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74LX1G126STR

STMicroelectronics

74LX1G126STR by STMicroelectronics

74LX1G126STR by STMicroelectronics is a CMOS bus driver with a propagation delay of just 4.5 ns, operating b/w 1.65V and 5.5V. It features a compact low-profile package and supports dual ports with true output polarity. Ideal for high-speed data transmission in military applications, it operates from -55 °C to 125 °C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,469 parts In-Stock

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4,469

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Speed Components Ltd

Israel . 3,000 parts In-Stock

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3,000

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Anansix

USA . 1,852 parts In-Stock

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1,852

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Digiode

USA . 815 parts In-Stock

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815

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Extreme Components

USA . 595 parts In-Stock

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595

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Distributors (Availability)

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Andel Nordic

Denmark . 123 parts In-Stock

1+ parts

$6.824

100+ parts

-

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$6.551

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$6.551

123

$6.824

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$6.551

$6.551

Microchip USA

USA . 276 parts In-Stock

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$14.171

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276

$14.171

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AZTECH Wire

Italy . 773 parts In-Stock

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$20.570

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773

$20.570

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IDEA Electronic Components Group

UK . 1,665 parts In-Stock

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$21.572

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$19.415

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$21.572

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$19.415

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MKK Technologies

India . 1,601 parts In-Stock

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$40.565

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1,601

$40.565

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DigiPath Technology Company

USA . 1,601 parts In-Stock

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$40.565

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1,601

$40.565

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Component Stockers USA

USA . 388 parts In-Stock

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$99.990

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388

$99.990

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Kepictronics

USA . 10,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 2,700 parts In-Stock

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Northwest PG Solutions

USA . 1,984 parts In-Stock

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Corphita

USA . 990 parts In-Stock

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990

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Parana Technologies

USA . 925 parts In-Stock

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$25.793

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925

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$25.793

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Native Components

USA . 675 parts In-Stock

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675

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Overview

Elevate your designs with the 74LX1G126STR from STMicroelectronics, a premier choice in bus drivers and transceivers. Known for superior quality and reliability, STMicroelectronics delivers exceptional performance with low propagation delay and robust temperature tolerance—ideal for automotive, industrial, and consumer applications. Enjoy enhanced efficiency and compact size, empowering your projects with cutting-edge technology that meets high standards without compromise.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Utilizing durable plastic/epoxy ensures robust performance and longevity, making it suitable for various applications.

Propagation Delay At Nominal Supply: 4.5 ns

This low propagation delay enhances signal integrity and speed, enabling efficient data transfer in fast-paced applications.

Surface Mount: YES

Surface mount technology allows for compact design and greater integration density, ideal for modern electronic devices.

Package Shape: RECTANGULAR

The rectangular package shape helps in efficient space utilization on PCBs, facilitating better layout design.

Nominal Supply Voltage / Vsup (V): 1.8

Works effectively at a nominal supply of 1.8V, making it suitable for low-power applications.

Power Supplies (V): 3.3

Compatible with a standard 3.3V supply, ensuring wide usability in various electronic systems.

No. of Terminals: 5

The 5-terminal configuration provides versatility in device connections, optimizing design for various applications.

Package Style (Meter): SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

The low-profile design allows for high-density mounting in compact electronics, ideal for space-constrained applications.

Maximum I (ol): 24 Amp

A maximum output current of 24 amps means it can handle significant load, suitable for robust applications.

Propagation Delay (tpd): 12 ns

This propagation delay supports high-speed performance, making the device suitable for applications requiring quick response times.

Maximum Operating Temperature: 125 °C

With a high operating temperature limit, this product is reliable in environments where heat is a concern.

Output Characteristics: 3-STATE

The 3-state output characteristic allows for flexible data handling and better management of bus systems.

Minimum Operating Temperature: -55 °C

The ability to operate at very low temperatures makes it suitable for extreme environments like aerospace and military applications.

Terminal Finish: TIN

Tin finish promotes good solderability, ensuring reliable connections during assembly.

Terminal Position: DUAL

Dual terminal positioning enhances layout flexibility and connectivity options on the board.

No. of Ports: 2

Having two ports allows for dual data paths, increasing versatility in various applications.

Maximum Seated Height: 1.45 mm

A low seated height aids in maintaining a compact form factor, facilitating integration into tight spaces.

Width: 1.625 mm

Compact width allows for efficient layout design, accommodating other components in space-sensitive applications.

Output Polarity: TRUE

The true output polarity makes integration straightforward with logic systems that expect a positive output.

Minimum Supply Voltage (Vsup): 1.65 V

Operates effectively at a minimum voltage of 1.65V, ensuring flexibility in power supply options.

Length: 2.9 mm

Short length contributes to a compact footprint, making it easy to fit in small designs.

Temperature Grade: MILITARY

Designed to military specifications, ensuring reliability in demanding environments and applications.

Technology: CMOS

CMOS technology provides low power consumption while maintaining high performance, making it energy-efficient.

Terminal Form: GULL WING

The gull wing terminal form enhances mechanical stability and reliability, especially in surface-mounted applications.

Packing Method: TR

Tape and reel packing method simplifies automated assembly processes, improving manufacturing efficiency.

Terminal Pitch: 0.95 mm

A 0.95 mm terminal pitch allows for fine pitch layouts, supporting high-density PCB designs.

Control Type: ENABLE HIGH

High-enable control type simplifies the interfacing with other circuits, enabling straightforward control mechanisms.

Maximum Supply Voltage (Vsup): 5.5 V

The maximum supply voltage of 5.5V provides versatility for a range of power supply options, ensuring compatibility with many systems.

Technical Specifications

Bus Driver & Transceivers 74LX1G126STR attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Control Type:

ENABLE HIGH

Family:

TTL/H/L

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

2.9 mm

Logic IC Type:

Maximum I (ol):

24 Amp

No. of Bits:

1

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Packing Method:

TR

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

4.5 ns

Propagation Delay (tpd):

12 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.45 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Width:

1.625 mm

Trade Compliance

74LX1G126STR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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