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74LX1G125CTR

STMicroelectronics

74LX1G125CTR by STMicroelectronics

74LX1G125CTR by STMicroelectronics is a CMOS bus driver with a propagation delay of just 6.2 ns and operates b/w 1.65V to 5.5V. It features a compact design with a max height of 1.1 mm, ideal for space-constrained applications. This device supports dual ports and offers true output polarity for efficient signal management.

Median Price

$3.850

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Component Electronics Inc.

Canada . 2,500 parts In-Stock

1+ parts

$3.850

100+ parts

$2.880

1k+ parts

$2.500

10k+ parts

-

2,500

$3.850

$2.880

$2.500

-

Vyrian

USA . 5,044 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,044

-

-

-

-

Anansix

USA . 1,245 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,245

-

-

-

-

Digiode

USA . 269 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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269

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 295 parts In-Stock

1+ parts

$5.242

100+ parts

-

1k+ parts

-

10k+ parts

-

295

$5.242

-

-

-

Andel Nordic

Denmark . 29 parts In-Stock

1+ parts

$6.174

100+ parts

-

1k+ parts

$5.927

10k+ parts

$5.927

29

$6.174

-

$5.927

$5.927

IDEA Electronic Components Group

UK . 536 parts In-Stock

1+ parts

$11.487

100+ parts

-

1k+ parts

$10.338

10k+ parts

-

536

$11.487

-

$10.338

-

AZTECH Wire

Italy . 157 parts In-Stock

1+ parts

$20.710

100+ parts

-

1k+ parts

-

10k+ parts

-

157

$20.710

-

-

-

MKK Technologies

India . 1,867 parts In-Stock

1+ parts

$21.601

100+ parts

-

1k+ parts

-

10k+ parts

-

1,867

$21.601

-

-

-

DigiPath Technology Company

USA . 1,867 parts In-Stock

1+ parts

$21.601

100+ parts

-

1k+ parts

-

10k+ parts

-

1,867

$21.601

-

-

-

Component Stockers USA

USA . 622 parts In-Stock

1+ parts

$99.990

100+ parts

-

1k+ parts

-

10k+ parts

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622

$99.990

-

-

-

Kepictronics

USA . 42,000 parts In-Stock

1+ parts

-

100+ parts

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42,000

-

-

-

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Corphita

USA . 3,912 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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3,912

-

-

-

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Northwest PG Solutions

USA . 962 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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962

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-

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Native Components

USA . 762 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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762

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-

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Parana Technologies

USA . 570 parts In-Stock

1+ parts

-

100+ parts

$13.735

1k+ parts

-

10k+ parts

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570

-

$13.735

-

-

Overview

Unlock seamless connectivity and efficiency in your designs with the 74LX1G125CTR from STMicroelectronics. Renowned for their commitment to innovation and quality, STMicroelectronics delivers a top-tier bus driver perfect for a multitude of applications, from consumer electronics to industrial systems. Experience fast signal integrity, low power consumption, and exceptional reliability—ensuring your projects run smoothly and effectively. Elevate your technology today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy in the packaging enhances durability and protects the internal components, making it suitable for demanding environments.

Propagation Delay At Nominal Supply: 6.2 ns

A low propagation delay indicates fast signal switching, which is essential for high-speed applications.

Surface Mount: YES

Surface mount technology allows for a more compact design and easier integration into modern circuit boards.

Package Shape: RECTANGULAR

The rectangular shape optimizes space usage on circuit boards, facilitating efficient layout design.

Nominal Supply Voltage / Vsup (V): 1.8

This nominal voltage is compatible with low-power applications, leading to reduced energy consumption in devices.

Load Capacitance (CL): 50 pF

A moderate load capacitance allows for good performance in signal integrity, making it suitable for high-frequency applications.

Power Supplies (V): 3.3

Supporting a power supply of 3.3V makes this product compatible with a wide range of contemporary electronic devices.

No. of Terminals: 5

Five terminals provide sufficient connectivity options for versatile circuit integrations.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

A thin profile and small outline design allow for space-saving applications in compact electronic devices.

Maximum I (ol): 24 Amp

A high output current capability enhances the performance of heavy-load applications.

Propagation Delay (tpd): 12 ns

A propagation delay of 12 ns ensures reliable data communication at speed, ideal for synchronous bus applications.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this product is suitable for extreme environments.

Output Characteristics: 3-STATE

3-state output provides flexibility in bus communications, enabling multiple devices to share the same data line.

Minimum Operating Temperature: -55 °C

Capable of operating at low temperatures makes this product suitable for harsh environments.

Terminal Finish: MATTE TIN

Matte tin finish ensures excellent solderability and corrosion resistance, enhancing the reliability of connections.

Terminal Position: DUAL

Dual terminal positioning provides versatile mounting options for practical circuit design.

No. of Ports: 2

Having two ports allows for easy data transfer between multiple devices, enhancing connectivity options.

Maximum Seated Height: 1.1 mm

A low seated height allows for compact designs and is ideal for slim electronic devices.

Width: 1.25 mm

A narrow width contributes to the miniaturization of circuits, making it fit for modern designs.

Output Polarity: TRUE

True output polarity is beneficial for straightforward logic interfacing in various applications.

Minimum Supply Voltage (Vsup): 1.65 V

Low minimum supply voltage makes it energy-efficient for battery-powered applications.

Length: 2 mm

A compact length allows integration in small designs, thereby facilitating innovation in electronic products.

Temperature Grade: MILITARY

Military grade temperature specifications ensure enhanced reliability under extreme conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making it perfect for modern digital applications.

Terminal Form: GULL WING

Gull wing terminals allow for easy soldering and excellent connections, improving assembly efficiency.

Packing Method: TR

Tape and reel packing ensures efficient handling and easy placement during assembly processes.

Terminal Pitch: 0.65 mm

A small terminal pitch enables dense circuit designs, which is advantageous for complex electronic systems.

Control Type: ENABLE LOW

Low-enable control simplifies design logic and reduces power consumption in idle states.

Maximum Supply Voltage (Vsup): 5.5 V

Supports up to 5.5V supply voltage ensures compatibility with a broad range of systems, enhancing its versatile applications.

Technical Specifications

Bus Driver & Transceivers 74LX1G125CTR attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Control Type:

ENABLE LOW

Family:

TTL/H/L

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP5/6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

6.2 ns

Propagation Delay (tpd):

12 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

1.25 mm

Trade Compliance

74LX1G125CTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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