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TND010F

Onsemi

TND010F by Onsemi

TND010F by Onsemi is a Peripheral Driver with 3 terminals, operating from -40 to 150 °C. Its plastic/epoxy body makes it suitable for automotive applications. With a terminal pitch of 2.54mm, it ensures reliable performance in various automotive systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,570 parts In-Stock

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1,570

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Digiode

USA . 1,223 parts In-Stock

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1,223

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Kulean Microsystems

USA . 3,824 parts In-Stock

1+ parts

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3,824

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Corphita

USA . 1,309 parts In-Stock

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1,309

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Problanco Electronics

Mexico . 874 parts In-Stock

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874

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TANS Electronics

Latvia . 718 parts In-Stock

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718

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SupplyDigital Components

Austria . 683 parts In-Stock

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683

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UHIMA Technologies

Türkiye . 450 parts In-Stock

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450

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Corohmni

South Africa . 400 parts In-Stock

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400

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Overview

Enhance your automotive applications with the TND010F Peripheral Driver by Onsemi. Designed with top-quality materials and advanced technology, this product offers unparalleled performance and reliability. With a wide operating temperature range and a compact design, the TND010F is perfect for various automotive systems. Trust Onsemi's expertise and innovation to elevate your projects to the next level. Upgrade to the TND010F today and experience the superior value and benefits it brings to your applications.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and reliability, making this product suitable for automotive applications where robustness is essential.

No. of Terminals: 3

Having 3 terminals allows for easy and efficient connection to other components, simplifying the installation process.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature of 150 °C, this product can withstand and perform well in challenging thermal conditions.

Minimum Operating Temperature: -40 °C

The ability to operate effectively even at temperatures as low as -40 °C makes this product suitable for a wide range of environments and applications.

Terminal Position: SINGLE

Having a single terminal position simplifies the wiring setup and reduces the chance of connectivity issues, ensuring reliable performance.

Temperature Grade: AUTOMOTIVE

Designed specifically for automotive use, this product meets the industry standard requirements for temperature grades, ensuring compatibility and reliability in automotive environments.

Terminal Pitch: 2.54 mm

The 2.54 mm terminal pitch provides compatibility with a wide range of other components, allowing for versatile and flexible integration in various systems.

Technical Specifications

Peripheral Drivers TND010F attributes and parameters. Explore more Peripheral Drivers devices from Onsemi

Specs

Driver No. of Bits:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Equivalence Code:

SIP3,.1

Qualification:

Not Qualified

Sub-Category:

Peripheral Drivers

Surface Mount:

NO

Temperature Grade:

Terminal Pitch:

2.54 mm

Terminal Position:

SINGLE

Trade Compliance

TND010F Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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