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74LX1G125STR

STMicroelectronics

74LX1G125STR by STMicroelectronics

74LX1G125STR by STMicroelectronics is a low-power CMOS bus driver with a propagation delay of just 6.2 ns, operating b/w 1.65V and 5.5V. It features a compact design with a max height of 1.45 mm and supports dual ports for efficient data transmission in military applications. Ideal for high-speed communication, it ensures reliable performance even at extreme temperatures from -55 °C to 125 °C.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,585 parts In-Stock

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8,585

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ComSIT Distribution GmbH

Germany . 2,386 parts In-Stock

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2,386

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Digiode

USA . 1,120 parts In-Stock

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Anansix

USA . 592 parts In-Stock

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Prism Electronics

USA . 15 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 289 parts In-Stock

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$9.430

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289

$9.430

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IDEA Electronic Components Group

UK . 808 parts In-Stock

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$14.415

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$12.973

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808

$14.415

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$12.973

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Microchip USA

USA . 381 parts In-Stock

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$16.118

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381

$16.118

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MKK Technologies

India . 169 parts In-Stock

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$27.106

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$27.106

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DigiPath Technology Company

USA . 169 parts In-Stock

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$27.106

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169

$27.106

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Ampacity Inc.

Singapore . 1,307 parts In-Stock

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$38.000

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Kepictronics

USA . 39,000 parts In-Stock

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Corphita

USA . 2,993 parts In-Stock

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Northwest PG Solutions

USA . 1,604 parts In-Stock

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Native Components

USA . 793 parts In-Stock

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Andel Nordic

Denmark . 392 parts In-Stock

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Parana Technologies

USA . 289 parts In-Stock

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$17.235

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289

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$17.235

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Overview

Elevate your design with the 74LX1G125STR from STMicroelectronics, a top-tier bus driver and transceiver renowned for its reliability and superior performance. With rapid switching speeds and low power consumption, this compact solution is perfect for applications in automotive, industrial, and consumer electronics. Trust in STMicroelectronics' legacy of innovation and quality to enhance your projects, delivering exceptional value and efficiency that meet the demands of modern technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy body material ensures long-lasting performance and reliability in various applications.

Propagation Delay At Nominal Supply: 6.2 ns

With a low propagation delay, this product enables faster data transmission, enhancing overall system performance.

Surface Mount: YES

The surface mount design facilitates easy integration onto PCBs, saving space and simplifying assembly processes.

Package Shape: RECTANGULAR

The rectangular package shape is optimized for efficient use of space and compatibility with most mounting layouts.

Nominal Supply Voltage / Vsup (V): 1.8

Operating at a low nominal supply voltage of 1.8V makes this product energy-efficient, ideal for battery-powered devices.

Load Capacitance (CL): 50 pF

A low load capacitance of 50 pF improves signal integrity, making it suitable for high-speed applications.

Power Supplies (V): 3.3

The compatibility with 3.3V power supplies allows for efficient operation in modern electronic systems.

No. of Terminals: 5

With five terminals, this product allows for versatile connectivity options in compact designs.

Package Style (Meter): SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

The small outline, low profile, and shrink pitch style enables denser circuit packing, ideal for space-constrained applications.

Maximum I (ol): 24 Amp

A maximum output current of 24A supports power-hungry applications, providing robust performance under load.

Propagation Delay (tpd): 12 ns

The propagation delay of 12 ns further ensures swift data handling, essential for high-speed communication systems.

Maximum Operating Temperature: 125 °C

Rated for high temperatures up to 125 °C, this product is suitable for demanding industrial or automotive environments.

Output Characteristics: 3-STATE

The 3-state output allows for flexible bus configurations, enhancing inter-device communication and control.

Minimum Operating Temperature: -55 °C

With a minimum operating temperature of -55 °C, this component is reliable in extreme cold conditions.

Terminal Finish: TIN

The tin terminal finish provides good solderability and corrosion resistance, ensuring a quality electronic connection.

Terminal Position: DUAL

Dual terminal positions enable diverse application setups, improving layout and design flexibility.

No. of Ports: 2

Two ports enhance its capability for complex systems requiring multiple data paths.

Maximum Seated Height: 1.45 mm

The low seated height allows for slimmer designs, making this product suitable for modern compact devices.

Width: 1.625 mm

A narrow width fits well in tight layouts while ensuring efficient space utilization in PCB designs.

Output Polarity: TRUE

With true output polarity, this product ensures straightforward digital logic interfacing.

Minimum Supply Voltage (Vsup): 1.65 V

It can operate at a minimum supply voltage of only 1.65V, providing flexibility for low-power applications.

Length: 2.9 mm

A compact length of 2.9 mm contributes to a smaller footprint on the PCB, accommodating tighter designs.

Temperature Grade: MILITARY

The military grade temperature rating guarantees reliability and performance in challenging environments.

Technology: CMOS

Utilizing CMOS technology offers low power consumption and high noise immunity, ideal for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminals facilitate easier soldering and assembly, improving manufacturing efficiency.

Packing Method: TR

The TR packing method streamlines handling and integration into production lines, increasing efficiency.

Terminal Pitch: 0.95 mm

A terminal pitch of 0.95 mm allows for compact designs while maintaining ease of soldering and assembly.

Control Type: ENABLE LOW

The enable low control type simplifies interfacing with controllers, improving system design versatility.

Maximum Supply Voltage (Vsup): 5.5 V

The ability to operate at a maximum of 5.5V supports a broad range of applications, including IoT and automotive.

Technical Specifications

Bus Driver & Transceivers 74LX1G125STR attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Control Type:

ENABLE LOW

Family:

TTL/H/L

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

2.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

No. of Bits:

1

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Packing Method:

TR

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

6.2 ns

Propagation Delay (tpd):

12 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.45 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Width:

1.625 mm

Trade Compliance

74LX1G125STR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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