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74V1G08CTR

STMicroelectronics

74V1G08CTR by STMicroelectronics

74V1G08CTR by STMicroelectronics is a CMOS logic gate with a propagation delay of just 11 ns and operates at supply voltages b/w 2-5.5 V. It features a compact design with a small outline, ideal for space-constrained applications. This device supports dual inputs and is suitable for military-grade environments with temperatures ranging from -55 °C to 125°C.

Median Price

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Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (In-Stock)

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ComSIT Distribution GmbH

Germany . 60,000 parts In-Stock

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ComSIT USA

USA . 60,000 parts In-Stock

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Cyclops Electronics Ltd

UK . 11,204 parts In-Stock

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Prism Electronics

USA . 5,275 parts In-Stock

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5,275

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Vyrian

USA . 3,337 parts In-Stock

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3,337

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Digiode

USA . 2,862 parts In-Stock

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Anansix

USA . 1,231 parts In-Stock

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EMSNET

USA . 942 parts In-Stock

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942

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Bristol Electronics

USA . 374 parts In-Stock

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374

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Dan-Mar Components

USA . 374 parts In-Stock

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374

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Distributors (Availability)

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Microchip USA

USA . 389 parts In-Stock

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$2.382

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389

$2.382

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AZTECH Wire

Italy . 259 parts In-Stock

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$10.100

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259

$10.100

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IDEA Electronic Components Group

UK . 639 parts In-Stock

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$24.266

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$21.839

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639

$24.266

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$21.839

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MKK Technologies

India . 804 parts In-Stock

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$45.630

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804

$45.630

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DigiPath Technology Company

USA . 804 parts In-Stock

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$45.630

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804

$45.630

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Component Stockers USA

USA . 766 parts In-Stock

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$99.990

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$99.990

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Perfect Parts

USA . 839,629 parts In-Stock

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GreenTree Electronics

Israel . 678,000 parts In-Stock

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Kepictronics

USA . 84,000 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 9,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 8,555 parts In-Stock

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Assy Fe

Spain . 5,750 parts In-Stock

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Corphita

USA . 3,516 parts In-Stock

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Parana Technologies

USA . 2,368 parts In-Stock

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$29.014

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Northwest PG Solutions

USA . 1,781 parts In-Stock

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Native Components

USA . 741 parts In-Stock

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741

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Overview

Unlock the potential of your designs with the 74V1G08CTR from STMicroelectronics, a leader in innovative semiconductor solutions. This high-performance logic gate ensures rapid signal processing with minimal power consumption, perfect for a range of applications from consumer electronics to automotive systems. Trust in ST's commitment to quality and reliability, and elevate your projects with a component that promises efficiency, durability, and exceptional performance!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material offers excellent protection against environmental factors, enhancing the reliability of the component.

Propagation Delay At Nominal Supply: 11 ns

With a low propagation delay, this logic gate ensures fast switching speeds, making it ideal for high-speed applications.

Surface Mount: YES

Surface mount technology allows for a compact design, facilitating easy integration into modern circuit boards.

Number of Inputs: 2

Having two inputs allows for versatile logic operations, making it suitable for various digital circuit designs.

Package Shape: RECTANGULAR

The rectangular shape facilitates efficient PCB layouts and optimal use of space in compact designs.

Nominal Supply Voltage / Vsup: 3.3 V

Operates efficiently at a commonly used supply voltage, optimizing compatibility with many modern devices.

Load Capacitance (CL): 50 pF

With low load capacitance, the gate can drive loads efficiently, ensuring better performance in high-speed circuits.

Power Supplies (V): 2/5.5

Supports a flexible voltage range, allowing for adaptability in various applications and reducing design constraints.

Number of Terminals: 5

Five terminals provide sufficient points for connection and integration into complex circuits, enhancing versatility.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile design optimize space on the PCB, contributing to smaller device footprints.

Maximum I (ol): 4 Amp

A maximum output current of 4 Amp allows the gate to drive heavier loads, useful in power management applications.

Propagation Delay (tpd): 11 ns

The consistent propagation delay at 11 ns ensures reliable performance across a range of operating conditions.

Maximum Operating Temperature: 125 °C

High max operating temperature enhances reliability in demanding environments, suitable for military and industrial applications.

Minimum Operating Temperature: -55 °C

With a wide temperature range, this logic gate can function in extreme environments, ensuring durability and reliability.

Terminal Finish: NICKEL PALLADIUM GOLD

The high-quality terminal finish ensures excellent conductivity and resistance to corrosion, prolonging the lifespan of the component.

Terminal Position: DUAL

Dual terminal positioning allows for versatile circuit designs and easier layout options on PCB.

Maximum Seated Height: 1.1 mm

The low seated height allows for more compact designs, which is crucial in space-constrained applications.

Width: 1.25 mm

A narrow width is advantageous in high-density circuit designs, allowing for more components to be placed in limited areas.

Minimum Supply Voltage (Vsup): 2 V

Supports a minimum supply voltage of 2 V, enabling compatibility with low-voltage applications and enhancing energy efficiency.

Maximum Time At Peak Reflow Temperature (s): 30

A maximum reflow time of 30 seconds ensures safe handling during assembly while preventing damage to the device.

Peak Reflow Temperature °C: 260

A high peak reflow temperature allows for compatibility with modern soldering processes, ensuring reliable assembly.

Length: 2 mm

The short length contributes to a compact footprint, ideal for dense PCB layouts.

Temperature Grade: MILITARY

Designed for military-grade applications, ensuring reliability under extreme conditions and demanding standards.

Technology: CMOS

CMOS technology provides low power consumption and high-speed operation, making this gate suitable for a wide range of applications.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and enhanced mechanical stability during assembly.

Packing Method: TR

Tape and reel packing method enhances ease of handling and efficient automated pick-and-place assembly processes.

Terminal Pitch: 0.65 mm

A 0.65 mm pitch is standard for many PCB designs, ensuring compatibility with a wide range of equipment and assembly processes.

Maximum Supply Voltage (Vsup): 5.5 V

The maximum supply voltage of 5.5 V ensures flexibility in power supply options, accommodating a variety of circuit designs.

Technical Specifications

Logic Gates 74V1G08CTR attributes and parameters. Explore more Logic Gates devices from STMicroelectronics

Specs

Family:

74V

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e4

Length:

2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

2

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/5.5

Propagation Delay At Nominal Supply:

11 ns

Propagation Delay (tpd):

11 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.1 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.25 mm

Trade Compliance

74V1G08CTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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