbH

Germany . 9,375 parts In-Stock

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Vyrian

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LWI Electronics Inc

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Connector Distribution Corp

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Right Parts Inc.

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Pegasus Components GmbH

Germany . 2,460 parts In-Stock

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Anansix

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QIE Inc.

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Component Sense

UK . 1,778 parts In-Stock

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ACDS - Activité Composants Distribution Service

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Digiode

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Bristol Electronics

USA . 1,178 parts In-Stock

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$0.375

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Dan-Mar Components

USA . 1,178 parts In-Stock

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Atlantic Semiconductor

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Elcom Components

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Prism Electronics

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Inventory MP

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Avant Electronics Limited

UK . 12 parts In-Stock

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LittleDiode

UK . 1 parts In-Stock

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Native Components

USA . 409 parts In-Stock

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$0.322

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$0.309

409

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Northwest PG Solutions

USA . 1,154 parts In-Stock

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$0.354

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$0.312

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Microchip USA

USA . 307 parts In-Stock

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$3.361

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IDEA Electronic Components Group

UK . 1,836 parts In-Stock

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$12.098

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$10.888

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Advanced Electronics

New Zealand . 60 parts In-Stock

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$13.006

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$11.835

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$10.665

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AZTECH Wire

Italy . 917 parts In-Stock

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MKK Technologies

India . 1,641 parts In-Stock

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DigiPath Technology Company

USA . 1,641 parts In-Stock

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Component Stockers USA

USA . 229 parts In-Stock

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Perfect Parts

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S.R.D Solutions

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Kepictronics

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Corphita

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A-Z Elektronik GmbH

Germany . 2,393 parts In-Stock

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Parana Technologies

USA . 2,286 parts In-Stock

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Alle Elektronik GmbH

Germany . 1,595 parts In-Stock

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Authorized Procurement Solutions

USA . 756 parts In-Stock

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GreenTree Electronics

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Assy Fe

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Overview

Unlock the power of logic gates with the HCF40106M013TR from STMicroelectronics. With a reputation for high-quality manufacturing, this product offers customers reliability and performance. Ideal for applications requiring precision and speed, this logic gate provides value by enhancing efficiency and functionality. Whether you're working on industrial automation or consumer electronics, this versatile component is sure to meet your needs. Trust STMicroelectronics to deliver cutting-edge solutions for all your electronic projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, making it suitable for various applications.

Propagation Delay at Nominal Supply: 280 ns

The low propagation delay ensures fast signal processing, making the product efficient for time-sensitive applications.

Surface Mount: YES

Being surface mountable saves space and allows for easier integration into circuit boards.

Nominal Supply Voltage (Vsup): 5V

Operates at a commonly used supply voltage, making it compatible with a wide range of systems.

Temperature Grade: MILITARY

The military-grade temperature range ensures the product can withstand harsh environmental conditions, making it suitable for rugged applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable.

Technical Specifications

Logic Gates HCF40106M013TR attributes and parameters. Explore more Logic Gates devices from STMicroelectronics

Specs

Family:

4000/14000/40000

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

8.65 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

6

No. of Inputs:

1

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5/15

Propagation Delay At Nominal Supply:

280 ns

Propagation Delay (tpd):

280 ns

Qualification:

Not Qualified

Schmitt Trigger:

YES

Maximum Seated Height:

1.75 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

20 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

3.9 mm

Trade Compliance

HCF40106M013TR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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