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TT8J11TCR

ROHM

TT8J11TCR by ROHM

ROHM's TT8J11TCR is a P-CHANNEL FET with 2 elements, built-in diode for SWITCHING applications. Features include 12V DS Breakdown Voltage, 3.5A Drain Current, 0.043 ohm On Resistance. With small outline package and max temp of 150°C, it suits various electronic designs.

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$0.446

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$0.415

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$0.403

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Overview

Discover the superior performance and reliability of the TT8J11TCR by ROHM, a leading manufacturer in the industry. This Power FET offers seamless switching capabilities in a compact package, making it ideal for a variety of applications. With a maximum pulsed drain current of 12A and maximum operating temperature of 150°C, this P-CHANNEL transistor provides exceptional value and efficiency. Trust ROHM to deliver quality products that meet your power management needs effortlessly.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight, durable, and cost-effective, making the product suitable for various applications.

Polarity or Channel Type: P-CHANNEL

P-channel FETs typically have lower on-resistance and power consumption compared to N-channel FETs, making them efficient for many switching applications.

Configuration: SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

Having 2 separate elements with a built-in diode provides flexibility and allows for more complex circuit designs.

Transistor Application: SWITCHING

Specifically designed for switching applications, ensuring fast and efficient operation in turning on and off electrical signals.

Surface Mount: YES

Surface-mount technology allows for easy and compact integration onto circuit boards, saving space and enabling high-density designs.

Minimum DS Breakdown Voltage: 12 V

With a minimum breakdown voltage of 12V, this FET can handle higher voltages without damage, making it suitable for a wide range of applications.

Package Shape: RECTANGULAR

Rectangular shape provides easy mounting and alignment on PCBs, ensuring secure placement during assembly.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs offer better control over the switching operation and lower power consumption in comparison to depletion mode FETs.

Maximum Pulsed Drain Current (IDM): 12 A

High pulsed drain current capability allows the FET to handle sudden spikes in current, making it suitable for pulse applications.

Maximum Drain Current (Abs) (ID): 3.5 A

Sufficient continuous drain current rating for medium-power applications while ensuring the FET remains within its safe operating limits.

Maximum Power Dissipation (Abs): 1.25 W

Low power dissipation helps in reducing heat generation and improves overall efficiency of the circuit.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space and allows for compact designs, making it suitable for applications with size constraints.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology offers high switching speeds, low gate drive power, and low on-resistance, ensuring efficient performance in various applications.

Maximum Operating Temperature: 150 °C

With a maximum operating temperature of 150°C, the FET can withstand high-temperature environments, ensuring reliable operation in harsh conditions.

Transistor Element Material: SILICON

Silicon-based FETs offer high switching speeds, low on-resistance, and good thermal stability, making them ideal for various electronics applications.

Maximum Drain-Source On Resistance: 0.043 ohm

Low on-resistance minimizes power loss and improves efficiency in switching applications, ensuring the FET operates effectively.

Terminal Position: DUAL

Dual terminal position allows for easy connections and flexibility in circuit layout, enhancing the versatility of the FET in different applications.

Maximum Time At Peak Reflow Temperature (s): 10

With a maximum reflow time of 10 seconds at peak temperature, the FET can withstand the reflow process during PCB assembly without damage.

Peak Reflow Temperature °C: 260

The FET can withstand peak reflow temperatures of 260°C during assembly, ensuring reliable solder joints and secure connections on the PCB.

Technical Specifications

Power Field Effect Transistors (FET) TT8J11TCR attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from ROHM

Specs

Minimum DS Breakdown Voltage:

12 V

Maximum Drain Current (Abs) (ID):

3.5 A

Maximum Drain Current (ID):

3.5 A

Maximum Drain-Source On Resistance:

.043 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-F8

Moisture Sensitivity Level (MSL):

1

No. of Elements:

2

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

12 A

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

10

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

TT8J11TCR Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

ROHM

Rohm Co Ltd is a Japan-based company that manufactures and distributes electronic components for use in automotive, transportation, medical, healthcare, audiovisual, telecommunications, digital power, computer and peripherals, and home appliance end markets. Its product portfolio includes integrated circuits in memory, amplifiers, switches, data converters, and microcontrollers; discrete semiconductors, such as transistors and diodes; power devices; passive devices, such as resistors and capacitors; and optoelectronic devices.

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