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BYV52-200FSY1

STMicroelectronics

BYV52-200FSY1 by STMicroelectronics

BYV52-200FSY1 by STMicroelectronics is a fast recovery rectifier diode designed for high-performance applications. It features a max repetitive peak reverse voltage of 200 V, a non-repetitive forward current of 400 A, and operates up to 150 °C. Its metal flange mount design ensures reliable performance in demanding environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,228 parts In-Stock

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3,228

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Anansix

USA . 2,583 parts In-Stock

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2,583

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Vyrian

USA . 67 parts In-Stock

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67

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 2,250 parts In-Stock

1+ parts

$0.035

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-

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$0.031

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2,250

$0.035

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$0.031

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Native Components

USA . 998 parts In-Stock

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$0.048

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$0.046

998

$0.048

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$0.046

MKK Technologies

India . 62 parts In-Stock

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$0.066

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62

$0.066

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DigiPath Technology Company

USA . 62 parts In-Stock

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$0.066

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62

$0.066

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Corphita

USA . 3,779 parts In-Stock

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3,779

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Northwest PG Solutions

USA . 2,068 parts In-Stock

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Parana Technologies

USA . 1,590 parts In-Stock

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$0.042

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1,590

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$0.042

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Overview

Elevate your designs with the BYV52-200FSY1 from STMicroelectronics—a pinnacle of quality and reliability in fast recovery rectifier diodes. Renowned for their innovative engineering, STMicroelectronics ensures exceptional performance under demanding conditions. With its robust construction and efficient thermal management, this diode excels in industrial applications, delivering superior power handling and durability that enhance your systems' efficiency and longevity. Make a smart investment in performance!

Feature Benefit Bullets

Package Body Material: METAL

The metal package body provides excellent durability and thermal conductivity, ensuring reliable performance in demanding environments.

Config: SINGLE

A single configuration makes this diode easy to integrate into various circuit designs, simplifying layout and assembly.

Package Shape: SQUARE

The square shape allows for efficient space utilization on PCBs, making it ideal for compact applications.

No. of Terminals: 3

Having three terminals provides flexibility for various connections and enhances the reliability of the soldering joints.

Package Style (Meter): FLANGE MOUNT

The flange mount style offers a secure and stable installation, which is advantageous for high-power applications.

Application: FAST RECOVERY

Fast recovery capability reduces switching losses, making this diode suitable for high-frequency applications.

Maximum Operating Temperature: 150 °C

An operating temperature of 150 °C ensures this diode can function in high-temperature environments, enhancing its versatility.

Terminal Finish: GOLD

Gold plating on terminals provides superior corrosion resistance and ensures reliable electrical contact over time.

Terminal Position: SINGLE

Single terminal position simplifies the design and installation process, reducing potential errors during assembly.

Diode Type: RECTIFIER DIODE

As a rectifier diode, it is specifically designed to convert alternating current (AC) to direct current (DC), making it essential for power supplies.

Terminal Form: PIN/PEG

The pin/peg terminal form allows for easy and robust mounting into a PCB, ensuring a stable connection.

Maximum Repetitive Peak Reverse Voltage: 200 V

With a peak reverse voltage of 200V, this diode is suitable for various applications requiring high voltage ratings.

Maximum Non Repetitive Peak Forward Current: 400 A

A maximum forward current of 400A guarantees that this diode can handle substantial current loads, making it suitable for heavy-duty applications.

Diode Element Material: SILICON

Silicon as a diode element material provides excellent efficiency and reliability, making this product a solid choice for engineers.

Technical Specifications

Diodes & Rectifiers BYV52-200FSY1 attributes and parameters. Explore more Diodes & Rectifiers devices from STMicroelectronics

Specs

Application:

FAST RECOVERY

Config:

SINGLE

Diode Element Material:

SILICON

Diode Type:

JEDEC-95 Code:

TO-254AA

JESD-30 Code:

S-MSFM-P3

JESD-609 Code:

e4

Maximum Non Repetitive Peak Forward Current:

400 A

No. of Elements:

1

No. of Phases:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

METAL

Package Shape:

Package Style (Meter):

FLANGE MOUNT

Qualification:

Not Qualified

Maximum Repetitive Peak Reverse Voltage:

200 V

Surface Mount:

NO

Terminal Finish:

GOLD

Terminal Form:

Terminal Position:

Trade Compliance

BYV52-200FSY1 Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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