Loading...

74LVX174MTR

STMicroelectronics

74LVX174MTR by STMicroelectronics

74LVX174MTR by STMicroelectronics is a CMOS latch with a 15.5 ns propagation delay and operates at a supply voltage of 2.7-3.6 V. It features 6 bits, supports surface mount technology, and is ideal for high-speed digital applications in military environments. Its compact design ensures efficient space utilization in various electronic circuits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,708 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,708

-

-

-

-

Vyrian

USA . 1,906 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,906

-

-

-

-

Anansix

USA . 1,745 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,745

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 353 parts In-Stock

1+ parts

$1.000

100+ parts

-

1k+ parts

-

10k+ parts

-

353

$1.000

-

-

-

AZTECH Wire

Italy . 112 parts In-Stock

1+ parts

$10.640

100+ parts

-

1k+ parts

-

10k+ parts

-

112

$10.640

-

-

-

IDEA Electronic Components Group

UK . 1,617 parts In-Stock

1+ parts

$29.981

100+ parts

-

1k+ parts

$26.983

10k+ parts

-

1,617

$29.981

-

$26.983

-

Native Components

USA . 303 parts In-Stock

1+ parts

$36.300

100+ parts

-

1k+ parts

-

10k+ parts

$34.848

303

$36.300

-

-

$34.848

Northwest PG Solutions

USA . 415 parts In-Stock

1+ parts

$39.930

100+ parts

-

1k+ parts

-

10k+ parts

-

415

$39.930

-

-

-

MKK Technologies

India . 81 parts In-Stock

1+ parts

$56.377

100+ parts

-

1k+ parts

-

10k+ parts

-

81

$56.377

-

-

-

DigiPath Technology Company

USA . 81 parts In-Stock

1+ parts

$56.377

100+ parts

-

1k+ parts

-

10k+ parts

-

81

$56.377

-

-

-

Parana Technologies

USA . 1,663 parts In-Stock

1+ parts

-

100+ parts

$35.847

1k+ parts

-

10k+ parts

-

1,663

-

$35.847

-

-

Corphita

USA . 975 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

975

-

-

-

-

Overview

Unlock exceptional performance with the 74LVX174MTR from STMicroelectronics, a trusted leader in semiconductor innovation. This high-quality latch offers rapid data processing at minimal power, ideal for advanced applications ranging from consumer electronics to industrial automation. With its robust design and remarkable reliability, you can enhance your projects with confidence, ensuring efficiency and longevity while benefiting from ST’s renowned support and expertise.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy material provides excellent protection against environmental factors, enhancing the longevity and reliability of the product.

Propagation Delay At Nominal Supply: 15.5 ns

A low propagation delay ensures faster response times, making this latch and flip-flop suitable for high-speed applications.

Surface Mount: YES

Surface mount technology allows for compact designs and automated assembly, making the product ideal for modern electronics.

Package Shape: RECTANGULAR

The rectangular shape optimizes space on circuit boards, facilitating easier integrations into various designs.

No. of Bits: 6

With 6 bits, this device provides adequate data handling capabilities for a variety of applications.

Nominal Supply Voltage / Vsup (V): 2.7

Operating at a low nominal supply voltage enhances power efficiency, making it suitable for battery-operated devices.

Load Capacitance (CL): 50 pF

A low load capacitance ensures quick switching speeds, thus increasing the overall performance of the circuit.

Power Supplies (V): 3.3

Compatible with a common supply voltage, making it easier to integrate into existing systems.

No. of Terminals: 16

16 terminals offer multiple connections, facilitating diverse applications and circuit designs.

Package Style (Meter): SMALL OUTLINE

The small outline package style is ideal for space-constrained applications, enhancing design flexibility.

Maximum I (ol): 4 Amp

A high output current rating allows for driving heavier loads, making it suitable for more demanding applications.

Propagation Delay (tpd): 22 ns

This propagation delay is reasonable for various applications, balancing performance and power efficiency.

Maximum Operating Temperature: 125 °C

A high maximum operating temperature makes this product suitable for applications requiring reliable performance in harsh environments.

Trigger Type: POSITIVE EDGE

Positive edge triggering is robust and commonly used in modern digital circuits, providing reliability and ease of implementation.

Minimum Operating Temperature: -55 °C

Its ability to operate at low temperatures enhances reliability for aerospace and military applications.

Terminal Finish: NICKEL PALLADIUM GOLD

The high-quality terminal finish ensures excellent solderability and corrosion resistance, enhancing the product's lifespan.

Terminal Position: DUAL

Dual terminal positioning offers flexibility in PCB design, simplifying layout and assembly.

Maximum Seated Height: 1.75 mm

A low seated height is ideal for compact circuits, allowing for space savings in design.

Width: 3.9 mm

A narrow width provides more routing options on a PCB, facilitating tighter design layouts.

Output Polarity: TRUE

True output polarity is standard in digital circuits, ensuring compatibility and straightforward integration.

Minimum Supply Voltage (Vsup): 2 V

The ability to operate at a minimum voltage of 2V allows for versatility in power supply choices, enhancing design options.

Length: 9.9 mm

A manageable length helps with PCB layout optimization, allowing for more compact designs.

Temperature Grade: MILITARY

Military temperature grade assures reliability and performance in extreme conditions, making it suitable for defense applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, ideal for portable and sensitive applications.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and provide reliable connections in surface mount applications.

Packing Method: TR

Tape and reel packing allows for efficient automated assembly processes, reducing production time.

Terminal Pitch: 1.27 mm

A standard terminal pitch ensures compatibility with a wide range of PCB layouts, simplifying the design process.

Minimum fmax: 95 MHz

A minimum frequency of 95 MHz indicates the capability to handle high-speed data processing applications.

Moisture Sensitivity Level (MSL): 3

A moisture sensitivity level of 3 indicates appropriate handling procedures, ensuring component reliability.

Maximum Supply Voltage (Vsup): 3.6 V

Supporting a maximum supply voltage of 3.6V allows flexibility in power supply design and integration in a variety of systems.

Technical Specifications

Latches & Flip-Flops 74LVX174MTR attributes and parameters. Explore more Latches & Flip-Flops devices from STMicroelectronics

Specs

Family:

LV/LV-A/LVX/H

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

3

No. of Bits:

6

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

15.5 ns

Propagation Delay (tpd):

22 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

2.7

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trigger Type:

POSITIVE EDGE

Width:

3.9 mm

Minimum fmax:

95 MHz

Trade Compliance

74LVX174MTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20