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74AC157TTR

STMicroelectronics

74AC157TTR by STMicroelectronics

74AC157TTR by STMicroelectronics is a CMOS multiplexer with a 9 ns propagation delay, operating at 3.3V to 5V. It features 4 functions and supports dual inputs in a compact SOIC package. Ideal for military applications, it withstands temperatures from -55 °C to 125°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,865 parts In-Stock

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Anansix

USA . 1,517 parts In-Stock

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Digiode

USA . 233 parts In-Stock

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AZTECH Wire

Italy . 929 parts In-Stock

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$10.510

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929

$10.510

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IDEA Electronic Components Group

UK . 1,459 parts In-Stock

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$24.178

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$21.760

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MKK Technologies

India . 1,473 parts In-Stock

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$45.464

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DigiPath Technology Company

USA . 1,473 parts In-Stock

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$45.464

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$45.464

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Corphita

USA . 2,857 parts In-Stock

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Northwest PG Solutions

USA . 2,033 parts In-Stock

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Parana Technologies

USA . 1,505 parts In-Stock

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$28.908

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Native Components

USA . 414 parts In-Stock

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Overview

Elevate your designs with the 74AC157TTR from STMicroelectronics, a top-tier multiplexer/demultiplexer that combines speed and reliability in one compact package. With an impressive propagation delay of just 9 ns, this device ensures rapid data processing for a variety of applications, from telecommunications to consumer electronics. Trust in ST’s industry-leading quality and experience, giving you peace of mind and outstanding performance while maximizing efficiency and reducing power consumption.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy construction ensures durability and reliability, making it suitable for various applications.

Propagation Delay at Nominal Supply: 9 ns

A low propagation delay allows for high-speed data transmission, enhancing overall circuit performance.

Surface Mount: YES

Surface mount technology facilitates compact designs and easy integration into modern electronic circuits.

No. of Functions: 4

The ability to perform multiple functions provides versatility in applications, reducing component count.

No. of Inputs: 2

With two inputs, this multiplexer/demultiplexer can efficiently manage data selection, simplifying circuit complexity.

Package Shape: RECTANGULAR

The rectangular package design optimizes board space utilization and provides ease of layout in design.

Nominal Supply Voltage / Vsup (V): 3.3

Operating at a nominal voltage of 3.3V makes it compatible with low-voltage systems, ideal for energy-efficient designs.

Load Capacitance (CL): 50 pF

A low load capacitance ensures minimal signal degradation, making it suitable for high-frequency applications.

Power Supplies (V): 3.3/5

Flexibility in power supply options allows easy integration into existing systems without additional components.

No. of Terminals: 16

With 16 terminals, it allows for extensive connectivity while retaining a compact design.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile aid in space-saving designs while maintaining functionality.

Maximum I (ol): 12 Amp

A high output current rating supports robust applications while ensuring reliable performance under load.

Propagation Delay (tpd): 9 ns

Consistent propagation delay contributes to predictable timing in digital circuits, enhancing synchronization.

Maximum Operating Temperature: 125 °C

High thermal endurance allows operation in extreme conditions, making it ideal for military and automotive applications.

Minimum Operating Temperature: -55 °C

Capable of functioning in low temperatures ensures reliability in harsh environments.

Terminal Finish: NICKEL PALLADIUM GOLD

The high-quality terminal finish enhances solderability and corrosion resistance, ensuring long-term reliability.

Terminal Position: DUAL

Dual terminal positioning allows for flexible PCB layout and improved accessibility.

Maximum Seated Height: 1.1 mm

A low seated height permits integration into low-profile equipment, which is advantageous in design constraints.

Width: 4.4 mm

Compact width supports efficient use of board space, allowing for higher density designs.

Output Polarity: TRUE

True output polarity simplifies circuit design and component selection for compatible components.

Minimum Supply Voltage (Vsup): 2 V

Low minimum supply voltage requirement enhances compatibility with battery-operated devices and energy-saving designs.

Length: 5 mm

Short length contributes to an overall compact form factor, enabling dense circuit design.

Temperature Grade: MILITARY

Military grade qualification ensures reliability and robustness in demanding environments, suitable for critical applications.

Technology: CMOS

CMOS technology enables low power operation and high noise immunity, making it perfect for modern digital circuits.

Terminal Form: GULL WING

Gull wing terminals provide excellent soldering characteristics, improving assembly and reliability.

Packing Method: TR

Tape and reel packaging allows for automated handling and placement in high-volume manufacturing.

Terminal Pitch: 0.65 mm

A tighter terminal pitch allows for more compact layout and higher density circuit designs.

Maximum Supply Voltage (Vsup): 6 V

Support for a maximum supply voltage of 6V offers flexibility for various applications and operational conditions.

Technical Specifications

Multiplexer & Demultiplexer 74AC157TTR attributes and parameters. Explore more Multiplexer & Demultiplexer devices from STMicroelectronics

Specs

Family:

AC

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

12 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Inputs:

2

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Power Supplies (V):

3.3/5

Propagation Delay At Nominal Supply:

9 ns

Propagation Delay (tpd):

9 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Multiplexer/Demultiplexers

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Trade Compliance

74AC157TTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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