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ACST4-7CB-TR

STMicroelectronics

ACST4-7CB-TR by STMicroelectronics

ACST4-7CB-TR by STMicroelectronics is a single TRIAC designed for efficient AC control. It features a max RMS on-state current of 4A, operates up to 125 °C, and supports 700V off-state voltage. Ideal for applications in lighting and motor control systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,825 parts In-Stock

1+ parts

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2,825

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Anansix

USA . 2,165 parts In-Stock

1+ parts

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2,165

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Digiode

USA . 1,160 parts In-Stock

1+ parts

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1,160

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,735 parts In-Stock

1+ parts

$2.986

100+ parts

-

1k+ parts

$2.688

10k+ parts

-

1,735

$2.986

-

$2.688

-

Ampacity Inc.

Singapore . 745 parts In-Stock

1+ parts

$3.100

100+ parts

-

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-

745

$3.100

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MKK Technologies

India . 302 parts In-Stock

1+ parts

$5.616

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-

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302

$5.616

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DigiPath Technology Company

USA . 302 parts In-Stock

1+ parts

$5.616

100+ parts

-

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302

$5.616

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AZTECH Wire

Italy . 775 parts In-Stock

1+ parts

$8.860

100+ parts

-

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775

$8.860

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Native Components

USA . 683 parts In-Stock

1+ parts

$19.040

100+ parts

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683

$19.040

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Northwest PG Solutions

USA . 1,083 parts In-Stock

1+ parts

$20.944

100+ parts

$18.850

1k+ parts

-

10k+ parts

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1,083

$20.944

$18.850

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Kepictronics

USA . 27,860 parts In-Stock

1+ parts

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27,860

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Corphita

USA . 3,418 parts In-Stock

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3,418

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Parana Technologies

USA . 1,238 parts In-Stock

1+ parts

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100+ parts

$3.571

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1,238

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$3.571

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Overview

Unlock the power of efficiency and reliability with the ACST4-7CB-TR from STMicroelectronics, a leader in semiconductor innovation. This high-performance TRIAC is designed for smooth operation in diverse applications, ensuring exceptional quality and durability. With its compact footprint and robust capabilities, it effortlessly handles demanding tasks while minimizing energy consumption. Elevate your projects with a trusted solution that delivers unmatched value and peace of mind.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material ensures a lightweight and robust package, providing excellent protection and heat resistance.

Maximum DC Gate Trigger Current: 25 mA

With a maximum trigger current of 25 mA, this TRIAC is suitable for low-power control applications while ensuring efficient operation.

Configuration: SINGLE

The single configuration simplifies circuit design and reduces complexity, making it a reliable choice for various applications.

Surface Mount: YES

Surface mount capability allows for compact designs and automated assembly processes, decreasing manufacturing costs.

Package Shape: RECTANGULAR

The rectangular shape maximizes space efficiency on PCBs, allowing for easy integration into existing layouts.

Terminal Form: GULL WING

Gull wing terminals provide reliable solder joints and are easy to inspect and handle during assembly.

Maximum Leakage Current: 0.5 mA

A low leakage current of 0.5 mA enhances energy efficiency and reduces power loss in the system.

No. of Terminals: 2

The two-terminal design is simple and easy to use, facilitating straightforward connections and circuit integration.

Package Style (Meter): SMALL OUTLINE

The small outline package style allows for compact design footprints, making it ideal for space-constrained applications.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125 °C, this TRIAC can withstand higher thermal conditions, ensuring reliability in demanding environments.

Trigger Device Type: 4 QUADRANT LOGIC LEVEL TRIAC

This 4 quadrant logic level TRIAC can handle AC signals from all quadrants, making it versatile for various switching applications.

Minimum Operating Temperature: -30 °C

The capability to operate down to -30 °C ensures reliable performance in low-temperature environments.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides excellent solderability and corrosion resistance, enhancing longevity of connections.

Terminal Position: SINGLE

Single terminal position allows for easy placement and integration on PCBs, simplifying design processes.

Maximum RMS On-state Current: 4 A

The TRIAC can handle a maximum RMS on-state current of 4 A, making it suitable for controlling moderate loads.

Maximum DC Gate Trigger Voltage: 1.1 V

A low gate trigger voltage of 1.1 V minimizes power consumption for control signals, enhancing energy efficiency.

Case Connection: MAIN TERMINAL 1

Main terminal case connection leads to simplified circuit layouts and reduces potential connection errors.

Repetitive Peak Off-state Voltage: 700 V

The high-off-state voltage capability of 700 V makes it ideal for high-voltage AC applications, offering increased reliability.

Minimum Critical Rate of Rise of Off-state Voltage: 500 V/µs

A minimum critical rate of rise of 500 V/µs allows for faster switching and improved performance in dynamic applications.

Maximum Holding Current: 35 mA

This TRIAC's holding current of 35 mA ensures it can maintain the ON state under a variety of load conditions, providing stability.

Technical Specifications

Triode For Alternating Current (TRIAC) ACST4-7CB-TR attributes and parameters. Explore more Triode For Alternating Current (TRIAC) devices from STMicroelectronics

Specs

Case Connection:

Configuration:

Minimum Critical Rate of Rise of Off-state Voltage:

500 V/us

Maximum DC Gate Trigger Current:

25 mA

Maximum DC Gate Trigger Voltage:

1.1 V

Maximum Holding Current:

35 mA

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Maximum Leakage Current:

.5 mA

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Qualification:

Not Qualified

Maximum RMS On-state Current:

4 A

Repetitive Peak Off-state Voltage:

700 V

Sub-Category:

TRIACs

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

Trigger Device Type:

Trade Compliance

ACST4-7CB-TR Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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