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TND017MP

Onsemi

TND017MP by Onsemi

TND017MP by Onsemi is a BUFFER OR INVERTER BASED PERIPHERAL DRIVER with 3 terminals, 5V nominal voltage, and 4.5A nominal output peak current limit. It operates in industrial temperatures (-40 to 85 °C) and provides built-in protections against transient, over current, and over voltage. Ideal for applications requiring sink output current flow direction at a max supply voltage of 10V.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,426 parts In-Stock

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2,426

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Digiode

USA . 1,749 parts In-Stock

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1,749

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

TANS Electronics

Latvia . 6,951 parts In-Stock

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6,951

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Kulean Microsystems

USA . 6,835 parts In-Stock

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6,835

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Problanco Electronics

Mexico . 6,317 parts In-Stock

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6,317

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SupplyDigital Components

Austria . 4,850 parts In-Stock

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4,850

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UHIMA Technologies

Türkiye . 738 parts In-Stock

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738

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Corphita

USA . 211 parts In-Stock

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Corohmni

South Africa . 128 parts In-Stock

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Overview

Unleash the power of reliable electronics with the TND017MP by Onsemi, a top-notch peripheral driver designed to provide superior performance in a variety of applications. With built-in protections against transient events, over current, and over voltage situations, this product ensures peace of mind for users. The industrial-grade temperature tolerance and durable terminal finish make it a standout choice for demanding environments. Trust Onsemi's expertise in semiconductor manufacturing to deliver a quality product that exceeds expectations. Elevate your electronics with the TND017MP and experience the unmatched value and benefits it brings to your projects.

Feature Benefit Bullets

Maximum Supply Voltage: 10 V

With a high maximum supply voltage, this peripheral driver can handle a wide range of input voltages, making it versatile for various applications.

Built-in Protections: TRANSIENT, OVER CURRENT, OVER VOLTAGE

The built-in protections ensure that the peripheral driver is safeguarded against different types of electrical faults, enhancing its reliability and durability.

Minimum Operating Temperature: -40 °C

The wide range of minimum operating temperature allows this peripheral driver to function reliably even in extreme cold conditions, increasing its usability in different environments.

Nominal Output Peak Current Limit: 4.5 A

With a high nominal output peak current limit, this peripheral driver can deliver a significant amount of current when needed, making it suitable for driving power-hungry peripherals.

Technical Specifications

Peripheral Drivers TND017MP attributes and parameters. Explore more Peripheral Drivers devices from Onsemi

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; OVER VOLTAGE

JESD-30 Code:

O-XBCY-T3

No. of Functions:

1

No. of Terminals:

3

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Current Flow Direction:

SINK

Nominal Output Peak Current Limit:

4.5 A

Package Body Material:

UNSPECIFIED

Package Shape:

Package Style (Meter):

CYLINDRICAL

Maximum Supply Voltage:

10 V

Minimum Supply Voltage:

4 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER NICKEL

Terminal Form:

Terminal Position:

BOTTOM

Trade Compliance

TND017MP Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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