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74LX1G125BJR

STMicroelectronics

74LX1G125BJR by STMicroelectronics

74LX1G125BJR by STMicroelectronics is a CMOS bus driver with a fast propagation delay of 6.2 ns and operates b/w 1.65V to 5.5V. It features a compact rectangular package and supports military-grade temperatures from -55 °C to 125 °C, ideal for robust applications. With its low power consumption and high output drive capability (24A), it's perfect for efficient signal transmission in demanding environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 1,397 parts In-Stock

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Anansix

USA . 1,082 parts In-Stock

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Vyrian

USA . 127 parts In-Stock

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Andel Nordic

Denmark . 67 parts In-Stock

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$2.245

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$2.155

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$2.155

67

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$2.155

IDEA Electronic Components Group

UK . 1,899 parts In-Stock

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$31.222

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$28.100

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$28.100

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MKK Technologies

India . 1,939 parts In-Stock

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$58.711

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DigiPath Technology Company

USA . 1,939 parts In-Stock

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$58.711

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Corphita

USA . 3,761 parts In-Stock

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Parana Technologies

USA . 2,009 parts In-Stock

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$37.331

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Northwest PG Solutions

USA . 631 parts In-Stock

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Native Components

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Overview

Unlock superior performance with the 74LX1G125BJR from STMicroelectronics, a trusted leader in semiconductor innovation. This high-quality bus driver and transceiver delivers exceptional speed and reliability for your electronic applications, making it perfect for automotive, industrial, and consumer electronics. With its robust temperature range and energy-efficient design, you can count on enhanced performance and longevity, elevating your projects to new heights. Experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable plastic/epoxy material ensures longevity and reliability in various environments.

Propagation Delay At Nominal Supply: 6.2 ns

Fast propagation delay improves the speed of data transfer, making it suitable for high-performance applications.

Surface Mount: YES

Surface mount capability allows for efficient space utilization on PCBs, enabling compact circuit designs.

Package Shape: RECTANGULAR

Rectangular shape facilitates easy placement on PCBs, optimizing layout efficiency.

Nominal Supply Voltage / Vsup (V): 1.8

Low nominal supply voltage enhances power efficiency, reducing energy consumption in electronic devices.

Load Capacitance (CL): 50 pF

Moderate load capacitance allows for stable operation without excessive loading on the bus.

Power Supplies (V): 3.3

Versatility with a 3.3V power supply makes it compatible with a wide range of digital systems.

No. of Terminals: 5

Five terminals provide sufficient connectivity options while maintaining a compact design.

Package Style (Meter): GRID ARRAY

Grid array style enhances heat dissipation and improves electrical performance.

Maximum I (ol): 24 Amp

High output current capability allows for handling demanding loads, making it suitable for various applications.

Propagation Delay (tpd): 12 ns

This propagation delay supports rapid signal changes, ideal for high-speed communication needs.

Maximum Operating Temperature: 125 °C

High temperature tolerance ensures reliability in harsh environments, catering to industrial applications.

Output Characteristics: 3-STATE

3-state outputs enable efficient bus control and reduce contention, simplifying design in multi-device systems.

Minimum Operating Temperature: -55 °C

Extended low temperature range allows operation in extreme environmental conditions, ideal for military applications.

Terminal Position: BOTTOM

Bottom terminal positioning supports effective soldering and thermal management in compact designs.

No. of Ports: 2

Two ports provide flexibility in interconnecting multiple devices, enhancing system integration.

Output Polarity: TRUE

True output polarity ensures compatibility with standard digital logic levels, facilitating system design.

Minimum Supply Voltage (Vsup): 1.65 V

Low minimum supply voltage enhances flexibility in power management within electronic circuits.

Temperature Grade: MILITARY

Designed to military specifications, ensuring performance and reliability in critical applications.

Technology: CMOS

CMOS technology affords low power consumption and high noise immunity, making it ideal for portable devices.

Terminal Form: BALL

Ball terminal form facilitates better mechanical and electrical connections in high-density designs.

Terminal Pitch: 0.35 mm

Small terminal pitch allows for high-density PCB layouts, maximizing component placement efficiency.

Control Type: ENABLE LOW

Active low control simplifies logic requirements and enhances circuit design simplicity.

Maximum Supply Voltage (Vsup): 5.5 V

Allows compatibility with higher voltage systems, increasing versatility across various applications.

Technical Specifications

Bus Driver & Transceivers 74LX1G125BJR attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Control Type:

ENABLE LOW

Family:

TTL/H/L

JESD-30 Code:

R-PBGA-B5

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

No. of Bits:

1

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA5,3X3,14

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

6.2 ns

Propagation Delay (tpd):

12 ns

Qualification:

Not Qualified

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.35 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

74LX1G125BJR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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