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MAC15A8

Onsemi

MAC15A8 by Onsemi

MAC15A8 by Onsemi is a TRIAC with 600V repetitive peak off-state voltage, 15A max RMS on-state current, and 50mA max DC gate trigger current. It is used in applications requiring AC power control such as dimmers, motor speed controllers, and heating control systems.

Median Price

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Lifecycle Status

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In-Stock Inventory

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MISTER SPROCKETS

USA . 1,618 parts In-Stock

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Digiode

USA . 509 parts In-Stock

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Vyrian

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R&J Components

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Holdelec - ElecDif-Pro

France . 100 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 78 parts In-Stock

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Bristol Electronics

USA . 78 parts In-Stock

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Dan-Mar Components

USA . 78 parts In-Stock

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Legend Electronics Inc.

USA . 23 parts In-Stock

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Fibra_Brandt Electronic GMBH

Germany . 22 parts In-Stock

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DF Sales Co.

USA . 9 parts In-Stock

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DF Sales Co.

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LittleDiode

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NAC Semi

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Distributors (Availability)

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Component Stockers USA

USA . 5,328 parts In-Stock

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$1.330

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Kepictronics

USA . 15,000 parts In-Stock

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Problanco Electronics

Mexico . 7,404 parts In-Stock

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TANS Electronics

Latvia . 4,155 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,901 parts In-Stock

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SupplyDigital Components

Austria . 3,870 parts In-Stock

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Corphita

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UHIMA Technologies

Türkiye . 873 parts In-Stock

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Assy Fe

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Corohmni

South Africa . 198 parts In-Stock

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Kulean Microsystems

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Overview

Discover the power and reliability of the MAC15A8 by Onsemi, a top-quality TRIAC that delivers exceptional performance in various applications. With Onsemi's reputation for excellence, you can trust in the durability and precision of this product. Whether you're looking to enhance your lighting systems, heating controls, or motor drives, the MAC15A8 offers unmatched value with a maximum RMS on-state current of 15 A and a repetitive peak off-state voltage of 600 V. Upgrade your projects today with the MAC15A8 and experience the difference in quality and efficiency.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and resilience to the product, making it suitable for various operating conditions.

Maximum DC Gate Trigger Current: 50 mA

Allows for efficient triggering of the TRIAC, ensuring reliable performance.

Configuration: SINGLE

Simplified design and easy integration into circuits.

Package Shape: RECTANGULAR

Facilitates efficient packaging and installation in electronic devices.

Terminal Form: THROUGH-HOLE

Enables easy assembly and soldering onto PCBs.

Maximum Leakage Current: 2 mA

Low leakage current ensures energy efficiency and prevents unnecessary power wastage.

No. of Terminals: 3

Sufficient number of terminals for connecting the TRIAC in circuits.

Package Style: FLANGE MOUNT

Provides secure mounting options for the TRIAC.

Maximum Operating Temperature: 125 °C

Wide operating temperature range suitable for various applications.

Trigger Device Type: TRIAC

Specifically designed for alternating current applications, ensuring compatibility and optimal performance.

Minimum Operating Temperature: -40 °C

Allows for operation in extreme cold conditions without compromising performance.

Terminal Finish: TIN LEAD

Ensures reliable electrical contact and prevents corrosion.

Maximum RMS On-state Current: 15 A

High current handling capacity suitable for various power applications.

Maximum DC Gate Trigger Voltage: 2 V

Low gate trigger voltage for efficient control of the TRIAC.

Case Connection: MAIN TERMINAL 2

Clearly labeled connection point for easy circuit integration.

Repetitive Peak Off-state Voltage: 600 V

High voltage rating for reliable isolation and switching capabilities.

Maximum Holding Current: 40 mA

Sufficient holding current for stable operation of the TRIAC.

Peak Reflow Temperature °C: 235

Can withstand high reflow temperatures during assembly processes.

Technical Specifications

Triode For Alternating Current (TRIAC) MAC15A8 attributes and parameters. Explore more Triode For Alternating Current (TRIAC) devices from Onsemi

Specs

Case Connection:

Configuration:

Maximum DC Gate Trigger Current:

50 mA

Maximum DC Gate Trigger Voltage:

2 V

Maximum Holding Current:

40 mA

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e0

Maximum Leakage Current:

2 mA

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Peak Reflow Temperature (C):

235

Qualification:

Not Qualified

Maximum RMS On-state Current:

15 A

Repetitive Peak Off-state Voltage:

600 V

Sub-Category:

TRIACs

Surface Mount:

NO

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Position:

Trigger Device Type:

Trade Compliance

MAC15A8 Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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