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74LX3G07BJR

STMicroelectronics

74LX3G07BJR by STMicroelectronics

74LX3G07BJR by STMicroelectronics is a CMOS bus driver with a propagation delay of just 3.7 ns, operating b/w 1.65V and 5.5V. It features open-drain output and supports up to 24A, ideal for high-speed data transmission in industrial applications. Its compact design ensures efficient space utilization in electronic circuits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 1,806 parts In-Stock

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1,806

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Digiode

USA . 1,275 parts In-Stock

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1,275

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Vyrian

USA . 924 parts In-Stock

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924

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Distributors (Availability)

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Native Components

USA . 941 parts In-Stock

1+ parts

$5.475

100+ parts

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941

$5.475

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Andel Nordic

Denmark . 548 parts In-Stock

1+ parts

$5.778

100+ parts

-

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$5.547

10k+ parts

$5.547

548

$5.778

-

$5.547

$5.547

IDEA Electronic Components Group

UK . 54 parts In-Stock

1+ parts

$29.311

100+ parts

-

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$26.380

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54

$29.311

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$26.380

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MKK Technologies

India . 2,149 parts In-Stock

1+ parts

$55.118

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2,149

$55.118

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DigiPath Technology Company

USA . 2,149 parts In-Stock

1+ parts

$55.118

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2,149

$55.118

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Corphita

USA . 4,649 parts In-Stock

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4,649

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Parana Technologies

USA . 1,770 parts In-Stock

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$35.046

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1,770

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$35.046

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Northwest PG Solutions

USA . 1,217 parts In-Stock

1+ parts

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$5.365

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1,217

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$5.365

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Overview

Unlock unparalleled performance with the 74LX3G07BJR from STMicroelectronics! This cutting-edge bus driver offers rapid response times and robust reliability, perfect for demanding industrial applications. Designed to thrive in various environments, its compact size allows for seamless integration into your projects. Partner with a leader in innovation—STMicroelectronics ensures quality you can trust, delivering exceptional value that enhances efficiency and drives success. Embrace excellence today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This durable material ensures high reliability and protection for the device in various environments.

Propagation Delay At Nominal Supply: 3.7 ns

A low propagation delay allows for faster signal processing, making this device suitable for high-speed applications.

Surface Mount: YES

Surface mount technology facilitates easier integration into compact circuit designs, saving space and improving performance.

No. of Functions: 3

The multiple function capability enhances versatility, allowing the part to serve several roles in a design.

Package Shape: RECTANGULAR

The rectangular shape is optimized for efficient layout and placement on circuit boards for improved assembly processes.

Nominal Supply Voltage / Vsup (V): 3.3

Operating at a standard supply voltage of 3.3V ensures compatibility with many other components in modern electronic designs.

Load Capacitance (CL): 50 pF

A load capacitance of 50 pF allows the device to effectively drive loads in various applications without significant signal degradation.

Power Supplies (V): 3.3

Supports a common power supply, simplifying the overall design and reducing the complexity of the power network.

No. of Terminals: 8

The 8-terminal design provides flexibility in routing signals and power, catering to various circuit configurations.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The thin profile and fine pitch design allow for high-density circuits, optimizing board real estate and performance.

Maximum I (ol): 24 Amp

A high output current rating ensures the device can drive substantial loads, suitable for demanding applications.

Propagation Delay (tpd): 7.8 ns

This propagation delay value indicates that the device maintains efficient speed even under varying conditions.

Maximum Operating Temperature: 85 °C

The ability to operate at higher temperatures suits industrial applications, ensuring reliability in harsh environments.

Output Characteristics: OPEN-DRAIN

Open-drain outputs allow for flexible interfacing options and can be easily used in wired-AND configurations.

Minimum Operating Temperature: -40 °C

This wide temperature range allows the device to perform in extreme conditions, making it ideal for outdoor applications.

Terminal Position: BOTTOM

Bottom terminal positioning facilitates efficient thermal management and reduced inductance in high-speed applications.

No. of Ports: 2

Two ports offer enhanced functionality and interconnectivity, making the product multipurpose in various designs.

Maximum Seated Height: 0.625 mm

A low seated height caters to space-constrained applications without sacrificing performance or reliability.

Width: 0.9 mm

The compact width maximizes layout versatility and accommodates densely packed PCB designs.

Output Polarity: TRUE

TRUE output polarity allows for straightforward interfacing with various input devices and logic levels.

Minimum Supply Voltage (Vsup): 1.65 V

A low minimum supply voltage makes this device suitable for low-power applications, enhancing energy efficiency.

Length: 1.9 mm

The short length aids in minimizing footprint on PCBs, beneficial for high-density electronic designs.

Temperature Grade: INDUSTRIAL

Industrial-grade specifications ensure durability and reliability in demanding environments—ideal for industrial applications.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, contributing to overall efficiency and reliability.

Terminal Form: BALL

Ball terminals facilitate strong connections and aid in effective thermal and electrical performance.

Packing Method: TR

Tape and reel packing is convenient for high-volume production, streamlining assembly processes.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch allows for dense component placement, making it ideal for modern small-scale circuitry.

Maximum Supply Voltage (Vsup): 5.5 V

Support for a higher maximum supply voltage extends the range of applications, accommodating various design needs.

Technical Specifications

Bus Driver & Transceivers 74LX3G07BJR attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Family:

LX

JESD-30 Code:

R-PBGA-B8

Length:

1.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

No. of Bits:

1

No. of Functions:

3

No. of Ports:

2

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

OPEN-DRAIN

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA8,2X4,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

3.7 ns

Propagation Delay (tpd):

7.8 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

.625 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

.9 mm

Trade Compliance

74LX3G07BJR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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