Loading...

74LX1G126CTR

STMicroelectronics

74LX1G126CTR by STMicroelectronics

74LX1G126CTR by STMicroelectronics is a CMOS bus driver with a propagation delay of just 4.5 ns, operating b/w 1.65V and 5.5V. It features a compact design with a max height of 1.1 mm and supports dual ports for efficient signal management in military applications. Ideal for high-speed data transmission, it operates reliably from -55 °C to 125 °C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

R&J Components

USA . 35,480 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

35,480

-

-

-

-

Vyrian

USA . 6,458 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,458

-

-

-

-

Connector Distribution Corp

USA . 2,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,500

-

-

-

-

Right Parts Inc.

USA . 2,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,500

-

-

-

-

Digiode

USA . 637 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

637

-

-

-

-

Anansix

USA . 636 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

636

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 489 parts In-Stock

1+ parts

$4.120

100+ parts

-

1k+ parts

-

10k+ parts

-

489

$4.120

-

-

-

AZTECH Wire

Italy . 673 parts In-Stock

1+ parts

$16.170

100+ parts

-

1k+ parts

-

10k+ parts

-

673

$16.170

-

-

-

IDEA Electronic Components Group

UK . 802 parts In-Stock

1+ parts

$18.479

100+ parts

-

1k+ parts

$16.631

10k+ parts

-

802

$18.479

-

$16.631

-

MKK Technologies

India . 605 parts In-Stock

1+ parts

$34.749

100+ parts

-

1k+ parts

-

10k+ parts

-

605

$34.749

-

-

-

DigiPath Technology Company

USA . 605 parts In-Stock

1+ parts

$34.749

100+ parts

-

1k+ parts

-

10k+ parts

-

605

$34.749

-

-

-

Authorized Procurement Solutions

USA . 25,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

25,000

-

-

-

-

Perfect Parts

USA . 3,848 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,848

-

-

-

-

Assy Fe

Spain . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,000

-

-

-

-

A-Z Elektronik GmbH

Germany . 2,700 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,700

-

-

-

-

Corphita

USA . 1,618 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,618

-

-

-

-

Northwest PG Solutions

USA . 1,511 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,511

-

-

-

-

Parana Technologies

USA . 497 parts In-Stock

1+ parts

-

100+ parts

$22.095

1k+ parts

-

10k+ parts

-

497

-

$22.095

-

-

Native Components

USA . 480 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

480

-

-

-

-

Overview

Experience unparalleled performance with the 74LX1G126CTR from STMicroelectronics, a leader in innovative semiconductor solutions. This compact bus driver excels in versatility and efficiency, making it perfect for a wide range of applications—from consumer electronics to industrial systems. With its exceptional speed and robust design, it ensures reliable communication between devices while saving power. Elevate your projects with this trusted component that delivers quality and reliability you can count on!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides durability and protection against environmental factors, making this device reliable for various applications.

Propagation Delay At Nominal Supply: 4.5 ns

A low propagation delay ensures fast signal transmission, enhancing overall system performance and response time.

Surface Mount: YES

Surface mount technology allows for compact designs and simplifies the assembly process, making it suitable for modern electronic devices.

Package Shape: RECTANGULAR

The rectangular shape optimizes layout and space utilization on PCBs, enabling better integration into designs.

Nominal Supply Voltage / Vsup: 1.8 V

A low nominal supply voltage contributes to reduced power consumption, facilitating energy-efficient designs.

Power Supplies (V): 3.3 V

Operating at 3.3 V is ideal for compatibility with many digital circuits, enhancing versatility in applications.

No. of Terminals: 5

With five terminals, this device maintains a balance between functionality and simplicity, allowing easy integration.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The thin profile and small outline design enable high-density layouts, perfect for space-constrained applications.

Maximum I (ol): 24 Amp

A high output current capability supports robust performance, making it suitable for demanding applications.

Propagation Delay (tpd): 12 ns

This specification signifies quick switching, critical for high-speed communication lines and data processing.

Maximum Operating Temperature: 125 °C

A high maximum operating temperature enhances reliability in harsh environments, making it ideal for military and industrial applications.

Output Characteristics: 3-STATE

3-state output capability allows for greater flexibility in bus systems, enabling effective communication among multiple devices.

Minimum Operating Temperature: -55 °C

The device's ability to operate in extreme cold conditions makes it suitable for aerospace and military applications.

Terminal Finish: MATTE TIN

Matte tin provides good solderability and corrosion resistance, ensuring durability and reliability in assembly.

Terminal Position: DUAL

The dual terminal position enhances layout flexibility and supports easier routing on PCBs.

No. of Ports: 2

Two ports support versatile applications, allowing for multiple connections and communication paths.

Maximum Seated Height: 1.1 mm

A low seated height is space-efficient, suitable for slim-profile circuits and modern compact designs.

Width: 1.25 mm

A narrow width aids in high-density PCB layouts, allowing more components to fit within limited spaces.

Output Polarity: TRUE

True output polarity promotes compatibility with standard logic levels in digital circuits, enhancing integration.

Minimum Supply Voltage (Vsup): 1.65 V

A minimum supply voltage requirement of 1.65 V ensures compatibility with low-voltage applications, optimizing power usage.

Length: 2 mm

Compact length allows for efficient layout and design in space-constrained electronic systems.

Temperature Grade: MILITARY

Military-grade specifications ensure rigorous quality and reliability standards, suitable for critical and harsh environments.

Technology: CMOS

CMOS technology offers high noise immunity and low power consumption, making this device efficient and reliable.

Terminal Form: GULL WING

The gull wing terminal form enhances soldering ease and reliability during manufacturing, ensuring robust connections.

Packing Method: TR

The Tape and Reel packing method facilitates automated assembly processes, improving production efficiency.

Terminal Pitch: 0.65 mm

The narrow terminal pitch is ideal for compact PCBs, allowing for more components to be fitted in a small area.

Control Type: ENABLE HIGH

Enable high control simplifies digital logic interfacing, enabling easier integration into control circuits.

Maximum Supply Voltage (Vsup): 5.5 V

A wide supply voltage range enhances the device's flexibility and adaptability across various electronic applications.

Technical Specifications

Bus Driver & Transceivers 74LX1G126CTR attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Control Type:

ENABLE HIGH

Family:

TTL/H/L

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

2 mm

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP5/6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

4.5 ns

Propagation Delay (tpd):

12 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

1.25 mm

Trade Compliance

74LX1G126CTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 5