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74AC157MTR

STMicroelectronics

74AC157MTR by STMicroelectronics

74AC157MTR by STMicroelectronics is a CMOS multiplexer with a propagation delay of just 9 ns, operating at supply voltages of 3.3V to 5V. It features four functions and two inputs in a compact SO package. Ideal for high-speed data routing in military applications, it supports extreme temperatures from -55 °C to 125°C.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Vyrian

USA . 11,252 parts In-Stock

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Digiode

USA . 2,963 parts In-Stock

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Anansix

USA . 2,353 parts In-Stock

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LWI Electronics Inc

India . 485 parts In-Stock

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Microchip USA

USA . 241 parts In-Stock

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$9.347

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IDEA Electronic Components Group

UK . 894 parts In-Stock

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$17.286

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$15.557

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AZTECH Wire

Italy . 327 parts In-Stock

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$19.690

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MKK Technologies

India . 1,340 parts In-Stock

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$32.505

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DigiPath Technology Company

USA . 1,340 parts In-Stock

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$32.505

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Component Stockers USA

USA . 610 parts In-Stock

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$99.990

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Assy Fe

Spain . 5,000 parts In-Stock

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Northwest PG Solutions

USA . 1,906 parts In-Stock

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Corphita

USA . 1,822 parts In-Stock

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Perfect Parts

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Native Components

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Parana Technologies

USA . 459 parts In-Stock

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Overview

Experience the unmatched reliability of the 74AC157MTR from STMicroelectronics, a leader in innovative semiconductor solutions. This versatile multiplexer/demultiplexer offers exceptional speed and efficiency, allowing seamless integration into your designs. Ideal for telecommunications, automotive, and consumer electronics, its robust performance ensures optimal functionality. Choose STMicroelectronics for unparalleled quality and elevate your projects with a component that truly delivers value and innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and protection against environmental factors, making this multiplexer/demultiplexer suitable for a variety of applications.

Propagation Delay At Nominal Supply: 9 ns

A low propagation delay of 9 ns ensures fast switching speeds, making it ideal for high-speed digital circuits.

Surface Mount: YES

The surface mount design allows for efficient use of PCB space and easier automated assembly, contributing to lower production costs.

No. of Functions: 4

Having four functions increases flexibility, allowing for more complex circuit designs in a single device.

No. of Inputs: 2

With two inputs, this device can handle multiple signal paths efficiently, simplifying circuit complexity.

Package Shape: RECTANGULAR

The rectangular shape is standard in many applications, facilitating integration into a variety of PCB layouts.

Nominal Supply Voltage / Vsup (V): 3.3

Operating at a nominal supply voltage of 3.3V makes this device compatible with modern low-power digital systems.

Load Capacitance (CL): 50 pF

A load capacitance of 50 pF indicates good performance in driving capacitive loads, enhancing signal integrity.

Power Supplies (V): 3.3/5

Compatibility with both 3.3V and 5V power supplies provides versatility in placement within different systems.

No. of Terminals: 16

With 16 terminals, this product offers sufficient connectivity for various applications, allowing for comprehensive system designs.

Package Style (Meter): SMALL OUTLINE

The small outline package style supports high-density designs, which is beneficial in compact electronic devices.

Maximum I (ol): 12 Amp

A maximum output current of 12 Amp makes this device capable of handling robust signal loads, enhancing its application range.

Propagation Delay (tpd): 9 ns

Consistent with the nominal supply, a 9 ns propagation delay offers reliable performance across various operating conditions.

Maximum Operating Temperature: 125 °C

Rated for high temperatures, this device can operate in challenging environments, ensuring reliability over a wide range of applications.

Minimum Operating Temperature: -55 °C

The ability to function at temperatures as low as -55 °C makes this device suitable for harsh environments, such as aerospace applications.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel-palladium-gold finish ensures excellent conductivity and corrosion resistance, enhancing long-term reliability.

Terminal Position: DUAL

Dual terminal positioning provides design flexibility and ease of routing in PCB layouts.

Maximum Seated Height: 1.75 mm

The maximum seated height of 1.75 mm accommodates low-profile designs, promoting compact assembly.

Width: 3.9 mm

A width of 3.9 mm allows for high-density packaging, aligning with modern miniaturization trends in electronics.

Output Polarity: TRUE

This specification indicates that the output is designed to match standard digital logic levels, ensuring compatibility.

Minimum Supply Voltage (Vsup): 2 V

The capability to operate down to 2V ensures flexibility in power supply design, suitable for battery-powered applications.

Length: 9.9 mm

The 9.9 mm length is compact enough to fit in tight spaces, supporting versatile design applications.

Temperature Grade: MILITARY

A military temperature grade guarantees robustness, making this multiplexer/demultiplexer suitable for demanding applications.

Technology: CMOS

The CMOS technology provides low power consumption, high noise immunity, and high-speed operation, ideal for modern digital circuits.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and assembly, ensuring reliable physical and electrical connections in circuits.

Packing Method: TR

The tape and reel packing method allows for automated assembly processes, enhancing manufacturing efficiency.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm is standard for many PCB designs, making integration straightforward and cost-effective.

Maximum Supply Voltage (Vsup): 6 V

The ability to handle a maximum supply voltage of 6V provides design engineers with flexibility in power supply options.

Technical Specifications

Multiplexer & Demultiplexer 74AC157MTR attributes and parameters. Explore more Multiplexer & Demultiplexer devices from STMicroelectronics

Specs

Family:

AC

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

12 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Inputs:

2

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Power Supplies (V):

3.3/5

Propagation Delay At Nominal Supply:

9 ns

Propagation Delay (tpd):

9 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Multiplexer/Demultiplexers

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

74AC157MTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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