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5962-8961403XX

STMicroelectronics

5962-8961403XX by STMicroelectronics

5962-8961403XX by STMicroelectronics is a military-grade EPROM with a 128K x 8 organization, operating asynchronously at a nominal voltage of 5V. It features a ceramic, glass-sealed package and operates b/w -55 °C to 125 °C. Ideal for reliable data storage in harsh environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

5962-8961403XX by STMicroelectronics
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Vyrian

USA . 3,753 parts In-Stock

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3,753

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Digiode

USA . 2,713 parts In-Stock

1+ parts

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2,713

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Anansix

USA . 1,545 parts In-Stock

1+ parts

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100+ parts

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1,545

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 897 parts In-Stock

1+ parts

$3.732

100+ parts

-

1k+ parts

$3.358

10k+ parts

-

897

$3.732

-

$3.358

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MARBEL Systems

Belgium . 890 parts In-Stock

1+ parts

$3.744

100+ parts

-

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890

$3.744

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Texas Native Microelectronics

USA . 1,160 parts In-Stock

1+ parts

$4.303

100+ parts

$4.131

1k+ parts

$4.002

10k+ parts

$3.787

1,160

$4.303

$4.131

$4.002

$3.787

Kenton Components

USA . 4,677 parts In-Stock

1+ parts

$5.164

100+ parts

-

1k+ parts

-

10k+ parts

$4.544

4,677

$5.164

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-

$4.544

MKK Technologies

India . 156 parts In-Stock

1+ parts

$7.017

100+ parts

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156

$7.017

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DigiPath Technology Company

USA . 156 parts In-Stock

1+ parts

$7.017

100+ parts

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156

$7.017

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Qasali Group International

UK . 28,740 parts In-Stock

1+ parts

$11.618

100+ parts

-

1k+ parts

$10.805

10k+ parts

$10.224

28,740

$11.618

-

$10.805

$10.224

Semicontronic

India . 1,436 parts In-Stock

1+ parts

$26.000

100+ parts

$25.350

1k+ parts

$25.220

10k+ parts

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1,436

$26.000

$25.350

$25.220

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Corphita

USA . 5,088 parts In-Stock

1+ parts

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5,088

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Northwest PG Solutions

USA . 642 parts In-Stock

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642

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Native Components

USA . 620 parts In-Stock

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620

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Parana Technologies

USA . 403 parts In-Stock

1+ parts

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$4.462

1k+ parts

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403

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$4.462

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Overview

Unlock unparalleled performance with the 5962-8961403XX EPROM by STMicroelectronics, a trusted leader in semiconductor solutions. Designed for extreme reliability, this military-grade component operates seamlessly between -55 °C to 125 °C, ensuring robust functionality even in harsh environments. Its ceramic, glass-sealed packaging guarantees durability and longevity, making it ideal for aerospace, defense, and industrial applications. Elevate your projects with STMicroelectronics' commitment to quality and innovation!

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The ceramic and glass-sealed construction provides excellent protection against environmental factors, ensuring reliability and longevity.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient use of PCB space, making it suitable for a variety of applications.

Operating Mode: ASYNCHRONOUS

Asynchronous operation enhances system performance by allowing the chip to operate without needing a specific clock signal, simplifying design.

Nominal Supply Voltage / Vsup: 5 V

A nominal supply voltage of 5 V is standard and compatible with many microcontrollers and systems, making integration easier.

No. of Terminals: 32

The 32 terminals provide ample connection points for various functionalities, allowing for flexible designs.

Package Style (Meter): IN-LINE, WINDOW

The in-line window package style is ideal for UV erasure, facilitating easy reprogramming and maintenance.

Maximum Operating Temperature: 125 °C

A maximum operating temperature of 125 °C makes this EPROM suitable for high-temperature environments, enhancing its application range.

Organization: 128KX8

With 128K x 8 organization, this EPROM offers a balance of storage capacity and performance, making it versatile for various applications.

Minimum Operating Temperature: -55 °C

The capability to operate at -55 °C expands its usability in extreme environments, ideal for military and aerospace applications.

Terminal Finish: TIN LEAD

The tin-lead terminal finish ensures good solderability, promoting reliable connections in electronic assemblies.

Terminal Position: DUAL

Dual terminal positions facilitate easier layout options and improve design flexibility in circuit boards.

Maximum Seated Height: 5.588 mm

A compact height of 5.588 mm allows for denser designs, making it suitable for space-constrained applications.

Width: 15.24 mm

The width of 15.24 mm provides a balanced footprint, making it easy to integrate into various device layouts.

Minimum Supply Voltage (Vsup): 4.5 V

A minimum supply voltage of 4.5 V guarantees compatibility with a wide range of power supply systems.

Length: 42.1005 mm

The length of 42.1005 mm is designed for standard applications, promoting ease of use and compatibility.

Temperature Grade: MILITARY

The military temperature grade ensures robust performance under demanding conditions, making it suitable for critical applications.

Technology: CMOS

CMOS technology allows for low power consumption and high-speed operation, making it energy-efficient and effective.

Parallel or Serial: PARALLEL

Parallel access allows for faster data retrieval, making it ideal for applications that require quick read times.

Terminal Form: THROUGH-HOLE

Through-hole technology provides strong mechanical support and reliability in demanding environments.

No. of Words: 131072 words

A capacity of 131072 words offers substantial data storage, suitable for a variety of tasks and applications.

Memory Width: 8

With a memory width of 8 bits, this EPROM can handle standard byte-sized data, making it broadly applicable.

Terminal Pitch: 2.54 mm

The 2.54 mm terminal pitch is a standard dimension for easy integration into existing systems.

No. of Words Code: 128K

With 128K word capacity, this EPROM accommodates sufficient coding for many applications, enhancing its versatility.

Maximum Supply Voltage (Vsup): 5.5 V

A maximum supply voltage of 5.5 V ensures safe operation without risk of damage, enhancing reliability.

Memory Density: 1048576 bit

With a memory density of 1 Megabit, this EPROM is well-suited for applications requiring substantial storage.

Memory IC Type: UVPROM

As a UVPROM, this product allows for easy reprogramming using UV light, making it efficient for prototype development.

Maximum Access Time: 200 ns

A maximum access time of 200 ns provides adequate speed for most applications, ensuring responsive performance.

Technical Specifications

EPROM 5962-8961403XX attributes and parameters. Explore more EPROM devices from STMicroelectronics

Specs

Maximum Access Time:

200 ns

JESD-30 Code:

R-GDIP-T32

JESD-609 Code:

e0

Length:

42.1005 mm

Memory Density:

1048576 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

32

No. of Words:

131072 words

No. of Words Code:

128K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Organization:

128KX8

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

Package Shape:

Package Style (Meter):

IN-LINE, WINDOW

Parallel or Serial:

PARALLEL

Qualification:

Not Qualified

Maximum Seated Height:

5.588 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

15.24 mm

Trade Compliance

5962-8961403XX Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.61

SB

8542.32.00.60

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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