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74LVQ174TTR

STMicroelectronics

74LVQ174TTR by STMicroelectronics

74LVQ174TTR by STMicroelectronics is a CMOS latch with 6 bits, 11 ns propagation delay, and 3.3V power supply. It is used in applications requiring positive edge triggering, operates b/w -55 to 125 °C, and has a max frequency of 70 MHz.

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3

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1k+

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Vyrian

USA . 7,983 parts In-Stock

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Digiode

USA . 4,496 parts In-Stock

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Anansix

USA . 2,701 parts In-Stock

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IDEA Electronic Components Group

UK . 1,308 parts In-Stock

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$11.039

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$9.935

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$11.039

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$9.935

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MKK Technologies

India . 1,691 parts In-Stock

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$20.758

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$20.758

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DigiPath Technology Company

USA . 1,691 parts In-Stock

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$20.758

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AZTECH Wire

Italy . 589 parts In-Stock

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$22.180

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Microchip USA

USA . 203 parts In-Stock

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$25.818

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Native Components

USA . 90 parts In-Stock

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$26.865

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$26.865

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Northwest PG Solutions

USA . 1,711 parts In-Stock

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$29.551

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$26.596

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Component Stockers USA

USA . 292 parts In-Stock

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$99.990

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Parana Technologies

USA . 2,121 parts In-Stock

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$13.199

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Corphita

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Overview

Unlock endless possibilities with the 74LVQ174TTR by STMicroelectronics, a high-quality latch flip-flop perfect for various applications. Manufactured by industry leader STMicroelectronics, this product offers unparalleled reliability and performance. Ideal for military-grade projects, this versatile component boasts a small outline, thin profile package style, making it a compact and efficient choice. With a nominal supply voltage of 3.3V and a propagation delay of just 14.5ns, the 74LVQ174TTR ensures swift and precise operations. Embrace innovation and seamless functionality with this top-of-the-line component.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body makes the product lightweight and durable, making it suitable for various applications.

Propagation Delay At Nominal Supply: 11 ns

The low propagation delay of 11 ns ensures fast and efficient operation of the latch or flip-flop, making it ideal for high-speed applications.

Surface Mount: YES

Being surface mountable allows for easy and convenient installation on PCBs, saving space and facilitating automated assembly processes.

No. of Bits: 6

Having 6 bits allows the latch or flip-flop to handle a larger amount of data or control signals, making it versatile for different use cases.

Nominal Supply Voltage / Vsup (V): 2.7

The nominal supply voltage of 2.7V is common and widely available, ensuring compatibility with various power sources.

Load Capacitance (CL): 50 pF

The low load capacitance of 50 pF minimizes the impact of external factors and ensures stable operation in different environments.

Power Supplies (V): 3.3

The product can operate efficiently with a power supply of 3.3V, which is a standard voltage level in many electronic systems.

No. of Terminals: 16

With 16 terminals, the latch or flip-flop offers flexibility in connections and interfaces with other components in a circuit.

Maximum I (ol): 24 Amp

The high maximum output current of 24 Amp allows the product to drive larger loads without overheating or performance issues.

Propagation Delay (tpd): 14.5 ns

The propagation delay of 14.5 ns ensures quick response times for data inputs, enhancing the overall speed of the circuit.

Technical Specifications

Latches & Flip-Flops 74LVQ174TTR attributes and parameters. Explore more Latches & Flip-Flops devices from STMicroelectronics

Specs

Family:

LVQ

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

70000000 Hz

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

6

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

11 ns

Propagation Delay (tpd):

14.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

2.7

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Trigger Type:

POSITIVE EDGE

Width:

4.4 mm

Minimum fmax:

70 MHz

Trade Compliance

74LVQ174TTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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