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TND011NM

Onsemi

TND011NM by Onsemi

TND011NM by Onsemi is a Peripheral Driver with 3 terminals, operating from -40 to 85 °C. Its plastic/epoxy package makes it suitable for industrial applications. With a terminal pitch of 2.54mm, it offers reliable performance in various electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,331 parts In-Stock

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1,331

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Digiode

USA . 201 parts In-Stock

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201

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Problanco Electronics

Mexico . 7,749 parts In-Stock

1+ parts

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7,749

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Corphita

USA . 2,316 parts In-Stock

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2,316

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Kulean Microsystems

USA . 1,826 parts In-Stock

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1,826

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UHIMA Technologies

Türkiye . 906 parts In-Stock

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906

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Corohmni

South Africa . 168 parts In-Stock

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168

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SupplyDigital Components

Austria . 51 parts In-Stock

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51

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TANS Electronics

Latvia . 1 parts In-Stock

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Overview

Elevate your electronic projects with the TND011NM by Onsemi, a top-tier manufacturer known for their cutting-edge technology and reliable products. Designed for applications in peripheral drivers, this high-quality device offers unmatched performance and durability. With its industrial-grade temperature grade and versatile terminal pitch, the TND011NM provides exceptional value to customers seeking a dependable solution for their projects. Trust Onsemi to deliver excellence in every aspect of your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and durable, perfect for use in various industrial applications.

No. of Terminals: 3

Having 3 terminals allows for easy and secure connection of multiple devices, providing flexibility and convenience in use.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85 °C, this product can withstand harsh industrial environments without compromising performance.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40 °C ensures reliable operation in cold conditions, making this product suitable for a wide range of applications.

Terminal Position: SINGLE

The single terminal position simplifies the installation process, making it easy to connect the peripheral drivers to other devices or systems.

Temperature Grade: INDUSTRIAL

This product is designed to meet industrial temperature standards, ensuring stable performance in demanding industrial environments.

Terminal Pitch: 2.54 mm

The 2.54 mm terminal pitch allows for easy and secure connections, making this product compatible with a wide range of devices and applications.

Technical Specifications

Peripheral Drivers TND011NM attributes and parameters. Explore more Peripheral Drivers devices from Onsemi

Specs

Driver No. of Bits:

1

No. of Terminals:

3

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Equivalence Code:

SIP3,.048

Qualification:

Not Qualified

Sub-Category:

Peripheral Drivers

Surface Mount:

NO

Temperature Grade:

Terminal Pitch:

2.54 mm

Terminal Position:

SINGLE

Trade Compliance

TND011NM Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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